MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112
부품 번호: MC9S12DT256CPVE ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $29.2 | $292.00 |
| 100 | $26.15 | $2,615.00 |
| 500 | $23.4 | $11,700.00 |
| 1,000 | $20.85 | $20,850.00 |
MC9S12DT256CPVE 개요
An HCS12 microcontroller is a member of the Freescale/NXP 16-bit MCU family built on the CPU12 core, combining a CISC instruction set with on-chip peripherals such as timers, ADC, PWM, and multiple serial interfaces. In the broader hierarchy, HCS12 sits between classic HC11/HC12 8-bit/16-bit microcontrollers and modern 32-bit ARM Cortex-M devices - the HCS12 family targets automotive multiplexing, body and chassis ECUs, and industrial control applications that need deterministic interrupt response and large on-chip memory. The DT256 sub-family is fully pin-compatible with the wider S12D family, letting designers scale memory and peripherals without re-laying out the PCB.
The MC9S12DT256CPVE integrates 2x SCI (UART), SPI, I2C, CAN, an 8-channel 10-bit ADC, an 8-channel enhanced capture timer, an 8-channel PWM, and 91 discrete digital I/O lines. Its supply voltage spans 2.35V to 2.75V core (with 5V-tolerant I/O typical of S12 designs). BDM (Background Debug Mode) and on-chip COP watchdog support automotive-grade development flows.
The device uses the HCS12 CPU12 core with a 25MHz bus, executing CISC instructions and supporting up to 4KB EEPROM and 256KB Flash for application code plus 12KB RAM for variables. The integrated CAN, SCI, and SPI controllers enable automotive multiplexing and industrial networking, while the 8-channel PWM and 10-bit ADC provide mixed-signal I/O for sensor and actuator interfaces.
Typical applications include automotive body controllers, CAN/J1939 nodes, HVAC modules, industrial PLCs, and 16-bit replacement of older HC11/HC12 designs. It is widely used where 5V I/O tolerance and deterministic CAN messaging are mandatory.
Designers should budget PCB space for the LQFP-112 footprint, use external decoupling on VDD/VSSX pairs, and follow NXP's EMC/ESD layout guidelines. The 'CPVE' suffix denotes the 112-pin LQFP commercial grade (0-70C) vs. MPVE -85C; verify temperature grade before layout.
This page synthesizes distributor pricing, drop-in pin-compatible S12 family alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: MC9S12DT256CPVE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S12DT256CPVE (동일 폼 팩터 및 풋프린트) — 차이점: ADC, PWM Channels, Operating Temperature, Package, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S12DT256MPVE
✅ 드롭인✓ 재고 있음
$14.36 / 개
데이터시트 보기 →MC9S12DJ256CPVE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S12DG256CPVE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S12DG256BVPV
✅ 드롭인✓ 재고 있음
$15.6 / 개
데이터시트 보기 →MC9S12DP512CPVE
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MC9S12DT128MPVE
✅ 드롭인✓ 재고 있음
$36.5 / 개
데이터시트 보기 →MC9S12DT256CPVE 최대 정격 & 전기적 특성
| Core Processor | HCS12 (CPU12 CISC) |
| Core Size | 16-bit |
| 최대 클록 주파수 | 25 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| RAM Size | 12 KB |
| EEPROM Size | 4 KB |
| 데이터 버스 폭 | 16-bit |
| 공급 전압 | 2.35 V to 2.75 V (core), 5 V I/O tolerant typical |
| Number of I/O Pins | 91 |
| ADC | 2x 8-channel, 10-bit |
| PWM Channels | 8 channels |
| Connectivity | CAN, I2C, SCI (UART), SPI |
| Timers | 8-channel Enhanced Capture Timer (ECT) |
| 패키지 | 112-pin LQFP (20x20 mm) |
| 동작 온도 | -40C to +85C (industrial, per 'P' suffix family) |
| 실장 유형 | Surface Mount |
| Debug Interface | BDM (Background Debug Mode) |
| Watchdog | COP (Computer Operating Properly) watchdog |
MC9S12DT256CPVE 112-pin lqfp (20x20 mm) 핀 구성 가이드
MC9S12DT256CPVE(112-pin lqfp (20x20 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC9S12DT256CPVE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC9S12DT256CPVE 적합 용도: 6 애플리케이션s: Automotive Body Control Module (BCM), CAN/J1939 Network Node, HVAC Climate Control Module, Industrial PLC / Sensor Hub, Instrument Cluster Driver, HC11/HC12 Legacy Replacement.
