EPF6024AQC208-1 - FLEX 6000 24K Gates 200MHz FPGA | Intel (Altera)
부품 번호: EPF6024AQC208-1 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.6 | $12,300.00 |
| 1,000 | $21.4 | $21,400.00 |
EPF6024AQC208-1 개요
A field-programmable gate array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit in the programmable-logic hierarchy between simple SPLDs/CPLDs and high-end structured ASICs, combining configurable logic blocks (LEs), programmable routing, and dedicated I/O cells. The FLEX 6000 family in particular pioneered low-cost, high-volume gate-array replacement for glue logic, prototyping, and design-iteration workflows in the late 1990s and early 2000s.
Key features of the EPF6024AQC208-1 include 1,960 logic elements organised into 196 LABs, an internal frequency up to 200 MHz for the -1 speed grade, 171 user I/Os, and JTAG-based in-system programmability through the Altera/Quartus tool chain. Each LE contains a 4-input look-up table, a programmable register, and dedicated carry and cascade chains for arithmetic and wide fan-in functions, while each LAB groups 16 LEs with local interconnect for high-speed logic-cluster operation.
The device is built on a 0.42 µm five-layer-metal CMOS process and uses SRAM configuration cells, allowing unlimited reconfigurations in-system. Configuration is typically loaded from a serial or parallel EPROM via the dedicated configuration interface. Built-in JTAG (IEEE 1149.1) boundary-scan test supports board-level interconnect verification without bed-of-nails fixtures, while the I/O cells support a range of 3.3 V LVTTL/LVCMOS standards with programmable drive strength and slew-rate control.
Typical applications include communication equipment glue logic, industrial control and instrumentation interfaces, legacy ASIC prototyping, high-volume gate-array replacement designs, and embedded control subsystems. The 171 available I/Os in a 208-pin PQFP also make it suitable for bridging multiple buses (e.g. microprocessor, memory and peripheral buses) inside dense backplane designs.
When designing with this device, ensure the Quartus/MAX+PLUS II fitter is configured for the EPF6024AQC208-1 device family and -1 speed grade, and that configuration storage (EPC1/EPC2 or compatible PROM) is sized for the 1,960-LE bitstream. The PQFP package requires a generous PCB pad/land pattern and careful thermal relief for production reflow.
This page synthesises distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a faster path to validation, replacement, and sourcing decisions for the EPF6024AQC208-1.
드롭인 대체품: EPF6024AQC208-1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF6024AQC208-1 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Device Type, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF6024AQC208-3
✅ 드롭인✓ 재고 있음
$18.85 / 개
데이터시트 보기 →EPF6024AQC208-1N
✅ 드롭인✓ 재고 있음
$18.75 / 개
데이터시트 보기 →EPF6016AQC208-1
✅ 드롭인✓ 재고 있음
$42.1 / 개
데이터시트 보기 →EPF6024AQC208-2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7.85 / 개
데이터시트 보기 →EPF6024AQC208
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EPF6024AQC208-1 최대 정격 & 전기적 특성
| Family | FLEX 6000 |
| Typical Gates | 24,000 |
| Logic Elements (LEs) | 1,960 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 171 |
| Internal Frequency (max, -1 speed grade) | 200 MHz |
| 공급 전압 | 3.3 V |
| Process Technology | 0.42 µm CMOS |
| Configuration Memory | SRAM |
| 패키지 | 208-pin PQFP (BFQFP) |
| 실장 유형 | Surface Mount (Gull-Wing) |
| 동작 온도 | 0 °C to +85 °C (Commercial) |
| Speed Grade | -1 |
| RoHS 상태 | Non-compliant (legacy PQFP, lead-bearing) |
| Programming Interface | JTAG (IEEE 1149.1) + Altera configuration port |
EPF6024AQC208-1 208-pin pqfp (bfqfp) 핀 구성 가이드
EPF6024AQC208-1(208-pin pqfp (bfqfp) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF6024AQC208-1.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF6024AQC208-1 적합 용도: 6 애플리케이션s: Communication Equipment Glue Logic, Industrial Control & Instrumentation, Legacy ASIC Prototyping & Emulation, High-Volume Gate-Array Replacement, Embedded Control Subsystems, Test & Measurement Backplanes.
Communication Equipment Glue Logic
The EPF6024AQC208-1 fits communication-equipment glue-logic applications by offering 1,960 LEs and 196 LABs of fast, deterministic combinational and registered logic on a 3.3 V rail. Its 171 user I/Os allow it to bridge a microprocessor bus (e.g. 8/16/32-bit local bus), an SDRAM interface, and a number of serial peripherals (UART, SPI, I²C) on a single device. The -1 speed grade's ~200 MHz internal fMAX is sufficient for bus-arbitration and protocol-bridging layers in legacy telecom backplanes and base-station controller cards. Compared with discrete 74-series logic, the EPF6024AQC208-1 reduces board area by collapsing 30–80 glue-logic ICs into one 208-pin PQFP while adding JTAG-driven in-system reconfiguration for late design changes.
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Industrial Control & Instrumentation
In industrial control systems, the EPF6024AQC208-1 functions as a custom state-machine and timing-controller core, exploiting its 196 LABs to encode PID loops, motor-control sequencing, and instrumentation-timing logic. The 3.3 V LVCMOS/LVTTL I/O cells pair naturally with modern microcontrollers such as the NXP LPC or TI Tiva-C families, while 171 user I/Os accommodate parallel ADC/DAC buses and encoder inputs. JTAG boundary-scan (IEEE 1149.1) gives board-test access without bed-of-nails fixtures, a key benefit for backplane volumes. The commercial 0–85 °C operating range suits factory-floor enclosures; for harsher environments, designers should screen date codes and derate timing closure.
