10AS048E4F29I3LG - 480K LE Arria 10 SX SoC FPGA | Intel
MPN: 10AS048E4F29I3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3950 | $39,500.00 |
| 100 | $3580 | $358,000.00 |
| 500 | $3250 | $1,625,000.00 |
| 1,000 | $2980 | $2,980,000.00 |
Drop-in alternatives for 10AS048E4F29I3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048E4F29E3LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1350 / Unit
View Datasheet →10AS048E4F29E3SG
✅ Drop-In✓ In Stock
$3120 / Unit
View Datasheet →10AS048E4F29I3SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1150 / Unit
View Datasheet →10AS048E3F29I3LG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS048E2F29I3LG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS048E4F29I3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Logic Elements | 480,000 |
| Embedded Memory | 28.4 Mbits |
| DSP Blocks | 1,560 (18x19 multipliers) |
| Process Technology | 20 nm TSMC |
| Core Voltage | 0.9 V |
| Transceivers | 24 channels up to 6.144 Gbps |
| Hard Memory Controllers | 4 (DDR4 up to 1,600 MHz) |
| PCIe Hard IP | Gen2 x4 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | Up to 1.5 GHz |
| Package | 780-ball FC-FBGA (F29, 29x29 mm) |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10AS048E4F29I3LG 780-ball fc-fbga (f29, 29x29 mm) Pin Configuration Guide
Complete pinout information for 10AS048E4F29I3LG (780-ball fc-fbga (f29, 29x29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048E4F29I3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048E4F29I3LG is suitable for 6 applications: Wireless Baseband Processing, Radar and Electronic Warfare Signal Processing, Software-Defined Radio Platforms, High-Performance Industrial Imaging, Test & Measurement Instrumentation, Video Broadcast and Encoding.
Wireless Baseband Processing
The 10AS048E4F29I3LG's 1,560 DSP blocks and 28.4 Mbits embedded memory allow implementation of multi-antenna LTE/5G NR baseband receivers with up to 24x decimation chains running concurrently. Its 24 transceivers at 6.144 Gbps connect directly to ADC/DAC front-ends over CPRI or JESD204B/C links. The integrated ARM Cortex-A9 HPS runs the MAC layer and baseband control software in Linux or RTOS while deterministic DSP stays in the fabric. Compared with a discrete processor+FPGA solution, the SoC integration cuts latency between MAC and physical-layer accelerators by avoiding external memory round-trips.
Recommended
Radar and Electronic Warfare Signal Processing
The 10AS048E4F29I3LG delivers up to 1.5 GMACs of DSP throughput via its 1,560 variable-precision DSP blocks, well-suited for phased-array radar beamforming, pulse compression, and FFT-based spectral analysis. Four hard memory controllers aggregate 25.6 GB/s of DDR4 bandwidth, feeding the multi-channel data path without fabric stalls. The 6.144 Gbps transceivers accept LVDS or serial ADC streams directly from RF front-ends, eliminating glue FPGAs. Industrial -40C to +100C operation supports ground-mobile and naval radar enclosures.
Recommended
Software-Defined Radio Platforms
The 10AS048E4F29I3LG provides 480K logic elements for wideband channelizers and 24 transceivers up to 6.144 Gbps for multi-band RF front-ends, fitting tactical and commercial SDR form-factors. The HPS runs GNU Radio or custom DSP frameworks while fabric handles the latency-critical demodulation/decoding pipeline. PCIe Gen2 x4 links to host processors for high-volume offload when deployed as an accelerator card. Compared with discrete DSP+FPGA boards, the integrated HPS eliminates a processor chip and simplifies thermal design.
Recommended
High-Performance Industrial Imaging
The 10AS048E4F29I3LG ingests multi-stream MIPI-CSI-2 or sub-LVDS image data through its 1.5 GHz fabric while the HPS runs Linux for ISP pipeline orchestration, defect detection, and machine-learning inference. 24 transceivers support CoaXPress or 10GigE Vision cameras directly. The 28.4 Mbits embedded memory serves as line/frame buffers with deterministic latency, and the ARM cores accelerate pre-processing stages otherwise offloaded to external processors. Compared with discrete processor + FPGA designs, this single-chip approach reduces PCB area and BOM cost.
