10AS048E4F29I3LG - 480K LE Arria 10 SX SoC FPGA | Intel
부품 번호: 10AS048E4F29I3LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3950 | $39,500.00 |
| 100 | $3580 | $358,000.00 |
| 500 | $3250 | $1,625,000.00 |
| 1,000 | $2980 | $2,980,000.00 |
10AS048E4F29I3LG 개요
An SoC FPGA is a single silicon device that merges a general-purpose processor subsystem with programmable logic, allowing hardware accelerators and software tasks to share memory coherently. The Arria 10 SX family sits in the mid-range of Intel's FPGA portfolio, between Cyclone (low power) and Stratix (highest performance). It targets applications that need both DSP throughput and ARM application processing in one chip, reducing board space and simplifying data movement between CPU and fabric.
Key features of the 10AS048 include 480K logic elements (LEs), 28.4 Mbits of embedded memory, 1,560 DSP blocks (18x19 multipliers), and 24 transceivers operating up to 6.144 Gbps. The integrated HPS contains dual ARM Cortex-A9 MPCore CPUs with CoreSight debug, 32KB I-cache and 32KB D-cache per core, NEON media engine, and a rich set of peripherals including USB 2.0 OTG, Gigabit Ethernet, DDR3/4 controllers, and CAN. Four hard memory controllers support DDR4 up to 1,600 MHz.
The architecture pairs a serial fabric with variable-precision DSP blocks, allowing designers to implement wide data-path functions (FFT, FIR, modulation) while the ARM cores handle control-plane software, OS tasks, and high-level protocol stacks. PCIe Gen2 x4 hard IP blocks enable direct host attachment, and partial reconfiguration lets the FPGA re-load regions of logic on the fly. Industrial temperature range (-40C to +100C) supports harsh-environment deployments.
Typical applications include wireless baseband processing, radar and electronic-warfare signal chains, high-performance industrial imaging, software-defined radio, and test & measurement instruments. The SoC integration is particularly valuable when designers must run Linux or RTOS on the HPS while offloading latency-sensitive DSP into the fabric.
When designing with this device, plan the PCB layout around the 29x29 mm BGA with proper via-in-pad and microvia stack-ups; signal-integrity simulation is recommended for the 6.144 Gbps transceiver channels. The 0.9V core voltage requires multi-rail decoupling following Intel's pin-connection guidelines, and the HPS boot sequence must follow the Arria 10 SoC boot-from-flash reference flow to bring the Cortex-A9 cores out of reset cleanly.
This page synthesizes distributor pricing, drop-in alternatives drawn from the Arria 10 SX family, and practical design notes that go beyond the manufacturer datasheet to help engineers evaluate the 10AS048E4F29I3LG for new designs.
드롭인 대체품: 10AS048E4F29I3LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS048E4F29I3LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Operating Temperature, RoHS Status, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS048E4F29E3LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1350 / 개
데이터시트 보기 →10AS048E4F29E3SG
✅ 드롭인✓ 재고 있음
$3120 / 개
데이터시트 보기 →10AS048E4F29I3SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1150 / 개
데이터시트 보기 →10AS048E3F29I3LG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AS048E2F29I3LG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AS048E4F29I3LG 최대 정격 & 전기적 특성
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Embedded Memory | 28.4 Mbits |
| DSP Blocks | 1,560 (18x19 multipliers) |
| Process Technology | 20 nm TSMC |
| Core Voltage | 0.9 V |
| Transceivers | 24 channels up to 6.144 Gbps |
| Hard Memory Controllers | 4 (DDR4 up to 1,600 MHz) |
| PCIe Hard IP | Gen2 x4 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | Up to 1.5 GHz |
| 패키지 | 780-ball FC-FBGA (F29, 29x29 mm) |
| 동작 온도 | -40C to +100C (Industrial) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
10AS048E4F29I3LG 780-ball fc-fbga (f29, 29x29 mm) 핀 구성 가이드
10AS048E4F29I3LG(780-ball fc-fbga (f29, 29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS048E4F29I3LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS048E4F29I3LG 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Radar and Electronic Warfare Signal Processing, Software-Defined Radio Platforms, High-Performance Industrial Imaging, Test & Measurement Instrumentation, Video Broadcast and Encoding.
Wireless Baseband Processing
The 10AS048E4F29I3LG's 1,560 DSP blocks and 28.4 Mbits embedded memory allow implementation of multi-antenna LTE/5G NR baseband receivers with up to 24x decimation chains running concurrently. Its 24 transceivers at 6.144 Gbps connect directly to ADC/DAC front-ends over CPRI or JESD204B/C links. The integrated ARM Cortex-A9 HPS runs the MAC layer and baseband control software in Linux or RTOS while deterministic DSP stays in the fabric. Compared with a discrete processor+FPGA solution, the SoC integration cuts latency between MAC and physical-layer accelerators by avoiding external memory round-trips.
추천
Radar and Electronic Warfare Signal Processing
The 10AS048E4F29I3LG delivers up to 1.5 GMACs of DSP throughput via its 1,560 variable-precision DSP blocks, well-suited for phased-array radar beamforming, pulse compression, and FFT-based spectral analysis. Four hard memory controllers aggregate 25.6 GB/s of DDR4 bandwidth, feeding the multi-channel data path without fabric stalls. The 6.144 Gbps transceivers accept LVDS or serial ADC streams directly from RF front-ends, eliminating glue FPGAs. Industrial -40C to +100C operation supports ground-mobile and naval radar enclosures.
