10AX090U2F45I1SG - Arria 10 GX FPGA, 900K LE, FCBGA-1932 | Intel
부품 번호: 10AX090U2F45I1SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $11032.94 | $11,032.94 |
| 10 | $9929.65 | $99,296.50 |
| 100 | $8274.71 | $827,471.00 |
| 500 | $7455.2 | $3,727,600.00 |
| 1,000 | $6895.59 | $6,895,590.00 |
10AX090U2F45I1SG 개요
What is a high-end FPGA? A Field-Programmable Gate Array is a programmable logic device containing configurable logic blocks (LBs), programmable interconnect, embedded memory blocks, DSP blocks, and high-speed transceivers. The Arria 10 family sits between Intel's lower-cost Cyclone and high-end Stratix families, balancing performance, power, and cost. Arria 10 devices are part of the broader hierarchy: FPGA -> programmable logic -> digital integrated circuit -> semiconductor. Arria 10 GX specifically targets applications needing integrated 10 Gbps+ transceivers, hard memory controllers, and PCI Express Gen3 hard IP blocks.
Key features of the 10AX090U2F45I1SG include 900K logic elements (LEs), 59,234,304 bits of embedded block RAM (e.g., M20K blocks), variable-precision DSP blocks, 24 backplane-capable transceivers supporting data rates up to 12.5 Gbps (per Arria 10 family datasheet), hard PCI Express Gen3 x8 IP blocks, and 12.5 Gbps transceivers supporting protocols such as 10GbE, Interlaken, and CPRI. The I1 temperature grade designates the industrial operating range from -40C to +100C junction, making the part suitable for industrial and ruggedized environments.
The U2 speed grade indicates a mid-tier performance bin, the F45 suffix denotes the 45mm x 45mm FCBGA package with 1932 balls, the I grade indicates industrial temperature, 1 corresponds to the specific transceiver/feature combination, and SG indicates the standard lead-free / RoHS-compliant packaging. The combination delivers a balance of high logic density, transceiver count, and thermal envelope.
Typical applications include 10G/40G Ethernet aggregation switches, radar signal processing for defense, medical imaging systems, test and measurement equipment, broadcast video processing, and protocol bridging ASICs. The hard PCIe Gen3 and high-speed transceivers make it well-suited for accelerator cards and high-throughput data acquisition backplanes.
When designing with this part, allocate adequate PCB layer count for the 1932-ball FCBGA breakout, follow Intel's Arria 10 pin connection guidelines for unused transceivers, and ensure robust power delivery for the core and transceiver rails. Quartus Prime design software is required for synthesis, place-and-route, and configuration bitstream generation.
This page synthesizes distributor pricing, family-level drop-in variants, design considerations, and application guidance not consolidated on any single distributor page, giving engineers a faster sourcing and selection decision.
드롭인 대체품: 10AX090U2F45I1SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX090U2F45I1SG (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature Grade, Process Technology, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX090U2F45E2SG
✅ 드롭인✓ 재고 있음
$5995 / 개
데이터시트 보기 →10AX090U2F45E2LG
✅ 드롭인✓ 재고 있음
$3647.5 / 개
데이터시트 보기 →10AX090U2F45E1SG
✅ 드롭인✓ 재고 있음
$5895 / 개
데이터시트 보기 →10AX090U1F45I1SG
✅ 드롭인✓ 재고 있음
$9750 / 개
데이터시트 보기 →10AX090U1F45E1SG
✅ 드롭인✓ 재고 있음
$8750 / 개
데이터시트 보기 →10AX090U2F45I1SG 최대 정격 & 전기적 특성
| Series | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory Bits | 59,234,304 bits |
| User I/Os | 480 |
| 패키지 | 1932-BBGA, FCBGA (45 mm x 45 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (Industrial) |
| Temperature Grade | I (Industrial) |
| Speed Grade | U2 |
| Process Technology | 20 nm Tri-Gate |
| RoHS 상태 | Compliant |
| RoHS Version | SG suffix indicates RoHS-compliant |
| Hard Memory Controllers | Yes (DDR3/DDR4 with ECC, family-level) |
10AX090U2F45I1SG 1932-bbga, fcbga (45 mm x 45 mm) 핀 구성 가이드
10AX090U2F45I1SG(1932-bbga, fcbga (45 mm x 45 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX090U2F45I1SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX090U2F45I1SG 적합 용도: 6 애플리케이션s: 10G/40G Ethernet Aggregation Switch, Radar and Electronic Warfare Signal Processing, Medical Imaging Accelerator Card, Test and Measurement Instrumentation, Broadcast Video Processing and Contribution Encoders, PCIe Accelerator Card for Data Center Offload.
