MC9S12DT256CMPV vs MC9S12DG256CCPV Comparaison
Comparaison détaillée côte à côte de MC9S12DT256CMPV par NXP Semiconductors et MC9S12DG256CCPV par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP
MC9S12DT256CMPV ✓ ActifNXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV NrndComparaison des spécifications
| Paramètre | MC9S12DT256CMPV | MC9S12DG256CCPV |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $11,50 | $18,20 |
| Core Architecture | HCS12 (S12) 16-bit CISC | — |
| Bus Frequency | Up to 50 MHz | — |
| Program Flash | 256 KB | — |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| Boîtier | LQFP-112 | — |
| Nombre de broches | 112 | — |
| Operating Voltage | 5.0 V (4.5 V to 5.5 V) | — |
| Temperature Grade | Automotive (-40C to +125C) | — |
| ADC | 2 x 8-channel 10-bit | 8-channel, 10-bit |
| PWM Channels | 8 channels | 8 channels |
| Enhanced Capture Timer | 8-channel (ECT) | — |
| SCI (UART) Interfaces | 2 | — |
| SPI Interfaces | 2 | — |
| CAN Modules | 1 x msCAN (CAN 2.0A/B) | — |
| GPIO (Approx.) | 20 discrete digital I/O lines | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Type de montage | Surface Mount (LQFP, gull-wing) | Surface Mount |
| Statut RoHS | Compliant (per NXP product page) | Compliant |
| Core | — | HCS12 (16-bit CISC) |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| RAM Size | — | 12 KB |
| EEPROM Size | — | 4 KB |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| Plage de température de fonctionnement | — | -40 °C to +85 °C (industrial) |
| Boîtier / Format | — | 112-LQFP (20 x 20 mm) |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| Timers | — | Enhanced Capture Timer (ECT) + watchdog |
| On-chip Debug | — | Background Debug Mode (BDM) |
| Niveau MSL | — | 3 (168 hours, JEDEC J-STD-020) |