EPF10K100EFC484-3N vs EPF10K130EFC484-3N 비교
다음의 상세 나란히 비교: EPF10K100EFC484-3N 제조: Intel 및 EPF10K130EFC484-3N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EPF10K100EFC484-3N | EPF10K130EFC484-3N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Obsolete | NRND |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $142.00 | $109.25 |
| Family | FLEX 10KE | — |
| Logic Elements / Cells | 4992 | — |
| Total Gates | 100,000 | — |
| Embedded Memory (EAB) | 49,152 bits (12 EABs) | — |
| Logic Array Blocks (LABs) | 624 | — |
| User I/Os | 338 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Core Voltage (VCCINT) | 2.5 V | — |
| I/O Voltage (VCCIO) | MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank) | — |
| Internal Performance | 200 MHz | — |
| Speed Grade | -3 (fastest commercial bin) | -3 (faster timing bin) |
| 패키지 | 484-ball FineLine BGA (FC484 / FBGA-484) | — |
| Temperature Grade | Commercial (0 °C to +70 °C) | — |
| Configuration Method | SRAM (external EPROM/Flash/JTAG required at power-up) | — |
| Lead-Free / RoHS | Yes (N suffix = lead-free) | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| Series | — | FLEX-10KE |
| Number of Logic Elements / Cells | — | 6656 |
| Total RAM Bits | — | 65536 |
| Typical Gate Count | — | 130000 |
| Number of I/O | — | 369 |
| Number of LABs/CLBs | — | 832 |
| Number of Embedded Array Blocks (EABs) | — | 72 |
| Operating Temperature Grade | — | Commercial (0C to +70C) |
| Core Voltage | — | 2.5 V |
| Package Type | — | 484-BBGA (FineLine BGA) |
| Package Dimensions | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |
| RoHS 상태 | — | [DATA_NEEDED: RoHS status] |
| Configuration Interface | — | JTAG / PS / PPS / Altera serial |