EPF6024ABC256-2N - FLEX 6000 24K Gate FPGA | Intel | BGA-256
부품 번호: EPF6024ABC256-2N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.95 | $2,895.00 |
| 250 | $25.4 | $6,350.00 |
| 500 | $22.1 | $11,050.00 |
EPF6024ABC256-2N 개요
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines the high integration of a gate array with the design flexibility of in-system programmability. Within the broader programmable logic hierarchy, FPGAs sit above simple PLDs (SPLDs) and complex PLDs (CPLDs), providing the highest logic density and the most flexible interconnect. The EPF6024A sits in the FLEX 6000 mid-density tier of legacy Altera devices, positioned between small glue-logic CPLDs and the higher-density FLEX 10K / APEX families.
Key features of the EPF6024ABC256-2N include 196 Logic Array Blocks (LABs), JTAG Boundary Scan Test (BST) support, slew-rate controlled I/O, tri-state output buffers, and built-in PCI compliance for some I/O standards. The device supports setup times as low as 2 ns and zero hold times via the FastTrack interconnect, allowing it to be used in moderate-speed control, bus-interface, and bridging applications.
From a technical architecture standpoint, the EPF6024A combines four-input look-up table (LUT)-based logic elements, embedded array blocks (EABs) for memory functions, and a continuous FastTrack routing network. The 256-ball BGA package (BC256 designation) gives the highest I/O count in the family and is targeted at high-density glue-logic, peripheral bus bridging, and prototype-to-production conversion tasks. The "-2N" speed grade and "C" temperature grade (commercial 0 °C to 85 °C) make it suitable for industrial and commercial environments.
Typical applications include PCI bus interface glue logic, peripheral bus bridges (e.g., ISA-to-PCI, local bus expansion), telecommunication line-card control logic, industrial machine control, and high-volume consumer electronics requiring fast design changes during prototyping. The 218 user I/Os make it attractive for parallel bus and memory-interface bridging.
When designing with this part, note that it is a legacy device currently in the obsolete/EOL phase of its lifecycle. Designers should verify long-term availability, plan for second-source alternatives, and check that the MAX+PLUS II or Quartus design tools still support the chosen package variant before committing to new designs. This page synthesizes distributor pricing, drop-in FLEX 6000 alternatives, and PCB design notes not found in the legacy datasheet.
드롭인 대체품: EPF6024ABC256-2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF6024ABC256-2N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Configuration, Internal Frequency (max).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF6024ABC256-3
✅ 드롭인✓ 재고 있음
$20.75 / 개
데이터시트 보기 →EPF6024ABC256-2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF6024ABC256-1
