IRFS3306PBF vs IRFB3306PBF 비교
다음의 상세 나란히 비교: IRFS3306PBF 제조: Infineon 및 IRFB3306PBF 제조: Infineon. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | IRFS3306PBF | IRFB3306PBF |
|---|---|---|
| 브랜드 | Infineon | Infineon |
| 카테고리 | MOSFETs | MOSFETs |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1.28 | $1.05 |
| FET Type | N-Channel | N-Channel |
| Technology | HEXFET (IR MOSFET) | IR HEXFET (MOSFET) |
| Drain-to-Source Voltage (VDS) | 60 V | — |
| Continuous Drain Current (ID, Tc) | 120 A (package limited) | — |
| Continuous Drain Current (ID, silicon limited) | 160 A | — |
| Gate-to-Source Voltage (VGS) | [DATA_NEEDED: VGS max rating] | — |
| Gate Threshold Voltage (VGS(th)) | [DATA_NEEDED: typical VGS(th)] | — |
| On-Resistance RDS(on) max @ VGS=10V | 4.2 mOhm | — |
| On-Resistance RDS(on) typ @ VGS=10V | 3.3 mOhm | — |
| Total Gate Charge (Qg) typ | 85 nC | [DATA_NEEDED: total gate charge Qg] |
| Gate-to-Drain Charge (Qgd) typ | [DATA_NEEDED: Qgd nominal value] | — |
| Power Dissipation (Pd) max @ Tc=25C | 230 W | — |
| 동작 접합 온도 | -55C to +175C | -55°C to +175°C |
| 패키지 | D2PAK (TO-263AB) surface mount | TO-220AB (through-hole) |
| 실장 유형 | Surface Mount | Through Hole |
| MSL 레벨 | 1 (per JEDEC J-STD-020) | — |
| Lead-Free / RoHS | PbF (lead-free), RoHS compliant | — |
| Drain-Source Voltage (Vdss) | — | 60 V |
| Continuous Drain Current (Id) at Tc=25°C | — | 120 A |
| Pulsed Drain Current (Idm) | — | [DATA_NEEDED: pulsed drain current] |
| Gate-Source Voltage (Vgs) max | — | ±20 V |
| Rds(on) max @ Vgs=10V | — | 4.2 mΩ |
| Gate Threshold Voltage (Vgs(th)) | — | [DATA_NEEDED: Vgs(th) typical value] |
| Gate-Drain Charge (Qgd) typ | — | 26 nC (nominal) |
| Power Dissipation (Pd) at Tc=25°C | — | 230 W |
| RoHS / Lead-Free (PbF) | — | Yes (PbF suffix indicates lead-free, RoHS compliant) |
| Avalanche Rated | — | Yes |
| Body Diode | — | Intrinsic (avalanche-rated) |