G9S12GN32F1VLCR vs MC9S08LH36CLK 비교
다음의 상세 나란히 비교: G9S12GN32F1VLCR 제조: NXP Semiconductors 및 MC9S08LH36CLK 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
G9S12GN32F1VLCR - 16-bit S12G MCU, 32KB Flash, CAN/LIN | NXP
G9S12GN32F1VLCR ✓ 활성사양 비교
| 파라미터 | G9S12GN32F1VLCR | MC9S08LH36CLK |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $3.61 | $0.00 |
| Core | S12 (HCS12, 16-bit CISC) | — |
| Program Flash | 32 KB | — |
| SRAM | 2 KB | — |
| Bus Frequency (max) | 25 MHz | — |
| CAN Controller | 1 x CAN 2.0A/B | — |
| LIN / SAE J2602 | Yes (via SCI + external transceiver) | — |
| ADC | 10-bit, 8 channels [DATA_NEEDED: channel count confirmation] | — |
| PWM Channels | Multi-channel 16-bit [DATA_NEEDED: exact channel count] | — |
| Enhanced Capture Timer (ECT) | Yes | — |
| 패키지 | LQFP-32 | 80-LQFP (14 x 14 mm) |
| 실장 유형 | Surface Mount | Surface Mount |
| 동작 온도 | -40 C to +105 C (VLC suffix, automotive grade) [DATA_NEEDED: confirmation of grade letter] | — |
| 습도 민감도 레벨 (MSL) | 3 | — |
| Peak Reflow Temperature | 260 °C | — |
| Maximum Time at Peak Reflow | 40 s | — |
| Terminal Finish | Tin (Sn), matte | — |
| JEDEC J-STD-609 Code | e3 | — |
| Lead-Free | Yes (e3 Sn finish) | — |
| RoHS 상태 | Compliant | RoHS Compliant |
| Security | Flash security lockout supported [DATA_NEEDED: full feature list] | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency (per distributor listing) | — | 16 MHz |
| Flash Memory | — | 36 KB (36K x 8) |
| Supply Voltage Range | — | 2.1 V to 3.6 V |
| Number of I/O | — | 37 |
| Program Memory Type | — | FLASH |
| Operating Voltage at Reduced Speed | — | 2.1 V (up to 20 MHz, per family datasheet) |
| Lifecycle Stage | — | ACTIVE (per parametric source) |
| Temperature Range | — | [DATA_NEEDED: operating temperature range] |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| Peripherals | — | [DATA_NEEDED: peripheral set detail] |
| Package Body Dimensions | — | 14 mm x 14 mm |