Automotive Body Control Module (BCM)
The MC9S12DT256CPVE is widely used in body control modules that manage lighting, central locking, wipers, and interior accessories. Its 256KB Flash comfortably holds BCM application code plus bootloader, while 12KB RAM supports CAN/J1939 stacks. The integrated CAN module plus 91 GPIO simplify connections to discrete relays, MOSFET drivers, and LIN slaves typical of BCM designs. Eight PWM channels drive LED dimming and motor speed control, and two 8-channel 10-bit ADCs read multiplexed switch and sensor inputs. The HCS12's deterministic interrupt latency makes it well suited for time-critical body functions where missed interrupts could leave a vehicle in an undefined state.
추천
CAN/J1939 Network Node
The MC9S12DT256CPVE's on-chip CAN 2.0A/B controller makes it a drop-in node controller for CAN and higher-layer J1939 networks in trucks, off-highway equipment, and industrial vehicles. Its 25MHz CPU12 core can manage a J1939 transport protocol stack alongside application code in the 256KB Flash. Multiple SCI and SPI ports allow the MCU to also drive a secondary LIN sub-network or interface external RF transceivers. The HCS12's COP watchdog and BDM debug simplify OEM end-of-line validation. For higher-load gateway nodes the pin-compatible MC9S12DP512CPVE offers the same CAN plus additional RAM for buffering transport-layer messages.
추천
HVAC Climate Control Module
HVAC modules in mid-size vehicles typically run closed-loop temperature control, blend/stepper motor actuation, and CAN communication with the BCM - all tasks that fit comfortably within the MC9S12DT256CPVE's feature set. The 8-channel PWM drives blower speed control in software, while two 8-channel 10-bit ADCs read NTC temperature sensors and potentiometer inputs. With 91 discrete I/O, the MCU can simultaneously drive multiple stepper motors, multiplex LEDs, and arbitrate CAN messages. The HCS12 timer system also supports precision PWM frequencies for variable-fan-speed control without CPU overhead.
추천
Industrial PLC / Sensor Hub
Industrial sensor hubs and small-format PLCs benefit from the MC9S12DT256CPVE's robust peripheral set and 5V-tolerant I/O. Its two ADCs handle analog sensor aggregation, the 8 PWM channels drive proportional valves or motor speed commands, and SCI plus SPI extend connectivity to remote I/O slices. The 256KB Flash holds ladder-logic interpreters or application-specific control firmware, while the 4KB EEPROM stores calibration and configuration data in non-volatile form. With 91 I/O pins the MCU consolidates what would otherwise require multiple 8-bit microcontrollers into a single chip, reducing BOM cost and PCB area.
추천
Instrument Cluster Driver
Simple instrument clusters that read speed, RPM, fuel level, and temperature can run on the MC9S12DT256CPVE, leveraging its dual 8-channel 10-bit ADCs to sample multiple analog sensors with minimal external circuitry. The 8 PWM channels drive gauge backlight dimming and indicator LEDs, while the integrated CAN module retrieves vehicle-speed and engine data from the powertrain bus. 12KB RAM holds display refresh buffers and CAN receive queues, and the 256KB Flash accommodates graphics rendering, gauge-sweep animation, and diagnostics routines. SPI interfaces with external stepper-motor drivers for needle actuation.
