EP2AGX260FF35C5G vs EP2AGZ300FF35C3G 비교

다음의 상세 나란히 비교: EP2AGX260FF35C5G 제조: Intel 및 EP2AGZ300FF35C3G 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

사양 비교

파라미터 EP2AGX260FF35C5G EP2AGZ300FF35C3G
브랜드 Intel Intel
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 NRND 활성
재고 상태 In Stock In Stock
단가 (USD) $1,395.00 $1,395.00
Series Arria II GX Arria II GZ
Family Arria II GX (EP2AGX260) —
Logic Elements 244,188 300,000
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] 119,088
Embedded Memory (bits) 12,038,144 —
DSP Blocks [DATA_NEEDED: DSP block count] 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes
Maximum User I/O 612 —
Number of Transceivers [DATA_NEEDED: transceiver count] —
Transceiver Data Rate Up to 6.375 Gbps —
패키지 1152-ball FCBGA (FF35) FCBGA-1152 (35 mm)
Package Code BBGA / HBGA —
실장 유형 Surface Mount (BGA) —
Speed Grade C5 (mid-speed) 3 (mid-performance)
Temperature Grade Commercial (0C to +85C) Commercial (0 C to 85 C junction)
공급 전압 [DATA_NEEDED: core/rail voltages] —
Lead-Free / RoHS RoHS compliant (G suffix) —
Process Node 40 nm —
Embedded Memory — 17,133 Kbit
Transceivers — 16 channels, up to 6.375 Gbps
Hard PCIe Controllers — Up to 12 (Gen2 endpoint/root-port)
User I/Os — 1,288
I/O Banks — 12
Process Technology — 40 nm TSMC
Package Family — BGA (Flip-Chip)
Configuration Method — Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel
Hard Memory Controller — DDR3 up to 800 MHz, DDR2, QDR II+
RoHS 상태 — Compliant

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