EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel
부품 번호: EPF10K200SBC356-1X ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $195 | $19,500.00 |
| 500 | $162 | $81,000.00 |
| 1,000 | $138 | $138,000.00 |
EPF10K200SBC356-1X 개요
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines a matrix of configurable logic blocks (CLBs/LEs), programmable routing, and I/O cells on a single die. In the system hierarchy, FPGAs sit between discrete logic ICs (gates, muxes) and ASICs: more flexible than ASICs, faster and more deterministic than microcontrollers for parallel DSP and high-speed I/O tasks. The FLEX 10KE family is the SRAM-based, Look-Up-Table (LUT)-based predecessor to the Cyclone series, designed for glue logic, bus interfacing, and DSP pre/post-processing on 0.22 µm process technology.
Key features of the EPF10K200SBC356-1X include 39,616 total RAM bits distributed across 12 EABs of 2,048 bits each, a JTAG-compliant IEEE 1149.1 boundary-scan interface for in-system programming and board test, multi-volt I/O compatibility (1.8 V/2.5 V/3.3 V/5.0 V), and dedicated clock management with FastTrack interconnect. The -1X suffix denotes the speed grade -1 (fastest commercial bin) and lead-free / RoHS-compliant packaging, distinguishing it from the non-X variant. The -1X suffix does not alter logic resources versus the -1 grade but confirms RoHS compliance per the manufacturer's ordering code convention.
Architecturally, the FLEX 10KE device uses a four-input LUT per LE, an EAB-based memory block (2 Kbit each, configurable as 256x8, 512x4, 1024x2, or 2048x1), and Altera's FastTrack continuous routing fabric. The LBGA-356 footprint delivers 274 usable I/O pins (the package has 356 balls; the remainder are power/ground/no-connect), and the 35 x 35 mm BGA with 1.27 mm pitch is the largest in the family, maximizing pin escape room for high-I/O designs. Power is delivered through dedicated VCCINT (2.5 V) and VCCIO banks for I/O voltage selection.
Typical applications include high-volume telecommunications line cards, industrial motor control and machine vision front-ends, military/aerospace signal processing boards where the FLEX 10KE remains a long-lifecycle legacy choice, and prototyping platforms migrating toward Cyclone or MAX series devices. It is also used in legacy replacement scenarios where the original design was built around the FLEX 10KE pinout and SameFrame migration paths within the family are required. Designers transitioning new designs should consider Cyclone II or Cyclone III as modern alternatives, but the EPF10K200SBC356-1X remains a stocked, supported part for production lines.
Designers should allocate a robust 2.5 V regulator (e.g., a 1 A LDO) for VCCINT and ensure VCCIO banks are properly decoupled (0.1 µF + 10 µF per bank). JTAG pinout (TCK, TMS, TDI, TDO, nSTATUS, CONF_DONE) must be brought to a header for ByteBlaster or MasterBlaster programming. Because this part is a legacy 0.22 µm device, unused I/Os should be left floating or pulled per Quartus II design guidelines; leaving them at defined logic levels avoids in-rush current during configuration.
This page consolidates distributor stock levels, parametric alternatives in the same LBGA-356 footprint, and engineering design notes that extend beyond the manufacturer datasheet, providing a single reference for sourcing, replacement, and integration decisions on the EPF10K200SBC356-1X.