추천
HC11/HC12 Legacy Replacement
Designers maintaining existing HC11 or HC12 designs can migrate to the MC9S12DT256CPVE as a pin-compatible 16-bit upgrade path while retaining toolchain familiarity. The HCS12's instruction set is largely source-compatible with the older HC12, easing software port. The 256KB Flash dwarfs typical HC12 part sizes (typically 32-128KB), enabling modern feature additions on the same board. With on-chip CAN, dual ADC, and PWM, the DT256 brings peripherals HC11/HC12 designs previously required external chips to achieve, simplifying BOM while extending product life.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S12DT256CPVE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S12DT256MPVE | MC9S12DJ256CPVE | MC9S12DG256CPVE | MC9S12DG256BVPV | MC9S12DP512CPVE | MC9S12DT128MPVE |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20mm) | 112-LQFP (20x20mm) - same | 112-LQFP (20x20mm) - same | 112-LQFP (20x20mm) - same | 112-LQFP (20x20mm) - same | 112-LQFP (20x20mm) - same | 112-LQFP (20x20mm) - same |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB | 128 KB |
| RAM Size | 12 KB | 12 KB | 12 KB | 12 KB | 12 KB | 29 KB | 8 KB |
| EEPROM Size | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB |
| Maximum Clock Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Operating Temperature | 0C to +70C (CPVE commercial) | -40C to +125C (automotive) | 0C to +70C | 0C to +70C | -40C to +105C (industrial) | 0C to +70C | -40C to +125C (automotive) |
| CAN Module | Yes (msCAN, CAN 2.0A/B) | Yes | Yes (with J1850) | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Pin-compatible scalability across full S12D family (vs MC9S12DP512CPVE / MC9S12DT128MPVE)
- Dual 8-channel 10-bit ADC for analog sensor aggregation (vs MC9S12DG256CPVE)
- 256KB Flash with on-chip CAN, SPI, SCI, I2C (vs MC9S12DG256CPVE)
- Cost-effective 256KB Flash in commercial grade (CPVE) (vs MC9S12DT256MPVE)
설계 노트
The MC9S12DT256CPVE uses a 2.35V to 2.75V core supply with multiple VDD/VSSX power pins that must each be decoupled individually. Place a 100nF X7R ceramic as close as possible to every VDD pin and a bulk 10uF tantalum or ceramic at the regulator output. The MCU's analog supply (VDDA/VSSA) should be filtered from the digital supply with a ferrite bead or 10-ohm resistor to keep ADC noise low; share a common ground plane with vias stitching the LQFP-112 thermal pad to ground.
Although the MC9S12DT256CPVE is rated for commercial 0C to +70C operation, internal power dissipation under full peripheral load (CAN + dual ADC + 8 PWM) can approach 0.5W. The LQFP-112 thermal pad (exposed pad underneath) must be soldered to a copper area of at least 1 square inch for adequate cooling, particularly when the MCU operates in enclosed automotive enclosures. If your target environment exceeds 70C (underhood, engine bay), step up to the MC9S12DT256MPVE automotive grade rather than rely on derating alone.
Do not assume the BDM (Background Debug Mode) pins are reserved only for debug - on the S12 family, MODC, BKGD, and RESET must be correctly pulled at reset or the MCU can enter special modes or fail to start. Use a 4.7k-10k pull-up on RESET per NXP reference designs and follow the BDM connector pinout exactly. Also, the PLL filter network on XFC/VDDPLL/VSSPLL needs its own LC filter components; omit these and the PLL will not lock reliably above 16MHz.
규정 준수 정보
AEC-Q100 not qualified; CPVE suffix denotes commercial 0-70C temperature grade. Reach and lead-free confirmations inferred from NXP corporate policy. RoHS and halogen-free status not explicitly given in retrieved data - marked [DATA_NEEDED].