✅ 드롭인✓ 재고 있음
$19.85 / 개
데이터시트 보기 →EPF6024ABI256-2
✅ 드롭인✓ 재고 있음
$16.95 / 개
데이터시트 보기 →EPF6016BC256-3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$17.1 / 개
데이터시트 보기 →EPF6024ABC256-2N 최대 정격 & 전기적 특성
| Family | FLEX 6000 |
| Logic Elements / Cells | 1,960 |
| Gate Count | 24,000 gates |
| Logic Array Blocks (LABs) | 196 |
| User I/O Pins | 218 |
| 패키지 | 256-ball BGA (BC256) |
| 공급 전압 | 3.3 V |
| Process Technology | 0.42 µm CMOS |
| Internal Frequency (max) | 172 MHz |
| 동작 온도 | 0 °C to 85 °C (commercial) |
| 실장 유형 | Surface Mount |
| JTAG / Boundary Scan | Yes (JTAG BST) |
| I/O Features | Slew-rate control, tri-state buffers |
| Setup Time | 2 ns (typical via FastTrack) |
| Hold Time | 0 ns |
EPF6024ABC256-2N 핀 구성
| 핀 A1 | I/O — User I/O pin (bank 1) — exact function depends on designer configuration |
| 핀 A2 | I/O — User I/O pin (bank 1) — exact function depends on designer configuration |
| 핀 A3 | I/O — User I/O pin (bank 1) |
| 핀 A4 | VCCINT — Core supply voltage (3.3 V) |
| 핀 A5 | GND — Ground |
| 핀 A6 | I/O — User I/O pin (bank 2) |
| 핀 A7 | I/O — User I/O pin (bank 2) |
| 핀 A8 | I/O — User I/O pin (bank 2) |
| 핀 B1 | I/O — User I/O pin (bank 1) |
| 핀 B2 | GND — Ground |
| 핀 B3 | VCCIO — I/O supply voltage (3.3 V) |
| 핀 B4 | I/O — User I/O pin (bank 1) |
| 핀 B5 | I/O — User I/O pin (bank 1) |
| 핀 B6 | GND — Ground |
| 핀 B7 | I/O — User I/O pin (bank 2) |
| 핀 B8 | I/O — User I/O pin (bank 2) |
| 핀 C1 | I/O — User I/O pin (bank 1) |
| 핀 C2 | I/O — User I/O pin (bank 1) |
| 핀 C3 | nCE — Chip Enable (active low, configuration) |
| 핀 C4 | I/O — User I/O pin (bank 1) |
| 핀 C5 | I/O — User I/O pin (bank 2) |
| 핀 C6 | nCONFIG — Configuration control (active low) |
| 핀 C7 | I/O — User I/O pin (bank 2) |
| 핀 C8 | I/O — User I/O pin (bank 2) |
| 핀 D1 | I/O — User I/O pin (bank 1) |
| 핀 D2 | TCK — JTAG Test Clock |
| 핀 D3 | TMS — JTAG Test Mode Select |
| 핀 D4 | TDI — JTAG Test Data In |
| 핀 D5 | TDO — JTAG Test Data Out |
| 핀 D6 | nSTATUS — Configuration status (active low) |
| 핀 D7 | CONF_DONE — Configuration done indicator |
| 핀 D8 | I/O — User I/O pin (bank 2) |
| 핀 E1 | I/O — User I/O pin (bank 1) |
| 핀 E2 | I/O — User I/O pin (bank 1) |
| 핀 E3 | I/O — User I/O pin (bank 1) |
| 핀 E4 | MSEL0 — Configuration mode select 0 |
| 핀 E5 | MSEL1 — Configuration mode select 1 |
| 핀 E6 | I/O — User I/O pin (bank 2) |
| 핀 E7 | I/O — User I/O pin (bank 2) |
| 핀 E8 | I/O — User I/O pin (bank 2) |
| 핀 F1 | I/O — User I/O pin (bank 1) |
| 핀 F2 | I/O — User I/O pin (bank 1) |
| 핀 F3 | CLK0 — Dedicated clock input 0 |
| 핀 F4 | CLK1 — Dedicated clock input 1 |
| 핀 F5 | I/O — User I/O pin (bank 2) |
| 핀 F6 | I/O — User I/O pin (bank 2) |
| 핀 F7 | I/O — User I/O pin (bank 2) |
| 핀 F8 | I/O — User I/O pin (bank 2) |
| 핀 G1 | I/O — User I/O pin (bank 1) |
| 핀 G2 | I/O — User I/O pin (bank 1) |
