10AS032H1F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel (Altera)
부품 번호: 10AS032H1F34E1HG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2237.25 | $2,237.25 |
| 10 | $2150.5 | $21,505.00 |
| 100 | $1985 | $198,500.00 |
| 250 | $1860 | $465,000.00 |
| 500 | $1755 | $877,500.00 |
10AS032H1F34E1HG 개요
An SoC FPGA is a single integrated circuit that combines a general-purpose processor subsystem (CPU, memory controller, peripherals) with a programmable FPGA fabric. The Arria 10 SX architecture places the ARM Cortex-A9 subsystem as a hard macro in the device's I/O column, giving developers deterministic shared-memory access to the FPGA fabric via a high-bandwidth AXI/ACP coherent interconnect — dramatically improving latency and throughput over soft-core SoC implementations. This hierarchy places the Arria 10 SX in the broader family of SoC FPGAs, programmable logic devices, and embedded processors.
Key features of the 10AS032H1F34E1HG include a 1.5 GHz Cortex-A9 dual-core hard processor system with NEON SIMD media engine and single/double precision floating-point unit, approximately 320K logic elements combined with roughly 21 Mb of on-chip M20K memory, hardened floating-point DSP blocks, up to 24 transceivers supporting data rates up to 17.4 Gbps, and integrated PCIe Gen3 x8 hard IP plus external memory interfaces supporting DDR4 at up to 2133 Mbps. Power consumption is optimized through the 20nm process and Smart Voltage ID-based adaptive body bias.
The architecture leverages a 20nm TSMC process with hard IP for memory controllers, PCIe, and the HPS, leaving the FPGA fabric free for application logic. Adaptive Body Bias reduces leakage at low activity, while smart routing and variable-precision DSP blocks accelerate DSP-heavy workloads such as wireless baseband or radar processing. The transceiver and memory subsystem are tightly coupled, making it well suited for line-rate streaming pipelines.
Typical applications include high-performance wireline and wireless baseband processing, software-defined radio, test and measurement instrumentation, broadcast video processing, industrial machine vision, and defense signal intelligence. The combination of ARM Cortex-A9 running an embedded OS plus a high-performance FPGA fabric lets teams implement complex control planes and data planes on a single device.
When designing with this part, pay close attention to PCB layout: the 1152-ball FCBGA requires a high-density multilayer PCB with microvia stack-ups, and proper decoupling per the Intel pin connection guidelines is essential. Thermal management is critical — the FC package dissipates significant power under heavy logic utilization, so a heatsink or thermal interface material is typically required in enclosed chassis.
This page synthesizes current distributor inventory, lifecycle signals, drop-in same-package alternatives, and practical PCB/thermal guidance not collected on a single manufacturer page.
드롭인 대체품: 10AS032H1F34E1HG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS032H1F34E1HG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, DSP Blocks, Transceivers, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS032H1F34E2HG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AS032H1F34E3HG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AS032H1F34I1HG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2077.26 / 개
데이터시트 보기 →10AS032H1F34I2HG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AS032H1F34I3HG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AS032H1F34E1HG 최대 정격 & 전기적 특성
| Device Family | Arria 10 SX |
| Architecture | 20nm SoC FPGA (FPGA + hard ARM Cortex-A9 subsystem) |
| Logic Elements | 320,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| On-chip Memory | Approx. 21 Mb (M20K blocks) |
| Transceivers | Up to 24 channels, up to 17.4 Gbps |
| DSP Blocks | Variable-precision hardened DSP with floating-point |
| Hard Memory Controllers | DDR4 up to 2133 Mbps, DDR3, QDRII+, RLDRAM3 |
| PCIe Hard IP | PCIe Gen3 x8 |
| 패키지 | 1152-ball FCBGA (35 x 35 mm) |
| Operating Temperature (E1 suffix) | 0C to +100C (extended) |
| 실장 유형 | Surface Mount, flip-chip BGA |
| RoHS 상태 | Compliant |
| Pin/Ball Count | 1152 |
10AS032H1F34E1HG 1152-ball fcbga (35 x 35 mm) 핀 구성 가이드
10AS032H1F34E1HG(1152-ball fcbga (35 x 35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS032H1F34E1HG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS032H1F34E1HG 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Software-Defined Radio (SDR) Platforms, Test and Measurement Instrumentation, Broadcast Video Processing, Industrial Machine Vision, Defense Signal Intelligence.
Wireless Baseband Processing
The 10AS032H1F34E1HG's combination of approximately 320K logic elements and hardened floating-point DSP blocks makes it well suited for wireless baseband signal processing. Its 17.4 Gbps transceivers connect directly to RF ADCs/DACs and JESD204B/C interfaces, while the dual-core ARM Cortex-A9 HPS running at 1.5 GHz handles the MAC layer and protocol stack under Linux. The device sustains LTE and 5G NR physical-layer workloads at line rate, replacing discrete DSP + MCU architectures with a single SoC FPGA. AXI-coherent access between HPS and FPGA fabric eliminates DMA bottlenecks common in two-chip designs.
추천
Software-Defined Radio (SDR) Platforms
The 10AS032H1F34E1HG is a workhorse for high-performance SDR platforms where reconfigurability across waveforms (LTE, Wi-Fi, custom OFDM) is essential. Its 24 transceivers support multiple antennas and RF chains simultaneously, while the FPGA fabric runs FFTs, channelizers, and modulators in real time. The HPS boots a Linux SDR stack (GNU Radio, custom frameworks) and exchanges samples with the fabric over the AXI/ACP bridge. Designers value the device's PCIe Gen3 x8 endpoint for host coupling in test and measurement chassis.