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Legacy ASIC Prototyping & Emulation
The EPF6024AQC208-1 was designed precisely for the legacy ASIC prototyping role: 24,000 typical gates of fast LUT-based logic, 100% in-system reconfigurability via SRAM configuration cells, and Quartus/MAX+PLUS II design entry. Engineers prototyping gate-array or pre-ASIC designs map RTL (VHDL/Verilog) onto the 1,960 LEs and verify real-world timing against the -1 speed grade's ~200 MHz fMAX before committing to a hard-ASIC mask set. The PQFP package is hand-solderable for engineering builds, and the JTAG port enables bitstream-load cycles in seconds. This application retains the EPF6024AQC208-1 in active service at many aerospace/defence OEMs decades after its release.
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High-Volume Gate-Array Replacement
For high-volume gate-array-replacement designs in the early 2000s, the EPF6024AQC208-1 offered the right balance of 24K typical gates, 171 I/Os, and 200 MHz performance at a price point lower than competing masked gate arrays. Modern equivalents of this use case include Cyclone IV and Cyclone 10 LP devices, but the EPF6024AQC208-1 still ships in long-lifecycle aerospace, medical-imaging, and railway-signalling designs where requalification cost exceeds migration cost. Designers benefit from the deterministic timing closure of the FLEX 6000 architecture, which avoids the variability of later synthesis-heavy architectures.
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Embedded Control Subsystems
The EPF6024AQC208-1 pairs with embedded microprocessors as a programmable I/O-expansion and custom-peripheral engine: its 171 user I/Os handle PWM generation, quadrature-encoder input, and parallel display/Keypad scanning, while its 196 LABs implement custom instruction-set extensions or DMA engines. The 3.3 V supply aligns with NXP/Freescale ColdFire and PowerQUICC families, simplifying single-rail designs. SRAM configuration cells allow field updates over JTAG without physical access, valuable in sealed enclosures. With 0–85 °C commercial temperature range, the part covers most indoor embedded applications; for outdoor/automotive variants, designers should consider the -1N RoHS-suffix part.
추천
Test & Measurement Backplanes
In test-and-measurement backplanes, the EPF6024AQC208-1 acts as a programmable timing generator, channel-multiplexer, and trigger-sequencing core. Its 196 LABs hold waveform tables and digital-state-machine encoders for arbitrary stimulus generation, while 171 user I/Os route trigger/marker signals across the backplane. The JTAG boundary-scan chain is used for board-level interconnect testing, eliminating bed-of-nails fixtures and accelerating time-to-market. With up to ~200 MHz internal fMAX in the -1 speed grade, the EPF6024AQC208-1 fits stimulus rates commonly required by ATE backplanes.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF6024AQC208-1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF6024AQC208-3 | EPF6024AQC208-1N | EPF6016AQC208-1 | EPF6024AQC208-2 | EPF6024AQC208 |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 208-pin PQFP (BFQFP) | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same |
| Family | FLEX 6000 | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same |
| Typical Gates | 24,000 | 24,000 | 24,000 | 16,000 (-33%) | 24,000 | 24,000 |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,320 (-33%) | 1,960 | 1,960 |
| Speed Grade | -1 (~200 MHz) | -3 (~100 MHz) -50% | -1N (~200 MHz, RoHS) | -1 (~200 MHz) | -2 (~150 MHz) -25% | default (~150 MHz) |
| User I/Os | 171 | 171 | 171 | 171 | 171 | 171 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS | Non-compliant (legacy) | Non-compliant | Compliant (lead-free) | Non-compliant | Non-compliant | Non-compliant |
주요 차별점
- Highest FLEX 6000 speed grade available in 208-pin PQFP (vs EPF6024AQC208-3)
- RoHS lead-free finish available without changing the die (vs EPF6024AQC208-1N)
- Higher logic density than the EPF6016 in the same footprint (vs EPF6016AQC208-1)
설계 노트
Estimated: do not drive 5 V TTL signals directly into the EPF6024AQC208-1's 3.3 V VCCIO pins. Use an external bus-switch or resistor-divider network; the device has no 5 V-tolerant I/O cells. Long-term reliability studies show that over-voltage I/O stresses accelerate latch-up risk in 0.42 µm CMOS, so level translation is mandatory when interfacing legacy 5 V logic.
The 208-pin PQFP package has 0.5 mm pitch gull-wing leads with a thermal pad underneath that bonds to internal PCB ground. Recommended PCB layout uses at least 4-layer stack-up with continuous ground plane directly under the device to provide thermal relief. Estimated: at 200 MHz internal fMAX and 0.42 µm process, typical junction-to-ambient thermal resistance θJA is ~25 °C/W, so derate maximum ambient by 25 °C above 1 W dissipation. Provide 6–8 thermal vias under the die-attach paddle.
Estimated: at -1 speed grade (≈200 MHz internal fMAX), the 3.3 V LVCMOS outputs of the EPF6024AQC208-1 require 22–33 Ω series damping resistors when driving traces longer than ~50 mm or capacitive loads above 25 pF. Use IBIS simulation in Quartus to verify signal integrity before committing to layout; bypass each VCCIO/GND pair with 0.1 µF ceramic + 10 µF tantalum decoupling placed within 5 mm of each power pin.
규정 준수 정보
RoHS non-compliant due to PQFP lead-frame finish; RoHS-compliant variant available as EPF6024AQC208-1N. REACH, halogen-free, and conflict-minerals declarations are not stated in the verified web data and should be requested directly from the authorised distributor for new procurement.