10AS032E4F27I3SG - Arria 10 SX SoC FPGA, 320K LE, 672-FBGA | Intel
부품 번호: 10AS032E4F27I3SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 50 | $1620 | $81,000.00 |
| 100 | $1545 | $154,500.00 |
| 500 | $1465 | $732,500.00 |
10AS032E4F27I3SG 개요
A System-on-Chip FPGA is a heterogeneous device that combines one or more hard CPU cores with programmable logic on a single die, sitting at the intersection of microcontrollers, ASICs, and traditional FPGAs in the broader embedded-processing taxonomy. The hard ARM Cortex-A9 subsystem removes the soft-core overhead and gives the designer predictable interrupt latency, deterministic boot, and access to standard OS ecosystems such as Linux and VxWorks, while the FPGA fabric accelerates parallel datapaths and custom interfaces.
Key features include 320K logic elements, embedded DSP blocks, on-chip M20K memory blocks, and multi-gigabit transceivers that support high-speed serial protocols. The SoC integrates 1.5 GHz-class Cortex-A9 cores, dual ARM Cortex-A9 MPCore, hardware ECC-protected L1/L2 caches, CoreSight debug and trace, and a rich set of peripherals including EMAC, USB, NAND flash controller, SD/MMC, SPI, UART, and I2C. The 20 nm process node and the flip-chip BGA package enable high logic density with thermal headroom for industrial operation.
Typical uses include industrial motor control and machine-vision pipelines, broadcast and professional video processing, wireless baseband, radar and beamforming front-ends, test and measurement instrumentation, and high-performance embedded computing. Designers typically pair the 10AS032E4F27I3SG with DDR3 memory, Ethernet PHYs, and high-speed ADCs/DACs to build deterministic, low-latency signal-processing systems.
For thermal design, the flip-chip BGA relies primarily on PCB thermal vias under the exposed die region, so allocating enough inner-layer copper and a balanced via array is critical. For power, separate core, periphery, HPS, and transceiver rails are recommended, each decoupled close to the package with a combination of bulk and high-frequency ceramics.
This page consolidates distributor pricing, drop-in same-package alternatives, and design considerations not found in the datasheet, helping engineers evaluate the 10AS032E4F27I3SG against other Arria 10 SX options and competing mid-range SoC FPGAs.
드롭인 대체품: 10AS032E4F27I3SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS032E4F27I3SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Number of Terminals, Mounting Type, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS032E4F27I3LG
✅ 드롭인✓ 재고 있음
$1085.1 / 개
데이터시트 보기 →10AS032E4F27E3SG
✅ 드롭인✓ 재고 있음
$1425 / 개
데이터시트 보기 →10AS032E4F27E3LG
✅ 드롭인✓ 재고 있음
$1950 / 개
데이터시트 보기 →10AS032E3F27I3SG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AS032E4F27I3SG 최대 정격 & 전기적 특성
| Manufacturer | Intel (formerly Altera) |
| Series | Arria 10 SX |
| Device Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | Up to 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage (typ.) | 0.9 V |
| 패키지 | 672-pin FCBGA (Flip-Chip BGA), 27 x 27 mm |
| Terminal Form | Ball |
| Number of Terminals | 672 |
| Operating Temperature Grade | Industrial (-40C to +100C junction) |
| 실장 유형 | Surface Mount |
| Compliance / Lead-Free | RoHS compliant, lead-free |
| 수명 주기 상태 | Active |
| FPGA Architecture | SRAM-based, volatile configuration |
10AS032E4F27I3SG 672-pin fcbga (flip-chip bga), 27 x 27 mm 핀 구성 가이드
10AS032E4F27I3SG(672-pin fcbga (flip-chip bga), 27 x 27 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS032E4F27I3SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS032E4F27I3SG 적합 용도: 6 애플리케이션s: Industrial Machine Vision and Inspection, Wireless Baseband and Beamforming, Broadcast and Professional Video Processing, Radar and Electronic-Warfare Front-Ends, Test and Measurement Instrumentation, High-Performance Embedded Computing (HPC) Edge Node.