드롭인 대체품: EPF10K200SBC356-1X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K200SBC356-1X (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Process Technology, Operating Temperature, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K200SBC356-1
✅ 드롭인✓ 재고 있음
$580 / 개
데이터시트 보기 →EPF10K200SBC356-2X
✅ 드롭인✓ 재고 있음
$295 / 개
데이터시트 보기 →EPF10K200SBC356-2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$178 / 개
데이터시트 보기 →EPF10K200SBC356-1X 최대 정격 & 전기적 특성
| Family | FLEX 10KE |
| Series | FLEX-10KS |
| Typical System Gates | 200,000 |
| Maximum System Gates | 513,000 |
| Logic Elements (LEs) | 9,984 |
| Logic Array Blocks (LABs) | 1,248 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 39,616 |
| User I/Os | 274 |
| Process Technology | 0.22 µm CMOS |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) |
| 패키지 | 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch |
| Operating Temperature Grade | Commercial |
| Speed Grade | -1 (fastest commercial bin) |
| 실장 유형 | Surface Mount (BGA) |
| JTAG Support | IEEE Std. 1149.1 boundary scan + ISP |
| Lead Free / RoHS | Yes (per -1X suffix) |
| Configuration Mode | SRAM-based, ISP via JTAG |
EPF10K200SBC356-1X 핀 구성
| 핀 A1 | I/O — User I/O (bank 1) |
| 핀 A2 | I/O — User I/O (bank 1) |
| 핀 A3 | VCCIO1 — I/O bank 1 voltage supply |
| 핀 A4 | I/O — User I/O (bank 1) |
| 핀 A5 | I/O — User I/O (bank 1) |
| 핀 B1 | GND — Ground |
| 핀 B2 | I/O — User I/O (bank 1) |
| 핀 B3 | I/O — User I/O (bank 1) |
| 핀 B4 | GND — Ground |
| 핀 B5 | I/O — User I/O (bank 1) |
| 핀 C1 | I/O — User I/O (bank 1) |
| 핀 C2 | I/O — User I/O (bank 1) |
| 핀 C3 | VCCINT — Core supply 2.5 V |
| 핀 C4 | I/O — User I/O (bank 1) |
| 핀 C5 | I/O — User I/O (bank 1) |
| 핀 D1 | GND — Ground |
| 핀 D2 | I/O — User I/O (bank 1) |
| 핀 D3 | I/O — User I/O (bank 1) |
| 핀 D4 | GND — Ground |
| 핀 D5 | TDI — JTAG test data in |
| 핀 E1 | I/O — User I/O (bank 1) |
| 핀 E2 | TCK — JTAG test clock |
| 핀 E3 | TMS — JTAG test mode select |
| 핀 E4 | I/O — User I/O (bank 1) |
| 핀 E5 | TDO — JTAG test data out |
| 핀 F1 | nSTATUS — Configuration status |
| 핀 F2 | nCONFIG — Configuration control (active low) |
| 핀 F3 | CONF_DONE — Configuration complete |
| 핀 F4 | MSEL0 — Configuration mode select 0 |
| 핀 F5 | MSEL1 — Configuration mode select 1 |
| 핀 G1 | VCCIO2 — I/O bank 2 voltage supply |
| 핀 G2 | I/O — User I/O (bank 2) |
| 핀 G3 | GND — Ground |
| 핀 G4 | I/O — User I/O (bank 2) |
| 핀 G5 | VCCINT — Core supply 2.5 V |
| 핀 H1 | I/O — User I/O (bank 2) |
| 핀 H2 | I/O — User I/O (bank 2) |
| 핀 H3 | I/O — User I/O (bank 2) |
| 핀 H4 | I/O — User I/O (bank 2) |
| 핀 H5 | I/O — User I/O (bank 2) |
| 핀 J1 | GND — Ground |
| 핀 J2 | I/O — User I/O (bank 2) |
| 핀 J3 | I/O — User I/O (bank 2) |
| 핀 J4 | GND — Ground |
| 핀 J5 | I/O — User I/O (bank 2) |
일반적인 애플리케이션
EPF10K200SBC356-1X 적합 용도: 6 애플리케이션s: Legacy Telecom Line Card Interface Logic, Industrial Motor Control and Drive Signal Processing, Military / Aerospace Legacy Avionics, Machine Vision Frame Grabbers and Pre-Processors, Prototyping and SameFrame Migration Platform, Test and Measurement Instrumentation Backplanes.