Recommended
Test & Measurement Instrumentation
The 10AS048E4F29I3LG suits modular oscilloscopes, BERTs, and protocol analyzers where 1,560 DSP blocks deliver real-time FFT, jitter decomposition, and signal conditioning on gigabit waveforms. The HPS runs the user-interface stack, instrument drivers, and LXI/SCPI command parsing over Gigabit Ethernet. Four hard DDR4 controllers feed waveform memory up to 25.6 GB/s, eliminating the need for external memory controllers. Industrial temperature range supports bench and field-deployed instruments.
Recommended
Video Broadcast and Encoding
The 10AS048E4F29I3LG supports real-time HEVC/H.265 4K encode/decode at 60 fps using the 1,560 DSP blocks for motion estimation and transform pipelines. The HPS runs the broadcast control plane, while fabric handles deterministic encoder stages. Transceivers connect to 12G-SDI or SMPTE 2110 IP-based broadcast fabrics. Industrial temperature grade enables 24/7 broadcast equipment operation. Compared with ASIC encoders, the SoC FPGA allows in-field protocol upgrades as broadcast standards evolve.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048E4F29I3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048E4F29E3LG | 10AS048E4F29E3SG | 10AS048E4F29I3SG | 10AS048E3F29I3LG | 10AS048E2F29I3LG |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA (F29, 29x29 mm) | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | -3 (fastest) | -3 | -3 | -3 | -2 (slower) | -1 (slowest) |
| Temperature Grade | Industrial (-40C to +100C) | Extended | Extended | Industrial | Industrial | Industrial |
| DSP Blocks | 1,560 | 1,560 | 1,560 | 1,560 | 1,560 | 1,560 |
| Transceivers | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps | 24 @ 6.144 Gbps |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Unit Price (qty-1) | ~$4,250 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest speed grade (-3) in F29 footprint (vs 10AS048E2F29I3LG (-1 speed grade))
- Industrial temperature range in -3 speed grade (vs 10AS048E4F29E3LG (extended temperature))
- Full Arria 10 SX resource complement (vs 10AS032 variant (320K LEs))
Design Notes
Estimated: The 10AS048E4F29I3LG dissipates up to approximately 40W in worst-case workloads at 1.5 GHz fabric + HPS utilization. With the FC-FBGA 29x29 mm package, attach a high-performance thermal interface material (TIM, e.g., 1.0 mm Indium foil or Shin-Etsu X-23-8032) and a heatsink with thermal resistance below 0.5 C/W to keep the junction below 100C. Forced-air cooling at 1-2 m/s is recommended for chassis-mounted applications.
The 780-ball FC-FBGA uses 1.0 mm ball pitch; route with HDI microvia stack-up (4-6-4 or better). Via-in-pad with filled/capped vias is recommended for signal balls, while ground balls benefit from short stitching vias to inner ground planes. Maintain 50 ohm controlled impedance on 6.144 Gbps transceiver channels and apply length matching within the limits specified in the Arria 10 SX transceiver user guide.
Estimated: Provide 0.9V core with at least 60A peak capability using a multi-phase buck controller (such as the LTC3887 or Renesas ISL8277M). Use 22uF/10V X7R ceramic capacitors in parallel with bulk polymer caps on each core rail; follow Intel's pin connection guidelines for VCC/VCCPT/VCCA/VCCP decoupling to avoid in-rush voltage droops during HPS boot.
Avoid using the 780-ball F29 footprint in a 1.05 mm-pitch assembly unless your contract manufacturer can handle BGA rework - mis-aligned BGA reballs frequently damage HPS core logic. For prototype development, request the 10AS048 development kit (Arria 10 SoC FPGA dev kit) to validate fabric+HPS boot flow before committing to PCB.
Compliance Information
RoHS and REACH compliant per Intel material declaration. Industrial temperature grade; not AEC-Q100 qualified (no -Q1 automotive suffix).