Industrial Machine Vision and Inspection
The 10AS032E4F27I3SG's combination of 320K logic elements, embedded DSP blocks, and dual 1.5 GHz Cortex-A9 cores makes it an excellent fit for high-throughput machine-vision pipelines. In a typical design, the FPGA fabric captures image data from MIPI CSI-2 or GigE Vision sensors, runs Sobel/FFT convolution in DSP, and forwards processed frames to the HPS for classification over Ethernet. A key benefit of the 320K LE fabric is the ability to instantiate multiple parallel image-processing pipelines at full sensor frame rate, while the Cortex-A9 HPS runs the application stack (OpenCV, inference, HMI). Industrial temperature grade (-40C to +100C) supports deployment in factory-floor enclosures. Pair this FPGA with a DDR3 controller, multi-lane PHY, and PoE+ for an integrated smart-camera SoC.
추천
Wireless Baseband and Beamforming
For wireless baseband and beamforming designs, the 10AS032E4F27I3SG delivers up to 96 DSP blocks and multi-gigabit transceivers in a single SoC. The 320K logic elements can implement a 4G/5G small-cell PHY, including FFT/iFFT, channel coding, and crest-factor reduction, while the Cortex-A9 HPS runs the MAC and upper-layer protocols. Transceiver rates and the HPS Ethernet MACs let designers aggregate several RF channels and forward baseband data over multiple Gigabit Ethernet links. The industrial temperature grade supports outdoor small-cell deployments, and the FCBGA package is well suited to high-density PCB layouts near RF front-end modules. Use external DPD feedback ADCs for full digital pre-distortion accuracy.
추천
Broadcast and Professional Video Processing
Broadcast routers, video-conference mixers, and 4K/UHD production switchers benefit from the 10AS032E4F27I3SG's combination of abundant DSP, high-speed serial I/O, and an integrated ARM HPS. The FPGA fabric handles multi-channel SDI de-/serialization, color-space conversion, and HDR mapping in real time, while the HPS runs the control plane and IP-based transport. The integrated ARM Cortex-A9 cluster eliminates an external microcontroller for housekeeping, simplifying BOM and reducing latency. The industrial temperature range supports OB-van and studio installations with variable cooling. For higher channel counts, design a multi-FPGA mesh using the high-speed transceivers for chip-to-chip links.
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Radar and Electronic-Warfare Front-Ends
The 10AS032E4F27I3SG suits phased-array radar and electronic-warfare front-ends where the 320K-LE fabric can implement FFT-based signal detection, pulse compression, and direction-finding algorithms in parallel. Multi-gigabit transceivers accept direct ADC data streams at several Gsps, and the dual Cortex-A9 HPS can run a real-time tracking/classification layer on the resulting tracks. The industrial temperature grade handles harsh aerospace and defense enclosures with constrained cooling. The FCBGA package integrates high-speed I/O with an extensive HPS peripheral set (EMAC, USB, SPI), reducing external chip count for tightly coupled RF digitizer + signal-processing cards. For wider instantaneous bandwidth, consider migrating to Arria 10 10AS066 or Arria 10 GX variants.
추천
Test and Measurement Instrumentation
Test and measurement instruments such as protocol analyzers, mixed-signal oscilloscopes, and arbitrary waveform generators benefit from the 10AS032E4F27I3SG's mix of FPGA logic for real-time acquisition and a Cortex-A9 HPS for the user interface, scripting, and remote control. The 320K LE budget can implement multi-channel decoders, simultaneous protocol stacks, and trigger engines. The Cortex-A9 cluster runs embedded Linux, providing fast boot, network connectivity, and a familiar development environment. The industrial temperature grade supports bench, lab, and portable instrument enclosures. Designers typically pair the device with high-speed ADCs (LVDS or JESD204B) and DDR3 memory for deep sample buffers, then expose SCPI / LXI over Ethernet.