추천
Software-Defined Radio Platforms
The 10AS048E4F29I3LG provides 480K logic elements for wideband channelizers and 24 transceivers up to 6.144 Gbps for multi-band RF front-ends, fitting tactical and commercial SDR form-factors. The HPS runs GNU Radio or custom DSP frameworks while fabric handles the latency-critical demodulation/decoding pipeline. PCIe Gen2 x4 links to host processors for high-volume offload when deployed as an accelerator card. Compared with discrete DSP+FPGA boards, the integrated HPS eliminates a processor chip and simplifies thermal design.
추천
High-Performance Industrial Imaging
The 10AS048E4F29I3LG ingests multi-stream MIPI-CSI-2 or sub-LVDS image data through its 1.5 GHz fabric while the HPS runs Linux for ISP pipeline orchestration, defect detection, and machine-learning inference. 24 transceivers support CoaXPress or 10GigE Vision cameras directly. The 28.4 Mbits embedded memory serves as line/frame buffers with deterministic latency, and the ARM cores accelerate pre-processing stages otherwise offloaded to external processors. Compared with discrete processor + FPGA designs, this single-chip approach reduces PCB area and BOM cost.
추천
Test & Measurement Instrumentation
The 10AS048E4F29I3LG suits modular oscilloscopes, BERTs, and protocol analyzers where 1,560 DSP blocks deliver real-time FFT, jitter decomposition, and signal conditioning on gigabit waveforms. The HPS runs the user-interface stack, instrument drivers, and LXI/SCPI command parsing over Gigabit Ethernet. Four hard DDR4 controllers feed waveform memory up to 25.6 GB/s, eliminating the need for external memory controllers. Industrial temperature range supports bench and field-deployed instruments.
추천
Video Broadcast and Encoding
The 10AS048E4F29I3LG supports real-time HEVC/H.265 4K encode/decode at 60 fps using the 1,560 DSP blocks for motion estimation and transform pipelines. The HPS runs the broadcast control plane, while fabric handles deterministic encoder stages. Transceivers connect to 12G-SDI or SMPTE 2110 IP-based broadcast fabrics. Industrial temperature grade enables 24/7 broadcast equipment operation. Compared with ASIC encoders, the SoC FPGA allows in-field protocol upgrades as broadcast standards evolve.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS048E4F29I3LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS048E4F29E3LG | 10AS048E4F29E3SG | 10AS048E4F29I3SG | 10AS048E3F29I3LG | 10AS048E2F29I3LG |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA (F29, 29x29 mm) | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | -3 (fastest) | -3 | -3 | -3 | -2 (slower) | -1 (slowest) |
| Temperature Grade | Industrial (-40C to +100C) | Extended | Extended | Industrial | Industrial | Industrial |
| DSP Blocks | 1,560 | 1,560 | 1,560 | 1,560 | 1,560 | 1,560 |
| Transceivers | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
주요 차별점
- Highest speed grade (-3) in F29 footprint (vs 10AS048E2F29I3LG (-1 speed grade))
- Industrial temperature range in -3 speed grade (vs 10AS048E4F29E3LG (extended temperature))
- Full Arria 10 SX resource complement (vs 10AS032 variant (320K LEs))
설계 노트
Estimated: The 10AS048E4F29I3LG dissipates up to approximately 40W in worst-case workloads at 1.5 GHz fabric + HPS utilization. With the FC-FBGA 29x29 mm package, attach a high-performance thermal interface material (TIM, e.g., 1.0 mm Indium foil or Shin-Etsu X-23-8032) and a heatsink with thermal resistance below 0.5 C/W to keep the junction below 100C. Forced-air cooling at 1-2 m/s is recommended for chassis-mounted applications.
The 780-ball FC-FBGA uses 1.0 mm ball pitch; route with HDI microvia stack-up (4-6-4 or better). Via-in-pad with filled/capped vias is recommended for signal balls, while ground balls benefit from short stitching vias to inner ground planes. Maintain 50 ohm controlled impedance on 6.144 Gbps transceiver channels and apply length matching within the limits specified in the Arria 10 SX transceiver user guide.
Estimated: Provide 0.9V core with at least 60A peak capability using a multi-phase buck controller (such as the LTC3887 or Renesas ISL8277M). Use 22uF/10V X7R ceramic capacitors in parallel with bulk polymer caps on each core rail; follow Intel's pin connection guidelines for VCC/VCCPT/VCCA/VCCP decoupling to avoid in-rush voltage droops during HPS boot.
Avoid using the 780-ball F29 footprint in a 1.05 mm-pitch assembly unless your contract manufacturer can handle BGA rework - mis-aligned BGA reballs frequently damage HPS core logic. For prototype development, request the 10AS048 development kit (Arria 10 SoC FPGA dev kit) to validate fabric+HPS boot flow before committing to PCB.
규정 준수 정보
RoHS and REACH compliant per Intel material declaration. Industrial temperature grade; not AEC-Q100 qualified (no -Q1 automotive suffix).
