K3LK4L40DM-BGCT vs MT40A256M16GE-075E:B 비교
다음의 상세 나란히 비교: K3LK4L40DM-BGCT 제조: Samsung Electronics 및 MT40A256M16GE-075E:B 제조: Micron Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Samsung Electronics
K3LK4L40DM-BGCT - Samsung DRAM Memory IC | Samsung Electronics
K3LK4L40DM-BGCT ✓ 활성Micron Technology
MT40A256M16GE-075E:B - 4Gb DDR4 SDRAM 2666 MT/s | Micron
MT40A256M16GE-075E:B ✓ 활성사양 비교
| 파라미터 | K3LK4L40DM-BGCT | MT40A256M16GE-075E:B |
|---|---|---|
| 브랜드 | Samsung Electronics | Micron Technology |
| 카테고리 | DRAM | Memory ICs |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $40.50 | $3.95 |
| 메모리 유형 | DRAM (SDRAM component) | DDR4 SDRAM |
| Manufacturer | Samsung Electronics | — |
| Density | [DATA_NEEDED: Density] | — |
| Organization (x-width) | [DATA_NEEDED: Organization] | — |
| 데이터 속도 | [DATA_NEEDED: Data Rate] | 2666 MT/s (DDR4-2666) |
| Supply Voltage Class | [DATA_NEEDED: Supply Voltage] | — |
| CAS 레이턴시 | [DATA_NEEDED: CAS Latency] | — |
| Package Type | BGA (per -BGC ordering-code suffix) | — |
| Package Ball Count | [DATA_NEEDED: Ball Count] | — |
| 실장 유형 | Surface Mount | Surface Mount |
| 동작 온도 | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: operating temperature range for standard grade] |
| Refresh Rate | [DATA_NEEDED: Refresh Interval] | — |
| RoHS 상태 | [DATA_NEEDED: RoHS Status] | — |
| Lead Free | [DATA_NEEDED: Lead-Free Status] | — |
| MSL 레벨 | [DATA_NEEDED: Moisture Sensitivity Level] | — |
| Packaging | Tape & Reel (per -T-style suffix convention) [DATA_NEEDED: confirmed packaging] | — |
| 메모리 크기 | — | 4 Gbit |
| 메모리 구성 | — | 256M x 16 |
| Memory Interface | — | Parallel |
| Clock Frequency | — | 1.33 GHz |
| VDD / VDDQ | — | 1.2 V +/-60 mV |
| VPP | — | 2.5 V, -125 mV/+250 mV |
| Internal Banks | — | 16 |
| Refresh | — | 64 ms / 8192-cycle; 32 ms / 8192-cycle at 95C |
| I/O Type | — | 1.2 V pseudo open-drain |
| VREFDQ | — | On-die, internal, adjustable generation |
| Special Features | — | Temperature controlled refresh (TCR) |
| 패키지 | — | 96-FBGA (9 x 14 mm) |
| Access Time | — | [DATA_NEEDED: CAS latency / access time] |