10G/40G Ethernet Aggregation Switch
The 10AX090U2F45I1SG is well-suited for 10G/40G Ethernet aggregation switches because of its 24 transceivers supporting data rates up to 12.5 Gbps, which directly covers 10GbE SFP+ and 40GbE QSFP+ ports. According to the Intel Arria 10 family datasheet, the hard 10GbE MAC IP and 1588 PTP support simplify PHY/MAC integration, while 900K logic elements provide headroom for L2/L3 switching fabric, ACL tables, and QoS queues. The 480 user I/Os allow ample parallel sideband, LED, and management interfaces, while industrial temperature supports carrier-grade deployments. Estimated line-rate throughput scales with U2 speed grade selection.
추천
Radar and Electronic Warfare Signal Processing
The 10AX090U2F45I1SG serves radar and electronic-warfare applications through its variable-precision DSP blocks, which deliver multi-GFLOP signal processing for beamforming, pulse compression, and FFTs. According to Intel Arria 10 marketing collateral, the part supports CPRI up to 9.8 Gbps for direct connection to remote radio heads, and 24 transceivers enable multi-antenna MIMO arrays. The I1 industrial temperature grade handles outdoor or near-antenna installations. The 900K logic elements absorb mid-tier FFT and direction-finding algorithms without external DSP, reducing BOM and PCB complexity. Estimated: full 1024-point FFT at 200+ MSPS fits within DSP budget.
추천
Medical Imaging Accelerator Card
The 10AX090U2F45I1SG supports medical imaging accelerators such as CT, MRI, and ultrasound front-ends where 900K logic elements and variable-precision DSP enable real-time image reconstruction. According to Intel Arria 10 datasheet, hard PCIe Gen3 x8 IP connects the FPGA to host CPUs at 8 GT/s with low latency, while 24 transceivers carry high-speed ADC data at up to 12.5 Gbps per lane. The 59 Mbit embedded block RAM absorbs pipeline stages and line buffers without external SRAM, reducing BOM. Industrial temperature supports OR-integrated imaging carts and ruggedized field equipment.
추천
Test and Measurement Instrumentation
The 10AX090U2F45I1SG is a strong fit for high-end oscilloscopes, protocol analyzers, and BERT equipment because the 24 transceivers handle multi-standard serial I/O including PCIe, SATA, USB 3.0, and 10GbE. According to the Arria 10 family datasheet, the 480 user I/Os interface to ADC/DAC front-ends with parallel LVDS lanes, while 900K LEs implement protocol-aware triggers and deep acquisition memory. The U2 speed grade supports high sample-rate DSP, and industrial temperature extends deployment to production-line and field environments. Estimated: 4-8 channel 25 Gbps pattern generator fits in the F45 FCBGA thermal envelope.
추천
Broadcast Video Processing and Contribution Encoders
The 10AX090U2F45I1SG suits broadcast video processing because of its 24 transceivers supporting SDI rates up to 12G-SDI, JPEG 2000 compression cores, and 900K LEs for multi-channel video pipelines. According to Intel Arria 10 application notes, hard HDMI 2.0 and DisplayPort 1.4 IP blocks accelerate AV I/O integration, while the industrial temperature grade supports outside-broadcast trucks and harsh studio environments. The 59 Mbit embedded block RAM absorbs multiple frames of 4K video buffering. Estimated: 4-channel 12G-SDI ingest with simultaneous JPEG 2000 encode fits within DSP and logic budgets.