Legacy Telecom Line Card Interface Logic
The EPF10K200SBC356-1X is well suited to legacy telecom line-card designs that require high I/O count (274 user I/Os) and substantial glue-logic capacity. Its multi-volt I/O banks (1.8 V to 5.0 V) allow direct interface to E1/T1 framers, TDM backplanes, and 5 V CPLDs without external level shifters, while the 9,984 LEs and 12 EABs provide enough fabric for HDLC controllers, ATM segmentation, and small packet buffers.
추천
Industrial Motor Control and Drive Signal Processing
In industrial motor-drive front-ends, the EPF10K200SBC356-1X provides 200K gates of deterministic parallel logic for PWM generation, encoder decoding (incremental, SSI, EnDat), and field-oriented control math. The 12 EABs deliver 39,616 bits of on-chip RAM for lookup tables (sine, Park/Clarke transforms), and the JTAG 1149.1 boundary scan allows in-system firmware updates on installed drives without removing the board.
추천
Military / Aerospace Legacy Avionics
The FLEX 10KE family has decades of in-service history in military and avionics systems where long-lifecycle parts are mandatory. The EPF10K200SBC356-1X's commercial temperature grade is acceptable for cabin and ground systems; for harsh-environment boards designers should pair it with ruggedized PCB substrates and derate power per MIL-STD-810. Distributor stock of 4,013+ pieces supports ongoing maintenance, repair, and overhaul pipelines for legacy platforms.
추천
Machine Vision Frame Grabbers and Pre-Processors
The EPF10K200SBC356-1X works well as a pre-processor for parallel image sensors (Camera Link, LVDS, parallel CMOS), where 274 I/Os can absorb wide data buses (32-bit parallel, plus control and timing). The 1,248 LABs and 9,984 LEs provide enough capacity for Bayer-to-RGB conversion, Sobel edge detection, or simple thresholding, and the 12 EABs act as line buffers for image rows before DMA into a downstream processor.
추천
Prototyping and SameFrame Migration Platform
Engineers often use the EPF10K200SBC356-1X as a prototyping platform with a planned SameFrame migration to higher-density FLEX 10KE parts in the 484-pin FineLine BGA package. The shared JTAG, configuration, and pinout conventions across the family allow IP reuse and Quartus II recompilation, while the LBGA-356 footprint offers maximum pin escape room for prototype board layouts before migrating to the larger BGA-484 production footprint.
추천
Test and Measurement Instrumentation Backplanes
The EPF10K200SBC356-1X's 274 I/Os and multi-volt I/O banks make it suitable for test-and-measurement backplanes that aggregate multiple instrument channels (scope, DMM, function generator) into a single PXI or VXI bus. The 39,616 bits of EAB RAM provide buffer space for sample data, while the -1 speed grade supports the fast trigger logic required by digitizer front-ends. JTAG boundary scan enables ATE-driven interconnect tests during board bring-up.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K200SBC356-1X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K200SBC356-1 | EPF10K200SBC356-2X | EPF10K200SBC356-2 |
|---|---|---|---|---|
| Package | 356-LBGA (BGA-356) 35x35 mm | 356-LBGA (BGA-356) 35x35 mm - same | 356-LBGA (BGA-356) 35x35 mm - same | 356-LBGA (BGA-356) 35x35 mm - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Speed Grade | -1 (fastest commercial) | -1 (fastest commercial) | -2 (slower) | -2 (slower) |
| RoHS Compliance | Yes (-X suffix) | No (non-X suffix) | Yes (-X suffix) | No (non-X suffix) |
| Logic Elements | 9,984 LEs | 9,984 LEs | 9,984 LEs | 9,984 LEs |
| User I/Os | 274 I/Os | 274 I/Os | 274 I/Os | 274 I/Os |
| Typical System Gates | 200,000 | 200,000 | 200,000 | 200,000 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Last-time-buy (RoHS) | Last-time-buy (non-RoHS) | Last-time-buy (RoHS) | Last-time-buy (non-RoHS) |
| Relative Fmax | 100% (-1 grade baseline) | 100% (-1 grade baseline) | ~80-85% (slower -2 grade) | ~80-85% (slower -2 grade) |
주요 차별점
- RoHS-compliant lead-free variant of the FLEX 10KE flagship (vs EPF10K200SBC356-1)
- Faster Fmax than the -2X drop-in alternative (vs EPF10K200SBC356-2X)
- Highest pin-count FLEX 10KE in a SameFrame migration path (vs EPF10K200EGC599-3)
설계 노트
The EPF10K200SBC356-1X requires a dedicated 2.5 V regulator on VCCINT capable of supplying 500 mA to 1 A under full utilization, plus independent VCCIO regulators for each I/O bank (1.8 V / 2.5 V / 3.3 V / 5.0 V). Decouple each VCCINT and VCCIO pin with a 0.1 µF X7R ceramic placed within 3 mm of the BGA ball, and add 10 µF bulk capacitors at every fourth power pin. Estimating with VCCINT=2.5 V at Icc=800 mA yields a 2 W core budget, plus dynamic I/O power that scales with toggle frequency and bank voltage. Plan board-level thermal dissipation accordingly: at full utilization, the 35 x 35 mm LBGA typically requires at least 4 inner ground planes stitched with thermal vias to keep junction below 85 °C in commercial applications.
