MT53E512M64D2HJ-046 - 32Gbit LPDDR4X SDRAM | Micron | Mobile
부품 번호: MT53E512M64D2HJ-046 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $31.39 | $31.39 |
| 10 | $29.82 | $298.20 |
| 100 | $27.78 | $2,778.00 |
| 500 | $26.14 | $13,070.00 |
| 1,000 | $24.58 | $24,580.00 |
MT53E512M64D2HJ-046 개요
Mobile LPDDR4X (Low Power Double Data Rate 4X) SDRAM is a low-voltage DRAM derived from the LPDDR4 standard, optimized for battery-powered and thermally constrained systems. Within the memory hierarchy it sits under synchronous DRAM (SDRAM) -> mobile DRAM -> LPDRAM, and complements NOR/NAND flash in embedded and mobile platforms. LPDDR4X lowers the I/O termination voltage (VDDQ) relative to LPDDR4, reducing I/O power while preserving the LPDDR4 protocol and data rates.
Key features of this device include the 32 Gbit density in a x64 organization, 4266 Mb/s data rate per pin enabled by the 2133 MHz clock, and the compact 556-ball FBGA (12.4 x 12.4 mm) footprint that supports space-limited SoC memory subsystems. Distributor listings cover industrial (AIT/AAT), automotive (AUT) and wide-temperature (WT) grade variants, allowing a common footprint across market segments.
Architecturally, the device implements the LPDDR4/LPDDR4X mobile SDRAM protocol with bank groups and burst access, delivering the high bandwidth SoC application processors require. The parallel 64-bit data path minimizes the number of devices needed per system, simplifying routing compared to x32 organizations.
Typical applications include automotive infotainment and ADAS platforms, industrial HMI and edge-compute modules, and networking/embedded systems where high-bandwidth, low-power DRAM is required alongside an application processor.
Design consideration: LPDDR4X signal integrity demands length-matched fly-by routing, on-die-termination (ODT) tuning and careful VDDQ decoupling; follow the memory controller vendor's layout guide for the 556-ball FBGA footprint.
This page synthesizes distributor pricing and stock data, same-footprint grade alternatives, and practical design notes not consolidated in the manufacturer part catalog.
드롭인 대체품: MT53E512M64D2HJ-046 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MT53E512M64D2HJ-046 AAT:B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT53E512M64D2HJ-046 AUT:B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT53E512M64D2HJ-046 AIT:B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT53E512M64D2HJ-046 WT:B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT53E512M64D2HJ-046 AUT:B TR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT53E512M64D2HJ-046 최대 정격 & 전기적 특성
| 메모리 유형 | SDRAM - Mobile LPDDR4 (LPDDR4X) |
| 메모리 크기 | 32 Gbit (4 GB) |
| 메모리 구성 | 512M x 64 |
| 인터페이스 | Parallel |
| Clock Frequency | 2.133 GHz |
| Access Time | 3.5 ns |
| 데이터 속도 | 4266 Mb/s per pin |
| 패키지 | 556-WFBGA (12.4 mm x 12.4 mm) |
| 실장 유형 | Surface Mount |
| Operating Temperature Grade | WT (wide temperature) - per WT:B suffix |
| Grade Variants | WT (wide temp), AUT (automotive), AIT/AAT (industrial/auto) |
| Packaging | Tray / Tape & Reel (TR), TR MOQ 2000 (per DigiKey AUT:B TR listing) |
MT53E512M64D2HJ-046 556-wfbga (12.4 mm x 12.4 mm) 핀 구성 가이드
MT53E512M64D2HJ-046(556-wfbga (12.4 mm x 12.4 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MT53E512M64D2HJ-046.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MT53E512M64D2HJ-046 적합 용도: 6 애플리케이션s: Automotive Infotainment and Cockpit, Industrial Edge Computing and HMI, Networking and Communication Equipment, ADAS and Camera Sensor Processing, Embedded Modules and Single-Board Computers, Portable and Battery-Powered Devices.
Automotive Infotainment and Cockpit
The MT53E512M64D2HJ-046 AUT:B grade provides 4 GB of LPDDR4X main memory for automotive infotainment SoCs, where the 4266 Mb/s per-pin data rate and x64 parallel bus deliver the bandwidth needed for multi-display HMI rendering and navigation workloads. In this role the memory sits on the processor's dedicated LPDDR4X bus with fly-by routing and controller-managed ODT calibration. Because LPDDR4X reduces the VDDQ I/O termination voltage versus LPDDR4, it lowers I/O power in thermally constrained dashboards - a quantified benefit for fanless cockpit units. Automotive qualification documentation (AUT suffix) supports design-in into safety-reviewed programs.
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Industrial Edge Computing and HMI
For industrial edge modules and HMI panels, the MT53E512M64D2HJ-046 AAT:B grade supplies 32 Gbit of volatile memory in a 12.4 x 12.4 mm 556-WFBGA footprint, fitting compact compute modules alongside eMMC and QSPI boot flash. The 2133 MHz clock and 64-bit parallel interface sustain the memory bandwidth required by vision inference and protocol-gateway workloads, while the LPDDR4X low VDDQ cuts module power versus DDR3L/DDR4 alternatives of similar bandwidth. Designers typically pair the DRAM with SPI NOR for boot code, benefiting from a shared, footprint-stable BOM across WT/AAT grades.
