A3P600-2FGG256 - ProASIC3 Flash FPGA 600K Gates | Microchip
부품 번호: A3P600-2FGG256 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $61.98 | $61.98 |
| 10 | $58.88 | $588.80 |
| 100 | $55.78 | $5,578.00 |
| 500 | $53.13 | $26,565.00 |
| 1,000 | $50.51 | $50,510.00 |
A3P600-2FGG256 개요
A flash-based FPGA is a field-programmable gate array whose configuration data is stored in on-chip flash memory rather than an external configuration device or volatile SRAM. Within the programmable-logic hierarchy, the A3P600 sits in the mid-density tier of the ProASIC3 family: FPGA -> flash FPGA -> ProASIC3 generation -> A3P600 device. Because the configuration is nonvolatile, the device powers up instantly as a single-chip solution with no boot PROM, no configuration controller, and no configuration-bitstream exposure during power-up.
Key features include LiveStructure-style reprogrammability without an external configuration device, a 1.5V core for low dynamic power, four I/O banks supporting compatible voltage standards per bank, and support for common single-ended and differential I/O standards. The 177 available user I/Os in the 256-ball package give substantial routing headroom for bus-intensive designs, while the 110592-bit embedded RAM supports FIFOs and small datapath buffers.
Architecturally, the ProASIC3 fabric is built on a 130nm flash process using a sea-of-VersaTiles mesh. VersaTiles are fine-grained logic cells that implement combinational and sequential functions with predictable timing; routing is handled by a hierarchical segmented structure. The -2 speed grade offers faster worst-case timing than the -1 grade, supporting system performance up to 310 MHz.
Typical applications include industrial automation and motor-control interfaces, communications line-card glue logic and bridging, aerospace/defense subsystems requiring instant-on operation, and test and measurement instrumentation. The single-chip flash configuration makes it particularly attractive where BOM simplification and tamper-resistant bitstream storage matter.
Designers should budget power by grouping I/O standards into the four banks, since VCCIBx supplies are bank-specific and only electrically compatible standards may share a bank, per the Microchip migration application note. Decouple each VCC/VCCIBx pin with low-ESR ceramics placed close to the balls.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3P600-2FGG256 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600-2FGG256 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, System Gates, Process Technology, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600-2FGG256I
✅ 드롭인✓ 재고 있음
$49.8 / 개
데이터시트 보기 →A3P600-1FGG256
✅ 드롭인✓ 재고 있음
$18.75 / 개
데이터시트 보기 →A3P600-2FG256
✅ 드롭인✓ 재고 있음
$57.43 / 개
데이터시트 보기 →A3P600-2FGG256 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| System Gates | 600K |
| Logic Elements | VersaTiles (ProASIC3 fabric) |
| Embedded RAM | 110592 bits |
| User I/O | 177 |
| Core Supply Voltage | 1.5 V |
| Maximum System Frequency | 310 MHz |
| Process Technology | 130 nm flash |
| Speed Grade | -2 |
| Configuration Memory | On-chip flash (nonvolatile, single chip) |
| I/O Banks | 4 |
| 패키지 | 256-LBGA / 256-FBGA |
| 실장 유형 | Surface Mount |
| Terminal Form | Ball (BGA), square package |
A3P600-2FGG256 256-lbga / 256-fbga 핀 구성 가이드
A3P600-2FGG256(256-lbga / 256-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P600-2FGG256.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P600-2FGG256 적합 용도: 6 애플리케이션s: Industrial Automation and Motor Control, Communications Bridging and Line-Card Glue Logic, Aerospace and Defense Subsystems, Test and Measurement Instrumentation, Embedded Sensing and IoT Gateways, Legacy FPGA Redesign and Obsolescence Bridge.
Industrial Automation and Motor Control
The A3P600-2FGG256 fits industrial control because its 177 user I/Os, organized in four voltage banks, can mix 3.3V and 2.5V sensor and actuator interfaces on one chip while the flash configuration delivers instant-on operation after power dips common on factory floors. In a typical motion-control card, the FPGA implements quadrature-decoder counters, PWM generators, and safety interlock logic between an MCU and gate drivers, exploiting the -2 speed grade (310 MHz capability) for deterministic timing rather than software latency. Because the bitstream resides in on-chip flash, there is no external configuration device to fail or expose the design, and the 110592-bit embedded RAM buffers encoder and fieldbus traffic. Decouple each VCCIBx bank separately since only electrically compatible I/O standards may share a bank, per the Microchip migration application note.
추천
Communications Bridging and Line-Card Glue Logic
Line cards and backplane adapters frequently need protocol translation between legacy buses and modern interfaces, a role the A3P600-2FGG256 fills with 600K system gates of VersaTile fabric and banked I/Os that match mixed-voltage backplane standards. The 177 available balls give enough pins for a wide data path plus control and status signals without pin-multiplexing, and the -2 speed grade sustains the timing of parallel interfaces in the hundreds of MHz region. Its single-chip flash configuration shortens power-up, valuable in telecom equipment with strict reset budgets, and the 110592-bit RAM implements FIFO elastic buffers between clock domains. Designers should place each voltage-standard domain on its own VCCIBx bank and add per-ball decoupling to protect signal integrity on high-toggle-rate buses.