The 356-ball LBGA uses 1.27 mm ball pitch with a 35 x 35 mm footprint, requiring a 4-layer or 6-layer PCB with continuous VCC and GND planes beneath the BGA. Escape routing on the top layer should use 0.1 mm (4 mil) traces and 0.1 mm spaces between balls; deeper fan-out requires via-in-pad or microvia stackups on the inner layers. Place 0.1 µF decoupling caps on the bottom side directly beneath the BGA footprint, and stitch the GND perimeter with a via fence every 2.5 mm to suppress BGA cavity resonances. For JTAG access, route TCK, TMS, TDI, TDO, nSTATUS, and CONF_DONE to a 0.1 inch header so ByteBlasterMV or USB-Blaster can attach for in-system programming.
The EPF10K200SBC356-1X is SRAM-based, meaning configuration data is lost on power-down and must be reloaded at every startup via JTAG, Altera EPC configuration device, or microcontroller-driven passive serial mode. Leave nCONFIG with a 1 kΩ pull-up to VCCIO and a 1 nF cap to GND to ensure a clean reset at power-up; CONF_DONE also needs a 1 kΩ pull-up. For board test, IEEE 1149.1 boundary-scan is supported and can be used to test interconnect on assembled boards without removing the FPGA - define BSDL files in your ATE flow to leverage this. Configuration time at the fastest passive serial mode is typically < 50 ms for full bitstream loading.
Do not apply 5 V to any VCCIO bank while VCCINT is below 2.0 V during power sequencing - this stresses the I/O ESD structures. Use a power-sequencer or ensure VCCINT ramps first. Unused I/O pins should be set to 'input tristate' in the Quartus II assignment rather than left floating, to avoid in-rush current during configuration. Avoid mixing 1.8 V and 5 V signals in the same VCCIO bank - bank voltages are shared across all I/O in a bank, and violating the absolute maximum differential will back-drive the lower-voltage pins.
Estimated thermal dissipation at full 200K-gate utilization with 60% toggle rate at 50 MHz: P_CORE ≈ 1.5 W (VCCINT) and P_IO ≈ 0.6 W across banks, for a 2.1 W total. On a 4-layer JEDEC-standard test board the LBGA-356 typically shows theta-JA of 18-22 °C/W, giving a 38-46 °C junction rise above ambient - well within the 125 °C maximum but leaving limited margin for elevated ambient environments. For industrial or sealed enclosures, derate by 25% or attach a small heatsink over the BGA top side (the LBGA has no exposed die paddle).
규정 준수 정보
Lead-free / RoHS compliance indicated by -X suffix in the ordering code per Altera/Intel convention. AEC-Q100 not applicable (FPGA not qualified to automotive grade). REACH compliance assumed based on legacy Altera parts but not explicitly stated in the verified data; halogen-free status not in the data.
