MSC8157ESVT1000A vs MSC8156ESAG1000B 비교
다음의 상세 나란히 비교: MSC8157ESVT1000A 제조: NXP Semiconductors 및 MSC8156ESAG1000B 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MSC8157ESVT1000A - 6-Core SC3850 DSP 1GHz FCBGA-783 | NXP
MSC8157ESVT1000A ObsoleteNXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ 단종사양 비교
| 파라미터 | MSC8157ESVT1000A | MSC8156ESAG1000B |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | DSP | DSP |
| 수명 주기 상태 | Obsolete | 수명 종료 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $152.80 | $112.00 |
| Product Type | Multi-core Digital Signal Processor (DSP) | — |
| DSP Core Architecture | StarCore SC3850 (Six cores) | — |
| Core Clock Speed | 1 GHz | — |
| Performance | 1000 MIPS per core / 6000 MIPS aggregate | — |
| 데이터 버스 폭 | 32-Bit / 64-Bit | — |
| L1 Instruction Cache (per core) | 32 KB | — |
| L1 Data Cache (per core) | 32 KB | — |
| Package Type | FCBGA-783 (Flip-Chip BGA, 29x29 mm) | — |
| Pin/Ball Count | 783 | — |
| 공급 전압 | 1.0 V core (typical) | [DATA_NEEDED: core and I/O rail voltages] |
| 동작 온도 | 0C to +105C | 0C to +105C |
| Process Technology | CMOS | 45 nm CMOS |
| 실장 유형 | Surface Mount (FCBGA) | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (lead-free) | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| High-Speed Interfaces | Serial RapidIO, SGMII, PCI Express, Ethernet, I2C, SPI, UART | — |
| Memory Controller | Multi-channel DDR SDRAM controller | 64-bit DDR2/DDR3, up to 800 MT/s |
| 수명 주기 상태 | Obsolete (stock available from authorized distributors) | End of Life (per NXP PCN) |
| DSP Cores | — | 6x SC3850 StarCore cores |
| Core Clock Frequency | — | 1 GHz per core |
| Aggregate Performance | — | [DATA_NEEDED: aggregate MMACS rating] |
| Hardware Accelerator | — | MAPLE-B baseband accelerator (turbo decode) |
| SerDes Lanes | — | 2 lanes, SRIO or PCIe (selectable) |
| Ethernet | — | 1x Gigabit Ethernet MAC |
| Packet Engine | — | QUICC Engine subsystem |
| Security Engine | — | SEC 4.0 (Cryptographic accelerator) |
| 패키지 | — | 783-ball FCBGA (29x29 mm) |
| RoHS 상태 | — | [DATA_NEEDED: RoHS compliance] |