추천
High-Performance Embedded Computing (HPC) Edge Node
At the network edge, the 10AS032E4F27I3SG acts as an HPC node combining deterministic low-latency FPGA acceleration (compression, encryption, packet inspection) with a full Linux-capable Cortex-A9 HPS. The 320K LE fabric accelerates openvSwitch, IPsec, or custom inference, while the HPS handles routing, control-plane APIs, and cloud connectivity. The integrated SoC reduces BOM and board area versus a discrete CPU + FPGA design, and the industrial temperature grade supports outdoor and ruggedized enclosures. Designers typically complement the device with 10 GbE PHYs for uplink, SATA SSDs for local storage, and trusted-platform-module ICs for secure boot. For higher throughput, scale to multi-FPGA fabrics using the multi-gigabit transceivers.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS032E4F27I3SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS032E4F27I3LG | 10AS032E4F27E3SG | 10AS032E4F27E3LG | 10AS032E3F27I3SG |
|---|---|---|---|---|---|
| Package | 672-FCBGA (F27, 27x27 mm) | 672-FCBGA (F27, 27x27 mm) | 672-FCBGA (F27, 27x27 mm) | 672-FCBGA (F27, 27x27 mm) | 672-FCBGA (F27, 27x27 mm) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 320K | 320K | 320K | 320K | 320K |
| Hard Processor System | Dual ARM Cortex-A9 + CoreSight | Dual ARM Cortex-A9 + CoreSight | Dual ARM Cortex-A9 + CoreSight | Dual ARM Cortex-A9 + CoreSight | Dual ARM Cortex-A9 + CoreSight |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +100C) | Commercial (0C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | -4 (fastest) | -4 (fastest) | -4 (fastest) | -4 (fastest) | -3 (slower) |
| Terminal Finish | Standard (SnPb-free) | Lead-free | Standard (SnPb-free) | Lead-free | Standard (SnPb-free) |
| Estimated 1pc Price (USD, 2026-09-04) | 1,850 | 1,860 | 1,710 | 1,720 | 1,780 |
| Drop-in Compatibility | Reference | Yes (same die/pinout) | Yes (same die/pinout, lower temp) | Yes (same die/pinout, lower temp) | Yes (same die/pinout, slower) |
주요 차별점
- Integrated dual ARM Cortex-A9 HPS in the same 672-FCBGA package (vs Cyclone V SX 5CSTFD6D5F31I7N)
- 320K logic elements with industrial temperature in same package (vs 10AS032E4F27E3SG)
- Speed grade -4 timing margin (vs 10AS032E3F27I3SG)
설계 노트
The 672-FCBGA package dissipates significant heat through the flip-chip die region on the package bottom; thermal management relies on a dense array of PCB thermal vias connecting the die pad to internal copper planes. Place at least 4 thermal vias per cm^2 under the die footprint, stitch power planes to maximize spreading, and consider a heat-spreader lid with TIM for industrial-temperature deployments. Estimated theta_JA for a JEDEC 4-layer board is approximately 7-10 C/W; estimate junction temperature rise by multiplying worst-case total power (typically 6-12 W) by T_JA and adding ambient. If junction rise exceeds 60 C in a 70 C enclosure, add forced-air cooling or a heat sink.
Estimated power budgets should be derived after place-and-route in Quartus Prime, but for early design budgeting the 10AS032E4F27I3SG typically requires four independent supply rails: 0.9 V VCC (core), 0.95 V VCCPT (periphery/transceivers), 1.8 V VCCPGM (configuration), and 1.8 V/3.3 V for HPS I/O and peripherals. Use a discrete 6+ phase digital controller with PowerSoC stages to meet the ~12 W peak load. Decouple each rail with bulk tantalum/poly plus 0402/0201 ceramics placed immediately adjacent to the BGA vias. Sequence the HPS rail before FPGA fabric VCC to ensure deterministic HPS boot, and add power-good monitoring to your supervisory MCU.
Estimated: routing a 672-ball FCBGA at 1 mm pitch requires at least a 12-layer stackup with 4-4-4-4mil stack-up symmetry and high-speed materials such as Megtron-6 or equivalent. Matched-length routing is mandatory for DDR3 and multi-gigabit transceiver pairs; use length-tuning software with 5 mil tolerance on the byte lanes and 25 mil on the address/control. Escape-route the top layer only for transceiver and HPS high-speed signals, fan out the rest to inner layers, and stitch the entire BGA field with a ground plane to provide return paths. Do NOT place vias in the BGA pads themselves; use dog-bone fan-out or microvia-in-pad designs for production boards.
Common design mistakes on the Arria 10 SX platform include (1) ignoring the MSL3 moisture sensitivity of the FCBGA package - bake before reflow, (2) forgetting HPS reset sequencing - the HPS_COLD_n and HPS_WARMn pins must follow the HPS power-rail order documented in the datasheet, (3) failing to provide a JTAG header for board-level debug, (4) omitting pull-ups on configuration pins MSEL and CONF_DONE, and (5) using the wrong configuration mode (FPP x8 vs AS x4) and bricking the design. Always prototype the boot path with the Intel SoC FPGA Embedded Development Kit before committing to custom hardware.
규정 준수 정보
RoHS-compliant per Intel/Altera product page. Not AEC-Q100 qualified; automotive designs should evaluate the Arria 10 -Q1 suffix variants if available, or a different device family.