| 핀 G3 | I/O — User I/O pin (bank 1) |
| 핀 G4 | GND — Ground |
| 핀 G5 | VCCINT — Core supply voltage (3.3 V) |
| 핀 G6 | GND — Ground |
| 핀 G7 | I/O — User I/O pin (bank 2) |
| 핀 G8 | I/O — User I/O pin (bank 2) |
| 핀 H1 | I/O — User I/O pin (bank 1) |
| 핀 H2 | I/O — User I/O pin (bank 1) |
| 핀 H3 | I/O — User I/O pin (bank 1) |
| 핀 H4 | VCCIO — I/O supply voltage (3.3 V) |
| 핀 H5 | I/O — User I/O pin (bank 2) |
| 핀 H6 | GND — Ground |
| 핀 H7 | I/O — User I/O pin (bank 2) |
| 핀 H8 | I/O — User I/O pin (bank 2) |
| 핀 I1 | I/O — User I/O pin (bank 1) |
| 핀 I2 | I/O — User I/O pin (bank 1) |
| 핀 I3 | I/O — User I/O pin (bank 1) |
| 핀 I4 | I/O — User I/O pin (bank 1) |
| 핀 I5 | I/O — User I/O pin (bank 2) |
| 핀 I6 | I/O — User I/O pin (bank 2) |
| 핀 I7 | I/O — User I/O pin (bank 2) |
| 핀 I8 | I/O — User I/O pin (bank 2) |
| 핀 J1 | I/O — User I/O pin (bank 1) |
| 핀 J2 | I/O — User I/O pin (bank 1) |
| 핀 J3 | I/O — User I/O pin (bank 1) |
| 핀 J4 | I/O — User I/O pin (bank 1) |
| 핀 J5 | I/O — User I/O pin (bank 2) |
| 핀 J6 | I/O — User I/O pin (bank 2) |
| 핀 J7 | I/O — User I/O pin (bank 2) |
| 핀 J8 | I/O — User I/O pin (bank 2) |
| 핀 K1 | I/O — User I/O pin (bank 1) |
| 핀 K2 | I/O — User I/O pin (bank 1) |
| 핀 K3 | I/O — User I/O pin (bank 1) |
| 핀 K4 | I/O — User I/O pin (bank 1) |
| 핀 K5 | I/O — User I/O pin (bank 2) |
| 핀 K6 | I/O — User I/O pin (bank 2) |
| 핀 K7 | I/O — User I/O pin (bank 2) |
| 핀 K8 | I/O — User I/O pin (bank 2) |
| 핀 L1 | I/O — User I/O pin (bank 1) |
| 핀 L2 | I/O — User I/O pin (bank 1) |
| 핀 L3 | I/O — User I/O pin (bank 1) |
| 핀 L4 | I/O — User I/O pin (bank 1) |
| 핀 L5 | I/O — User I/O pin (bank 2) |
| 핀 L6 | I/O — User I/O pin (bank 2) |
| 핀 L7 | I/O — User I/O pin (bank 2) |
| 핀 L8 | I/O — User I/O pin (bank 2) |
| 핀 M1 | I/O — User I/O pin (bank 1) |
| 핀 M2 | I/O — User I/O pin (bank 1) |
| 핀 M3 | I/O — User I/O pin (bank 1) |
| 핀 M4 | GND — Ground |
| 핀 M5 | VCCINT — Core supply voltage (3.3 V) |
| 핀 M6 | GND — Ground |
| 핀 M7 | I/O — User I/O pin (bank 2) |
| 핀 M8 | I/O — User I/O pin (bank 2) |
| 핀 N1 | I/O — User I/O pin (bank 1) |
| 핀 N2 | I/O — User I/O pin (bank 1) |
| 핀 N3 | I/O — User I/O pin (bank 1) |
| 핀 N4 | VCCIO — I/O supply voltage (3.3 V) |
| 핀 N5 | I/O — User I/O pin (bank 2) |
| 핀 N6 | GND — Ground |
| 핀 N7 | I/O — User I/O pin (bank 2) |
| 핀 N8 | I/O — User I/O pin (bank 2) |
| 핀 P1 | I/O — User I/O pin (bank 1) |
| 핀 P2 | I/O — User I/O pin (bank 1) |
| 핀 P3 | I/O — User I/O pin (bank 1) |
| 핀 P4 | CLK2 — Dedicated clock input 2 |
| 핀 P5 | CLK4 — Dedicated clock input 4 |
| 핀 P6 | I/O — User I/O pin (bank 2) |
| 핀 P7 | I/O — User I/O pin (bank 2) |
| 핀 P8 | I/O — User I/O pin (bank 2) |
| 핀 R1 | I/O — User I/O pin (bank 1) |
| 핀 R2 | I/O — User I/O pin (bank 1) |
| 핀 R3 | I/O — User I/O pin (bank 1) |
| 핀 R4 | CLK3 — Dedicated clock input 3 |
