EP20K600CF672C8N vs EP20K600CF672I8 비교
다음의 상세 나란히 비교: EP20K600CF672C8N 제조: Intel 및 EP20K600CF672I8 제조: Altera. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP20K600CF672C8N | EP20K600CF672I8 |
|---|---|---|
| 브랜드 | Intel | Altera |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $108.00 | $195.00 |
| Device Type | SPLD | SPLD / FPGA |
| Product Type | FPGA / programmable logic device | — |
| Family | APEX 20KC | APEX 20KC |
| Nominal Gate Capacity | 600K gates | — |
| Logic Elements or Cells | 24,320 | — |
| Macros | 2,432 | — |
| User I/O Count | 508 | — |
| Package Terminals | 652 pins | — |
| 패키지 | BGA-652, 45 x 45 mm, 1.27 mm pitch | — |
| Package Description | 672-pin FC-FBGA | — |
| 공급 전압 | 1.8 V | — |
| Listed Frequency | 301.21 MHz | — |
| Propagation Delay | 1.48 ns | — |
| Fabrication Process | 0.15 µm | — |
| 동작 온도 | 0°C to 85°C | 0 °C to +85 °C (Industrial) |
| Interconnect Metal | All-layer copper metal | — |
| I/O Configuration | 508 user I/O | — |
| 실장 유형 | Surface mount | Surface Mount |
| RoHS 상태 | unknown | Compliant per legacy product records |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration memory and programming method] | — |
| Core Current | [DATA_NEEDED: core supply current] | — |
| I/O Bank Voltage | [DATA_NEEDED: supported I/O voltage range] | — |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| 열 저항 | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| Logic Elements / Cells | — | 24,320 |
| Macros (Logic Cells) | — | 2432 |
| Typical Gate Count | — | 600,000 gates |
| Embedded Memory | — | 311,296 bits |
| User I/Os | — | 488 to 508 |
| 핀 수 | — | 652 (functional) / 672 (BGA balls) |
| Propagation Delay (typical) | — | 1.48 ns |
| Internal Frequency (max) | — | [DATA_NEEDED: max internal frequency in MHz] |
| Core Supply Voltage | — | 1.8 V |
| Process Technology | — | 0.15 µm all-layer copper |
| Package Type | — | 672-ball BGA, 45 x 45 mm, 1.27 mm pitch |
| Configuration Interface | — | JTAG / Passive Serial |
| Design Tool | — | Quartus II (legacy MAX+PLUS II) |