추천
PCIe Accelerator Card for Data Center Offload
The 10AX090U2F45I1SG builds PCIe Gen3 x8 accelerator cards because the hard PCIe Gen3 controller integrates seamlessly with host CPUs at 8 GT/s. According to Intel's Arria 10 datasheet, 24 transceivers enable QSFP+ network I/O for distributed acceleration fabrics, while 900K LEs implement custom compute kernels (compression, encryption, ML inference). DDR4 with hard controllers supports up to 4 ranks at 2133 MT/s with ECC. The FCBGA-1932 package and industrial temperature allow card-edge and edge-server deployments. Estimated: 100 Gbps aggregate I/O plus 32 GB DDR4 buffer fits power and thermal envelope with appropriate heatsink.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX090U2F45I1SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX090U2F45E2SG | 10AX090U2F45E2LG | 10AX090U2F45E1SG | 10AX090U1F45I1SG | 10AX090U1F45E1SG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Package | F45 FCBGA-1932 (45 mm x 45 mm) | F45 FCBGA-1932 - same | F45 FCBGA-1932 - same | F45 FCBGA-1932 - same | F45 FCBGA-1932 - same | F45 FCBGA-1932 - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | U2 (mid-tier) | U2 - same | U2 - same | U2 - same | U1 (-1 speed bin) | U1 (-1 speed bin) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +100C) | Commercial (0C to +100C) | Commercial (0C to +100C) | Industrial - same | Commercial (0C to +100C) |
| Transceivers | 24 channels up to 12.5 Gbps | 24 channels - same | 24 channels - same | 24 channels - same | 24 channels - same | 24 channels - same |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits - same | 59,234,304 bits - same | 59,234,304 bits - same | 59,234,304 bits - same | 59,234,304 bits - same |
주요 차별점
- Highest-density Arria 10 variant in F45 FCBGA-1932 (vs 10AS066K2F35I1SG)
- Industrial temperature grade with full transceiver count (vs 10AX090U2F45E2SG)
- U2 speed grade - cost-effective Fmax tier (vs 10AX090U3F45I1SG)
- Hard PCIe Gen3 x8 IP integrated (vs XC7A100T-2FGG676I (Xilinx Artix-7))
설계 노트
The FCBGA-1932 package dissipates substantial power at full transceiver utilization - up to approximately 40 W at 24 channels at 12.5 Gbps with high logic utilization. According to Intel Arria 10 thermal guidance, a heat sink with thermal interface material is mandatory, and the PCB must include at least 16 thermal vias under the center ground ball array. Without adequate cooling, the junction temperature can exceed 100C under industrial load. Estimated: at 40 W and theta_JA = 0.6 C/W (with heat sink), the junction rise is approximately 24C above ambient.
The 1932-ball FCBGA at 1.0 mm pitch demands a minimum of 16 PCB layers with HDI microvia construction. According to Intel Arria 10 hardware design guidelines, route the transceiver reference clocks on an inner stripline layer with controlled impedance of 100 ohm differential, and use a continuous ground reference plane beneath all high-speed traces. BGA breakout fan-out should follow a dog-bone or via-in-pad pattern with at least 4 mil trace and 8 mil space. Length matching within 0.127 mm (5 mil) per transceiver lane is required.
Power-on sequencing for the Arria 10 GX requires the core VCC to ramp first, then VCCPT, VCCAUX, VCCIO, and transceiver supplies in a defined order per Intel's power management guide. Estimated: 0.9V core at 30-40A requires a 6-phase buck regulator with output ripple under 30 mVpp. Hold nCONFIG low until all rails are stable. Voltage droops during configuration can corrupt the bitstream, so bulk decoupling must provide at least 1 ms of hold-up at full load current.
Do not leave unused transceiver channels floating - follow the Intel Arria 10 pin connection guidelines and tie unused TX/RX pins through 10 kohm to GND to prevent oscillation. According to Intel application notes, unused 10 GbE and PCIe lanes must have specific reference clock termination. Missing JTAG pull-ups on nCONFIG or nSTATUS during board bring-up is a common cause of configuration failure. Always include a JTAG header with all four JTAG signals plus 10 kohm pull-ups to VCCIO.
High-speed transceiver routing must maintain 100 ohm differential impedance with no more than two vias per differential pair, and intra-pair skew below 0.127 mm (5 mil). Per Intel's transceiver layout guidelines, separate adjacent transceiver channels by at least 4x the dielectric height to minimize crosstalk. Reference clock traces must be length-matched within 0.05 mm between P and N. Use an embedded microstrip or symmetric stripline topology with a continuous ground plane beneath; never cross reference clock traces over plane splits.
규정 준수 정보
RoHS compliant per SG suffix in MPN. AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade IC. REACH and halogen-free status not explicitly listed in provided distributor data; consult Intel product declaration documents for confirmation.