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Networking and Communication Equipment
In routers, switches and 5G small-cell platforms, the MT53E512M64D2HJ-046 buffers packet descriptors and forwarding tables; its 4266 Mb/s per-pin data rate over a x64 bus provides tens of GB/s of peak bandwidth that keeps pace with multi-gigabit line rates. The 556-ball WFBGA's 12.4 x 12.4 mm outline lets designers place the DRAM close to the network processor, shortening length-matched flight times and easing timing closure at 2133 MHz. The WT:B grade, currently shipping from DigiKey, suits commercial-temperature networking SKUs, while AAT variants cover extended-temperature carrier-grade builds.
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ADAS and Camera Sensor Processing
ADAS domain controllers and front-camera ECUs stream multiple high-resolution sensor feeds through ISP pipelines into DRAM; the MT53E512M64D2HJ-046's 32 Gbit capacity accommodates multi-frame ring buffers, while the -046 speed grade's low 3.5 ns access time minimizes latency on perception workloads. The AUT:B automotive grade supplies the qualification trail required for ASIL-programmed platforms, and the shared 556-WFBGA footprint across WT/AUT grades lets one PCB serve multiple programs. Compared with x32-organized parts, the x64 organization halves device count, reducing BGA escapes and board-layer count in safety-relevant layouts.
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Embedded Modules and Single-Board Computers
SOM and SBC vendors use the MT53E512M64D2HJ-046 as soldered-down main memory for ARM-based compute modules, where its 4 GB density and LPDDR4X protocol match mainstream application processors. The 12.4 x 12.4 mm 556-WFBGA package integrates onto the module core layer beneath the SoC, keeping the connector footprint small. LPDDR4X's reduced VDDQ lowers module idle power - valuable in battery-backed edge nodes - and the AAT grade extends operating range for unconditioned industrial environments. Pair with industrial-grade QSPI NOR for fail-safe boot, reusing the same memory-vendor supply chain.
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Portable and Battery-Powered Devices
The MT53E512M64D2HJ-046 originates from Micron's Mobile LPDDR4 family, and its LPDDR4X I/O voltage reduction translates directly into longer battery runtime in portable instruments, handheld terminals and rugged tablets. The 32 Gbit, 512M x 64 single-package organization removes multi-chip PoP complexity, improving yield and thermal paths in thin enclosures. At 2133 MHz the device sustains responsive UI and camera pipelines, while the WT:B grade's wide-temperature support covers outdoor use. Deep power-down and self-refresh modes in the LPDDR4X protocol minimize standby current between wake events.
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추천 제품 요약
엔지니어링 참조 데이터: MT53E512M64D2HJ-046 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MT53E512M64D2HJ-046 AAT:B | MT53E512M64D2HJ-046 AUT:B | MT53E512M64D2HJ-046 AIT:B | MT53E512M64D2HJ-046 WT:B |
|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Package | 556-WFBGA (12.4 x 12.4 mm) | 556-WFBGA (12.4 x 12.4 mm) - same | 556-WFBGA (12.4 x 12.4 mm) - same | 556-WFBGA (12.4 x 12.4 mm) - same | 556-WFBGA (12.4 x 12.4 mm) - same |
| Memory Size | 32 Gbit | 32 Gbit | 32 Gbit | 32 Gbit | 32 Gbit |
| Organization | 512M x 64 | 512M x 64 | 512M x 64 | 512M x 64 | 512M x 64 |
| Clock / Data Rate | 2.133 GHz / 4266 Mb/s per pin | 2.133 GHz / 4266 Mb/s | 2.133 GHz / 4266 Mb/s | 2.133 GHz / 4266 Mb/s | 2.133 GHz / 4266 Mb/s |
| Access Time | 3.5 ns | 3.5 ns | 3.5 ns | 3.5 ns | 3.5 ns |
| Lifecycle Status | Active (WT:B ships from DigiKey) | Active - recommended substitute for AIT:B | Active (automotive grade) | Obsolete per DigiKey | Active - ships today |
주요 차별점
- x64 organization halves device count (vs MT53D384M32D2DS-046)
- Same die across qualification grades (vs MT53E512M64D2HJ-046 AUT:B)
- Defined migration path from obsolete grades (vs MT53E512M64D2HJ-046 AIT:B)
설계 노트
Route the 64-bit LPDDR4X data bus as tightly matched length groups to the 556-WFBGA package, keeping trace-length skew within the memory controller's timing budget at 2133 MHz (4266 Mb/s per pin). Follow the SoC vendor's fly-by topology for address/command lines and place VTT/VDDQ termination components close to the package edge of the 12.4 x 12.4 mm outline. Use the Micron datasheet ballout for the exact grade suffix when generating the footprint.
LPDDR4X reduces the VDDQ I/O termination voltage relative to LPDDR4, so the power tree must supply separate, well-decoupled VDD and VDDQ rails. Bulk plus high-frequency ceramic decoupling (low-ESL arrays) should surround the 556-ball footprint. Verify the controller supports the LPDDR4X VDDQ level before substituting an LPDDR4X part into an LPDDR4 socket, as the termination voltage difference is the primary electrical delta between the standards.
Do not mix grade suffixes casually: the AIT:B variant is officially obsolete (per DigiKey) and its recommended substitute is AAT:B, which shares the identical footprint and electricals but different qualification documentation. Automotive programs must specify AUT:B for qualification paperwork, and tape-and-reel options such as AUT:B TR carry a 2,000-piece minimum order. Always validate the exact suffix on the marking against your BOM before assembly.
규정 준수 정보
Compliance data was not present in the provided verified web data. Micron publishes RoHS/REACH declarations per part number on its part-catalog pages; verify against the Micron part detail page for the exact grade suffix. The AUT suffix indicates automotive qualification per distributor listings, but AEC-Q100 status is not explicitly stated in the provided data.