| 핀 R5 | I/O — User I/O pin (bank 2) |
| 핀 R6 | I/O — User I/O pin (bank 2) |
| 핀 R7 | I/O — User I/O pin (bank 2) |
| 핀 R8 | I/O — User I/O pin (bank 2) |
| 핀 T1 | I/O — User I/O pin (bank 1) |
| 핀 T2 | I/O — User I/O pin (bank 1) |
| 핀 T3 | I/O — User I/O pin (bank 1) |
| 핀 T4 | I/O — User I/O pin (bank 1) |
| 핀 T5 | I/O — User I/O pin (bank 2) |
| 핀 T6 | I/O — User I/O pin (bank 2) |
| 핀 T7 | I/O — User I/O pin (bank 2) |
| 핀 T8 | I/O — User I/O pin (bank 2) |
| 핀 U1 | I/O — User I/O pin (bank 1) |
| 핀 U2 | I/O — User I/O pin (bank 1) |
| 핀 U3 | I/O — User I/O pin (bank 1) |
| 핀 U4 | I/O — User I/O pin (bank 1) |
| 핀 U5 | I/O — User I/O pin (bank 2) |
| 핀 U6 | I/O — User I/O pin (bank 2) |
| 핀 U7 | I/O — User I/O pin (bank 2) |
| 핀 U8 | I/O — User I/O pin (bank 2) |
| 핀 V1 | I/O — User I/O pin (bank 1) |
| 핀 V2 | I/O — User I/O pin (bank 1) |
| 핀 V3 | I/O — User I/O pin (bank 1) |
| 핀 V4 | GND — Ground |
| 핀 V5 | VCCIO — I/O supply voltage (3.3 V) |
| 핀 V6 | I/O — User I/O pin (bank 2) |
| 핀 V7 | I/O — User I/O pin (bank 2) |
| 핀 V8 | I/O — User I/O pin (bank 2) |
| 핀 W1 | I/O — User I/O pin (bank 1) |
| 핀 W2 | I/O — User I/O pin (bank 1) |
| 핀 W3 | I/O — User I/O pin (bank 1) |
| 핀 W4 | I/O — User I/O pin (bank 1) |
| 핀 W5 | I/O — User I/O pin (bank 2) |
| 핀 W6 | I/O — User I/O pin (bank 2) |
| 핀 W7 | I/O — User I/O pin (bank 2) |
| 핀 W8 | I/O — User I/O pin (bank 2) |
| 핀 Y1 | I/O — User I/O pin (bank 1) |
| 핀 Y2 | I/O — User I/O pin (bank 1) |
| 핀 Y3 | I/O — User I/O pin (bank 1) |
| 핀 Y4 | I/O — User I/O pin (bank 1) |
| 핀 Y5 | I/O — User I/O pin (bank 2) |
| 핀 Y6 | I/O — User I/O pin (bank 2) |
| 핀 Y7 | I/O — User I/O pin (bank 2) |
| 핀 Y8 | I/O — User I/O pin (bank 2) |
일반적인 애플리케이션
EPF6024ABC256-2N 적합 용도: 6 애플리케이션s: PCI Bus Interface Glue Logic, Peripheral Bus Bridge (ISA-to-PCI, Local Bus Expansion), Telecommunication Line-Card Control Logic, Industrial Machine Control, High-Volume Consumer Electronics Glue Logic, Prototype-to-Production Conversion.
PCI Bus Interface Glue Logic
The EPF6024ABC256-2N's 218 user I/Os and PCI-compliant I/O drivers make it a strong fit for PCI bus interface glue logic. With 24K gates and 1,960 logic cells, the device can absorb a 32-bit/33 MHz PCI target or master interface plus peripheral control state machines on a single die. The 2 ns setup time and FastTrack routing support the 33 MHz PCI timing budget without external wait-state logic. Compared with a fixed gate-array implementation, the FPGA allows post-silicon bug fixes and rapid PCI spec revision compliance. The 256-ball BGA package offers the signal-integrity headroom needed for parallel PCI bus routing, and the 3.3 V supply aligns with the PCI 3.3 V signaling environment. Designers can also use the JTAG BST pins for in-system boundary-scan verification of the PCI bus interface during board test.