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Test and Measurement Instrumentation
For oscilloscopes, signal analyzers, and protocol testers, the 10AS032H1F34E1HG delivers the parallel logic capacity to capture and process multi-gigasample-per-second ADC data streams. Its 21 Mb of M20K memory buffers long acquisitions, while the FPGA fabric implements custom trigger logic and decoders. The Cortex-A9 HPS manages the user interface, display, and Ethernet/USB connectivity, running an embedded OS for instrument control. Compared with discrete FPGA + processor designs, this single-chip approach shrinks PCB area and reduces BOM cost in high-channel-count instruments.
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Broadcast Video Processing
The 10AS032H1F34E1HG accelerates broadcast video workloads including 4K/8K upconversion, frame-rate conversion, and HDR mapping. Its DSP blocks implement scaling and color-space conversion pipelines, while H.265/HEVC codecs run in the FPGA fabric for real-time contribution encoding. The ARM HPS manages IP transport streams (SMPTE 2022, SMPTE 2110) over Ethernet and orchestrates channel playout. The 1.5 GHz Cortex-A9 also handles captioning and graphics overlay, replacing separate control MCUs.
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Industrial Machine Vision
In factory automation and inspection systems, the 10AS032H1F34E1HG performs real-time image processing on multiple high-resolution camera streams. Its transceivers accept MIPI CSI-2, CoaXPress, or GigE Vision inputs, while the FPGA fabric runs convolution, edge detection, and AI inference accelerators. The Cortex-A9 HPS hosts a Linux-based vision stack (OpenCV, ROS 2) and drives EtherCAT or PROFINET industrial Ethernet to coordinate with PLCs and robots. The extended industrial temperature grade (E1) supports factory-floor environments from 0C to +100C.
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Defense Signal Intelligence
The 10AS032H1F34E1HG is widely adopted in electronic-warfare and signals-intelligence systems where wideband capture and real-time demodulation are critical. Its 17.4 Gbps transceivers digitize GHz-bandwidth RF directly, the FPGA fabric runs channelizers and demodulators at full rate, and the HPS coordinates spectrum scanning and recording. The 1152-ball FCBGA's high pin count supports the dense digital I/O needed for multi-channel RF front ends, and the device's security features (AES, secure boot) protect classified waveforms. Its mature ecosystem and long-life program status make it a low-risk choice for defense platforms.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS032H1F34E1HG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS032H1F34E2HG | 10AS032H1F34E3HG | 10AS032H1F34I1HG | 10AS032H1F34I2HG | 10AS032H1F34I3HG |
|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (35x35) | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 320K | 320K | 320K | 320K | 320K | 320K |
| Hard Processor System | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
| Operating Temperature | 0C to +100C (E1) | 0C to +100C (E2) | 0C to +100C (E3) | -40C to +100C (I1) | -40C to +100C (I2) | -40C to +100C (I3) |
| Transceivers (max) | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps |
| Lead-Free / RoHS | Yes (HG suffix) | Yes (HG suffix) | Yes (HG suffix) | Yes (HG suffix) | Yes (HG suffix) | Yes (HG suffix) |
주요 차별점
- Same silicon as 1152-ball FCBGA family siblings across temperature grades (vs 10AS032H1F34I3HG)
- Higher pin count than 780-ball BGA siblings, supporting more transceiver channels and wider memory interface (vs 10AS032E4F29I3SG)
- Dual-core ARM Cortex-A9 HPS integrated on die (vs Logic-only Arria 10 GX parts)
설계 노트
The 1152-ball FCBGA requires an HDI PCB with microvia stack-ups and matched-length routing for high-speed transceivers. Use the Arria 10 pin connection guidelines to assign power-pin decoupling: bulk caps within 50 mils of the pin, plus 0.1 uF and 0.01 uF ceramics at each power pin per the Intel FPGA power delivery network design guide. Estimated via-in-pad microvia count exceeds 1,000; expect 8-12 layer stack-up with buried capacitance.
Estimated: at full FPGA fabric utilization (320K LE, ~85% toggle rate) plus active HPS, expect 12-18 W power dissipation. The 35x35 mm FCBGA package has theta_JA around 8-12 C/W with a properly designed heatsink; without a heatsink, junction temperature can exceed 100C in still air. Use a thermal interface material rated for the package height, and consider a clip-mounted heatsink per the Arria 10 thermal design guide.
Do not assume all 10AS032H1F34 variants are drop-in: only same-suffix code (E1/E2/E3 or I1/I2/I3 in F34) parts share the identical pinout. The 10AS032E4F29I3SG and similar 780-ball BGA siblings share silicon but use a different footprint and are NOT pin-compatible. Always verify the order code against the Arria 10 device handbook before PCB respin.
Transceiver channels up to 17.4 Gbps require strict impedance control (100 ohm differential with 5% tolerance) and length matching within the budget published in the Arria 10 transceiver user guide. Keep AC-coupling capacitors within 200 mils of the FPGA pin, and isolate high-speed transceiver regions from the HPS peripherals and DDR4 interfaces with a solid ground plane to minimize crosstalk and EMI.
규정 준수 정보
Lead-free / RoHS-compliant per the HG suffix in the order code. AEC-Q100 not qualified (industrial-grade part); for automotive applications use an explicitly qualified Intel FPGA part. REACH, halogen-free, and conflict-minerals status not explicitly stated in the verified distributor data.
