MRFE6S9135HSR3 vs MRFE6S9135HR3 비교
다음의 상세 나란히 비교: MRFE6S9135HSR3 제조: NXP Semiconductors 및 MRFE6S9135HR3 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MRFE6S9135HSR3 | MRFE6S9135HR3 |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | MOSFETs | MOSFETs |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $108.00 | $0.00 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Status | Active | — |
| 트랜지스터 유형 | LDMOS (N-Channel Enhancement-Mode Lateral MOSFET) | N-Channel Enhancement-Mode Lateral MOSFET (LDMOS) |
| Frequency | 940 MHz (designed up to 1000 MHz) | — |
| Test Voltage | 28 V | — |
| Test Current | 1 A | 1 A |
| Power Gain (Gps) | 21 dB | 21 dB (typical at 940 MHz) |
| Output Power (Pout) | 39 W average (single W-CDMA, 940 MHz) | 39 W (at 940 MHz, two-tone test) |
| Drain-Source Voltage Rating | 66 V | — |
| Drain Current Rating | 10 µA (leakage spec from cross-reference) | — |
| 패키지 / 케이스 | NI-880S (CASE 465B-03, STYLE 1), ceramic, straight leads | — |
| 실장 유형 | Through-hole / chassis-mount with flange bolt-down | Screw-mount / bolt-down flange |
| Input / Output Impedance | [DATA_NEEDED: input/output impedance at 940 MHz test condition] | — |
| Drain Efficiency | [DATA_NEEDED: drain efficiency at 39 W W-CDMA] | 63.3 % (typical at test conditions) |
| 동작 접합 온도 | -40 C to +150 C (typical LDMOS rating; [DATA_NEEDED: exact datasheet Tj max]) | — |
| Lead Free Status | Lead Free | — |
| RoHS 상태 | Compliant per NXP product page | [DATA_NEEDED: RoHS status] |
| 습도 민감도 레벨 (MSL) | [DATA_NEEDED: MSL rating from datasheet] | — |
| Packaging | Tape & Reel (suffix R3, 250-unit per reel) | — |
| Technology | — | RF Power LDMOS |
| Drain-Source Voltage (Rated) | — | 66 V |
| Typical Operating Voltage | — | 28 V |
| Operating Frequency Range | — | Up to 1000 MHz (broadband, 1 MHz to 1000 MHz typical) |
| Test Frequency | — | 940 MHz |
| Package Type | — | NI-880H-2L (ceramic flange) |
| ESD Protection (HBM) | — | Class II (per JESD22-A114) |
| ESD Protection (MM) | — | Class A (per EIA/JESD22-A115) |
| ESD Protection (CDM) | — | Class IV (per JESD22-C101) |
| Lead Status | — | Lead-containing (per digchip listing) |
| Designed For | — | Broadband commercial and industrial applications up to 1000 MHz |