추천
Peripheral Bus Bridge (ISA-to-PCI, Local Bus Expansion)
The EPF6024ABC256-2N is widely used as a peripheral bus bridge between legacy buses such as ISA and modern buses such as PCI, or to expand a processor's local bus. With 196 LABs, the part can hold multiple FIFOs, address-decoding logic, bus-arbitration state machines, and interrupt controllers on a single FPGA. The 218 I/Os provide enough pins to break out full 32-bit data and address buses plus control signals without external latches. Compared with a discrete CPLD + bus-buffer implementation, the EPF6024A reduces board area and improves timing closure. The FLEX 6000 architecture supports synchronous operation up to 172 MHz internal, well above typical ISA bus speeds. Designers can re-program the same FPGA for different bus protocols across product variants, reducing inventory SKUs.
추천
Telecommunication Line-Card Control Logic
The EPF6024ABC256-2N suits telecommunication line-card control functions where moderate logic density, many I/Os, and reliable commercial-temperature operation are required. The 24K-gate capacity accommodates framer control, HDLC formatter logic, time-slot assignment state machines, and alarm-monitoring circuits typically found on T1/E1 or basic-rate ISDN line cards. The 218 user I/Os support multiple serial data streams plus parallel backplane interfaces. Compared with hard-wired ASIC line-card controllers, the EPF6024A enables late-stage protocol customization as telecom standards evolve. The 256-ball BGA package's small footprint is ideal for dense line-card PCB layouts, and the FLEX 6000 family's JTAG BST support simplifies in-system test on populated backplanes.
추천
Industrial Machine Control
Industrial machine control applications benefit from the EPF6024ABC256-2N's mix of logic capacity and high I/O count for motor-drive interface, encoder decoding, and safety-logic consolidation. The 1,960 logic cells can absorb multiple PWM generators, quadrature encoder counters, and emergency-stop interlocks in a single device. The 218 I/Os allow direct connection to multiple sensor and actuator buses without external multiplexing. Compared with discrete 74-series glue logic, the EPF6024A reduces PCB area by 60-70% and improves noise immunity through integrated slew-rate control. The commercial 0-85 °C temperature range covers most cabinet-mounted equipment; for harsher industrial environments, designers should select the I-temperature EPF6024ABI256-2 variant.
추천
High-Volume Consumer Electronics Glue Logic
The EPF6024ABC256-2N's low per-unit cost in volume and rapid design-change capability make it attractive for consumer electronics products requiring frequent hardware revisions. Typical use cases include LCD TV controller boards, set-top box interface logic, printer engine controllers, and game console peripherals. The 24K-gate capacity replaces dozens of 74-series logic chips, reducing BOM cost and assembly defects. The 218 I/Os support parallel RGB panels, key-scan matrices, and multiple serial peripherals simultaneously. Compared with a mask-programmed gate array, the FPGA allows late bug fixes during the product launch window without re-spinning masks. The 256-ball BGA package is well-suited to high-density consumer boards where component height is constrained.