추천
Aerospace and Defense Subsystems
Flash FPGAs are preferred in defense electronics because configuration data is nonvolatile and resident on-chip, eliminating bitstream-fetch vulnerabilities and external PROM components that complicate conformal-coated or sealed assemblies. The A3P600-2FGG256 provides 600K system gates for sensor-interface preprocessing, bus bridging (e.g., discrete-to-digital adapters), and payload housekeeping logic, with 177 I/Os supporting dense connector pinouts in a compact 256-ball FBGA. Instant-on behavior means telemetry and health-monitoring logic run from the first milliseconds of power, and the industrial-temperature sibling A3P600-2FGG256I extends the thermal envelope for harsh environments on the identical footprint. Note the base FG part is commercial-graded; for extended range specify the I variant, which is a true pin-to-pin drop-in.
추천
Test and Measurement Instrumentation
Bench and automated-test instruments rely on FPGAs for precise, parallel timestamping and stimulus generation, and the A3P600-2FGG256 supplies 600K gates of deterministic fabric clocked toward the 310 MHz class achievable with the -2 speed grade. Its 177 I/Os capture multi-channel digital probes or drive pattern generators, while the 110592-bit embedded RAM implements capture buffers and pattern memories without external SRAM, reducing bill-of-material complexity. Because the design configures from internal flash, an instrument powers to a functional state immediately - important for instruments that must respond to trigger events shortly after power application. Designers should bank the I/O by voltage standard, add local decoupling at every supply ball, and verify worst-case timing closure in Libero at the -2 corner.
추천
Embedded Sensing and IoT Gateways
Edge gateways aggregate many sensor channels and need flexible glue logic between radios, sensors, and the host processor; the A3P600-2FGG256 serves this with four I/O banks that accommodate mixed-voltage sensor interfaces, 177 I/Os for parallel sensor buses, and 600K gates for preprocessing such as filtering, debouncing, and protocol conversion. The 1.5V core process keeps dynamic power moderate for always-on nodes, and the nonvolatile flash configuration means the gateway logic is live before the host MCU boots, enabling early fault capture. Embedded RAM (110592 bits) implements small FIFOs between bursty sensor traffic and slower host reads. When industrial temperature is required, the pin-compatible A3P600-2FGG256I replaces it without any board change.
추천
Legacy FPGA Redesign and Obsolescence Bridge
Many programs migrating from discontinued Actel ProASIC or Axcelerator devices land on ProASIC3 because the flash architecture, Libero toolchain concepts, and instant-on behavior carry over, and the A3P600-2FGG256 is the mid-density landing point at 600K gates. The 256-ball FBGA footprint family within ProASIC3 (FG/FGG codes, -1/-2 speed grades) lets one PCB serve multiple speed and temperature variants, protecting supply continuity: a board laid out for A3P600-2FGG256 accepts A3P600-1FGG256 or the industrial A3P600-2FGG256I as drop-ins. Follow the Microchip migration application note for bank-routed VCCIBx planning, since A3P600 and A3P1000 both use four I/O banks, easing later density upgrades with modest layout changes.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P600-2FGG256 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600-2FGG256I | A3P600-1FGG256 | A3P600-2FG256 |
|---|---|---|---|---|
| Package | 256-FBGA (FGG) | 256-FBGA - same | 256-FBGA - same | 256-FBGA (FG code) - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K |
| User I/O | 177 | 177 | 177 | 177 |
| Embedded RAM (bits) | 110592 | 110592 | 110592 | 110592 |
| Speed Grade | -2 (up to 310 MHz class) | -2 | -1 (slower worst-case timing) | -2 |
| Configuration | On-chip flash, single chip | On-chip flash | On-chip flash | On-chip flash |
주요 차별점
- Industrial temperature availability on identical footprint (vs A3P600-2FGG256I)
- Faster worst-case timing than the -1 grade (vs A3P600-1FGG256)
- Lead-free green package code (vs A3P600-2FG256)
설계 노트
Estimated: budget core power from the 1.5V rail and I/O power per VCCIBx bank as P = C * V^2 * f * toggle-rate summed per bank. ProASIC3 devices have four I/O banks (A3P600/A3P1000/A3P400 per Microchip migration note), and each bank has dedicated VCCIBx supplies, so a single bank driving many high-toggle outputs can dominate the power budget. Use Microchip's power calculator in Libero SoC with your post-fit netlist rather than rule-of-thumb numbers, and provision bulk plus per-ball ceramic decoupling on every VCC and VCCIBx ball.
A 256-ball FBGA at 1.0mm pitch requires via-in-pad or dog-bone escape routing; plan layer count early. Assign I/O standards so that electrically compatible standards share one bank - only compatible standards may be placed on the same VCCIBx bank, per the Microchip migration application note. Reserve balls for JTAG programming and boundary-scan test access, and keep the flash-FPGA's instant-on nature in mind: ensure upstream supplies are sequenced or the FPGA I/Os may drive before peripherals are powered.
Do not confuse FG and FGG package codes: both are 256-ball FBGA footprints, but FGG denotes the lead-free/green variant, and mixing them on one BOM line can cause compliance or soldering-profile mismatches. Also, the -1 speed grade is not a free cost-down: re-run timing closure in Libero at the -1 corner before switching from A3P600-2FGG256. Finally, commercial-grade parts must not be qualified by substitution into industrial sockets; use the pin-compatible A3P600-2FGG256I instead.
규정 준수 정보
The FGG package code conventionally denotes Microchip/Microsemi lead-free (green) packaging, but explicit RoHS/REACH statements were not present in the verified web data; confirm on the Microchip product page before BOM sign-off.
