MC9S12DT256CMPV vs MC9S12DG256CCPV 비교

다음의 상세 나란히 비교: MC9S12DT256CMPV 제조: NXP Semiconductors 및 MC9S12DG256CCPV 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S12DT256CMPV MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP

MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP

MC9S12DT256CMPV ✓ 활성
NXP Semiconductors
MC9S12DG256CCPV MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DG256CCPV Nrnd

사양 비교

파라미터 MC9S12DT256CMPV MC9S12DG256CCPV
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 활성 NRND
재고 상태 In Stock In Stock
단가 (USD) $11.50 $18.20
Core Architecture HCS12 (S12) 16-bit CISC —
Bus Frequency Up to 50 MHz —
Program Flash 256 KB —
RAM 12 KB —
EEPROM 4 KB —
패키지 LQFP-112 —
핀 수 112 —
Operating Voltage 5.0 V (4.5 V to 5.5 V) —
Temperature Grade Automotive (-40C to +125C) —
ADC 2 x 8-channel 10-bit 8-channel, 10-bit
PWM Channels 8 channels 8 channels
Enhanced Capture Timer 8-channel (ECT) —
SCI (UART) Interfaces 2 —
SPI Interfaces 2 —
CAN Modules 1 x msCAN (CAN 2.0A/B) —
GPIO (Approx.) 20 discrete digital I/O lines —
Debug Interface Background Debug Mode (BDM) —
실장 유형 Surface Mount (LQFP, gull-wing) Surface Mount
RoHS 상태 Compliant (per NXP product page) Compliant
Core — HCS12 (16-bit CISC)
Maximum CPU/Bus Frequency — 25 MHz
Program Memory (Flash) — 256 KB (256K x 8)
RAM Size — 12 KB
EEPROM Size — 4 KB
Number of I/O Lines — 91
Supply Voltage Range — 2.97 V to 5.5 V (single 5 V supply)
동작 온도 범위 — -40 °C to +85 °C (industrial)
패키지 / 케이스 — 112-LQFP (20 x 20 mm)
Communication Interfaces — 2 x SCI, 2 x SPI, I2C, CAN 2.0
Timers — Enhanced Capture Timer (ECT) + watchdog
On-chip Debug — Background Debug Mode (BDM)
MSL 레벨 — 3 (168 hours, JEDEC J-STD-020)

데이터시트 & 자료

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