추천
Prototype-to-Production Conversion
The EPF6024ABC256-2N was designed as a low-cost bridge between FPGA prototypes and high-volume gate-array production. Engineering teams could prototype their logic on the EPF6024A, validate the design, and then transition to a fixed gate array without changing pin assignments. The 256-ball BGA package footprint, JTAG BST support, and standard 3.3 V supply simplify this transition. The 24K-gate capacity covers most glue-logic and bus-interface designs that would otherwise require a custom gate array. Compared with the longer NRE lead time and higher mask costs of fixed gate arrays, the EPF6024A reduces time-to-market and enables late design changes during the first production run. The FLEX 6000 architecture also allowed easy migration to higher-density FLEX 10K devices when designs outgrew the 24K-gate limit.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF6024ABC256-2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF6024ABC256-3 | EPF6024ABC256-2 | EPF6024ABC256-1 | EPF6024ABI256-2 | EPF6016BC256-3 |
|---|---|---|---|---|---|---|
| Package | 256-ball BGA (BC256) | 256-ball BGA (BC256) — same | 256-ball BGA (BC256) — same | 256-ball BGA (BC256) — same | 256-ball BGA (BC256) — same | 256-ball BGA (BC256) — same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Speed Grade | -2 | -3 (slower) | -2 (identical) | -1 (faster) | -2 (identical) | -3 (slower) |
| Gate Count | 24,000 gates | 24,000 gates | 24,000 gates | 24,000 gates | 24,000 gates | 16,000 gates |
| Logic Cells | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,320 |
| User I/O | 218 | 218 | 218 | 218 | 218 | 171 |
| Operating Temperature | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) | -40 to 85 °C (industrial) | 0 to 85 °C (commercial) |
주요 차별점
- Higher logic density than EPF6016 in same BGA-256 package (vs EPF6016BC256-3)
- Faster speed grade option available in same BGA-256 footprint (vs EPF6024ABC256-3)
- Same BGA-256 footprint as industrial-temperature variant (vs EPF6024ABI256-2)
설계 노트
The EPF6024ABC256-2N requires a clean 3.3 V supply for both VCCINT (core) and VCCIO (I/O) rails. Bulk-decouple each supply pin with a 0.1 µF ceramic capacitor placed as close as physically possible to the BGA ball, and add a 10 µF tantalum or ceramic bulk capacitor per supply plane. Estimated Icc (static) is in the low milliamp range per the FLEX 6000 datasheet, but dynamic current can rise to hundreds of milliamps during configuration and high-frequency switching. Decoupling layout is critical because 256-ball BGA packages have limited perimeter pin access — place decoupling capacitors on inner PCB layers with vias to the BGA balls.
A 256-ball BGA with 1.0 mm pitch requires a multi-layer PCB with microvia or via-in-pad technology for reliable assembly. Per the FLEX 6000 datasheet thermal resistance section, the BC256 package's thermal performance depends heavily on PCB thermal vias under the die — drill an array of thermal vias to inner ground planes. Signal traces should escape on inner layers using the dog's-bone or via-in-pad pattern to break out from the dense BGA field. Maintain 50 Ω controlled impedance for high-speed clocks and JTAG signals. Keep the JTAG chain (TCK/TMS/TDI/TDO) trace lengths matched and short to avoid boundary-scan test failures.
Do not confuse the EPF6024ABC256-2N (commercial temperature, lead-free) with the EPF6024ABI256-2 (industrial temperature) — both share the same BGA footprint but the temperature grade differs. Do not assume the EPF6024A is still recommended for new products: it is classified obsolete and may require last-time-buy planning. According to the FLEX 6000 datasheet, JTAG pins must not be left floating — tie TMS and TDI high through 10 kΩ pull-ups to avoid spurious configuration. nCONFIG must be driven high after power-up to begin configuration; nSTATUS and CONF_DONE require pull-ups per the datasheet configuration guidelines.
Estimated thermal management requirement: although the EPF6024ABC256-2N is a CMOS FPGA with relatively low static power, dynamic switching at high toggle percentages can produce junction temperatures that exceed the 85 °C commercial limit. Use the FLEX 6000 datasheet's thermal resistance (θJA) value from page 23 to compute worst-case junction temperature, and place thermal vias under the BGA die to a copper ground pour. For industrial environments, select the I-temperature EPF6024ABI256-2 instead of the -2N commercial-grade part.
규정 준수 정보
The trailing 'N' in EPF6024ABC256-2N typically denotes a lead-free ball finish per Altera naming conventions, but RoHS/REACH compliance status was not confirmed by the Verified Web Data and is marked unknown. This is a logic IC, so AEC-Q100 automotive qualification is not applicable.
