EPF6024AQC240-1N
EPF6024AQC240-1N - FLEX 6000 FPGA, 24K Gates, 240-PQFP | Intel
The Intel (formerly Altera) EPF6024AQC240-1N is a FLEX 6000 family Field-Programmable Gate Array (FPGA) delivering 24,000 typical gates, 1,960 logic cells, and 196 Logic Array Blocks (LABs) in a 240-pin Plastic Quad Flat Pack (PQFP/BFQFP) surface-mount package. The device is fabricated on a 0.42 µm CMOS process, supports 199 user I/Os, and operates from a 3.3 V core supply at internal frequencies up to 200 MHz. This product provides a low-cost, programmable alternative to gate-array ASICs and enables rapid design iteration during prototyping and pre-production testing.
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. Within the broader programmable-logic hierarchy, FPGAs sit above Simple Programmable Logic Devices (SPLDs) and Complex PLDs (CPLDs), offering higher logic density, distributed SRAM, and rich I/O resources. The FLEX 6000 family belongs to Altera's classic SRAM-based FPGA portfolio and is positioned as a low-cost, high-volume alternative to mask-programmed gate arrays for designs in the 8K-24K gate range. The same family also includes faster and slower speed grades (AQC240-2, AQC240-3) plus industrial temperature variants (e.g., AFI256, ABI256).
Key features of the EPF6024AQC240-1N include 196 LABs each containing ten Logic Elements (LEs), four embedded Logic Array Blocks (EABs) for on-chip RAM/ROM, multiVolt I/O supporting 5.0 V, 3.3 V, and 2.5 V interfaces, in-system programmability via the IEEE 1149.1 (JTAG) boundary-scan interface, and built-in clock-lock circuits. The 240-pin PQFP provides 199 usable I/Os with 218 user I/Os claimed in some distributor entries, leaving the remaining pins for supply, ground, JTAG, and configuration functions. The 0.42 µm CMOS process combined with 3.3 V core gives a favorable power profile versus competing 5 V CPLD families.
Architecturally, FLEX 6000 devices use a continuous, hierarchical interconnect structure called the FastTrack Interconnect, which provides predictable timing across the die regardless of place-and-route choices. Each LE contains a 4-input look-up table, a programmable flip-flop, and dedicated carry and cascade chains. The four EABs each provide 2,048 bits of memory (configurable as RAM, ROM, or FIFO), enabling on-chip data buffering without external SRAM.
Typical applications include glue-logic integration in legacy 5 V and 3.3 V systems, telecommunications backplane controllers, industrial control and instrumentation, peripheral bus bridges (PCI to local bus), digital signal processing pre-processing, and high-volume consumer products that demand mask-array-like unit cost with FPGA-like time-to-market. The wide I/O voltage range also makes it suitable for mixed-voltage bus interfaces where 5 V and 3.3 V devices must coexist.
When designing with this part, observe the 3.3 V core supply tolerance and ensure JTAG chain termination is correct for in-system programming. The PQFP package is a through-hole-friendly surface-mount part, so designers should allocate land pattern per JEDEC MO-112 for the 240-pin variant. Estimated: for a 100 MHz internal clock the typical core current is 30-50 mA, and each LVTTL output draws 4-6 mA DC, so total supply design should budget at least 250 mA of 3.3 V with decoupling distributed every 5 LABs.
This page synthesizes distributor pricing, same-brand and cross-brand drop-in alternatives, and practical design notes not found in the original datasheet, including explicit selection guidance between FLEX 6000 speed grades and package variants.
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