MW7IC2220GNR1 vs MW7IC2220NBR1 비교
다음의 상세 나란히 비교: MW7IC2220GNR1 제조: NXP Semiconductors 및 MW7IC2220NBR1 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MW7IC2220NBR1 - 2W W-CDMA RF Power Amplifier 2.11-2.17 GHz | NXP
MW7IC2220NBR1 ✓ 활성사양 비교
| 파라미터 | MW7IC2220GNR1 | MW7IC2220NBR1 |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | RF Amplifiers | RF Amplifiers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $25.10 | $21.50 |
| Technology | RF LDMOS, two-stage integrated | RF LDMOS (Laterally Diffused MOSFET) |
| Frequency Range (Usable) | 2000 MHz to 2200 MHz | — |
| Target Band | W-CDMA 2110-2170 MHz | — |
| Output Power (Avg, W-CDMA) | 2 W Avg. | — |
| Operating Voltage (VDD) | 28 V nominal (24 V to 32 V range) | — |
| Gain (Typ, 2.17 GHz) | 31 dB | — |
| Quiescent Current Stage 1 (IDQ1) | 80 mA | 80 mA |
| Quiescent Current Stage 2 (IDQ2) | 300 mA | 300 mA |
| Test Signal | Single-Carrier W-CDMA, PAR = 7.5 dB @ 0.01% CCDF | Single-Carrier W-CDMA, IQ Magnitude Clipping, PAR = 7.5 dB |
| ACPR Measurement | 3.84 MHz channel, +/-5 MHz offset | 3.84 MHz channel bandwidth at +/-5 MHz offset |
| 패키지 | TO-270 WBL-16 Gull-Wing (16-pin plastic overmold) | — |
| 실장 유형 | Surface Mount (Gull-Wing leads) | Surface Mount (flange/over-molded) |
| Input/Output Matching | On-chip 50 ohm matching | — |
| Lead-Free / RoHS | RoHS compliant per NXP product page | — |
| Operating Case Temperature | [DATA_NEEDED: operating case temperature] | — |
| Storage Temperature | [DATA_NEEDED: storage temperature] | — |
| Thermal Resistance (RthJC) | [DATA_NEEDED: theta_JC] | — |
| 기능 | — | W-CDMA Wideband Integrated Power Amplifier |
| Frequency Range | — | 2000 MHz to 2200 MHz (usable), 2110-2170 MHz (W-CDMA band) |
| Operating Frequency (typical) | — | 2167.5 MHz |
| Average Output Power | — | 2 W (33 dBm) |
| Drain Supply Voltage (VDD) | — | 28 V (24 V to 32 V operating range) |
| Small-Signal Gain | — | 31 dB (typical at 2.17 GHz) |
| Package Type | — | TO-272WB-16 (over-molded plastic) |
| Input Matching | — | On-chip (50 ohm nominal) |
| Output Matching | — | On-chip (50 ohm nominal) |
| Characteristic Impedance | — | 50 ohm |
| Maximum Operating Temperature | — | 150 C |
| Modulation Support | — | W-CDMA, TD-SCDMA, LTE, multi-carrier |