10AX090U1F45E1SG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel
MPN: 10AX090U1F45E1SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11369.23 | $11,369.23 |
| 10 | $10850 | $108,500.00 |
| 50 | $9995 | $499,750.00 |
| 100 | $9450 | $945,000.00 |
| 250 | $8750 | $2,187,500.00 |
Drop-in alternatives for 10AX090U1F45E1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090S4F45I3SG
✅ Drop-In✓ In Stock
$4520 / Unit
View Datasheet →10AX090S3F45E2SG
✅ Drop-In✓ In Stock
$5320 / Unit
View Datasheet →10AX090S2F45E2SG
✅ Drop-In✓ In Stock
$2050 / Unit
View Datasheet →10AX090S1F45E1SG
✅ Drop-In✓ In Stock
$8200 / Unit
View Datasheet →10AX090N2F45E2SG
✅ Drop-In✓ In Stock
$4943.22 / Unit
View Datasheet →10AX090U1F45E1SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Family | Arria 10 |
| Logic Elements (LE) | 900000 |
| Embedded Memory Bits | 59234304 |
| Total RAM Bits | 59,234,304 bit |
| Number of I/O | 480 |
| Number of Transceivers | 24 |
| Transceiver Data Rate | 10.3125 Gbps |
| Number of PLLs | 48 (fractional) |
| Core Voltage VCC | 0.9 V |
| Speed Grade | -E1 (fastest) |
| Operating Temperature Grade | Extended |
| Process Technology | 20 nm |
| Package | 1932-BBGA, FCBGA |
| Package Type | FCBGA (Flip-Chip BGA) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10AX090U1F45E1SG fcbga (flip-chip bga) Pin Configuration Guide
Complete pinout information for 10AX090U1F45E1SG (fcbga (flip-chip bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090U1F45E1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090U1F45E1SG is suitable for 6 applications: 100 Gbps Network Interface Card, 4K/8K Video Broadcast Equipment, ASIC Prototyping Platform, Wireless Baseband Processing, High-Performance Computing Acceleration, Industrial Test and Measurement.
100 Gbps Network Interface Card
The 10AX090U1F45E1SG's 24 transceiver channels at 10.3125 Gbps aggregate to 248 Gbps full-duplex bandwidth, which is the right envelope for a 4x25 GbE or 1x100G NIC. The 900K logic elements fit packet classification, custom header parsing, and on-card traffic shaping firmware. The hard PCIe Gen3 x8 IP block provides low-latency host offload, and the embedded 59 Mbit memory buffer supports cut-through forwarding without external SRAM.
Recommended
4K/8K Video Broadcast Equipment
The 900K logic elements and 1,518 variable-precision DSP blocks of the 10AX090U1F45E1SG are well-suited to multi-channel 4K (or single 8K) HEVC / JPEG-XS video processing pipelines. The 24 transceivers deliver up to 12G-SDI / SMPTE-2022 transport over coax at 12 Gbps. Internal M20K memory blocks (59 Mbit) provide line buffers and motion-estimation scratch RAM without external DDR access latency, critical for broadcast frame-burst requirements.
Recommended
ASIC Prototyping Platform
ASIC prototyping is a canonical use case for the 10AX090U1F45E1SG, with 900K logic elements and 24 transceivers sufficient to map mid-complexity ASIC RTL blocks. The Quartus Prime design flow lets engineers partition an ASIC across multiple Arria 10 devices via low-latency transceiver bridges. Industrial-grade variants like 10AX090S4F45I3SG add thermal headroom for emulator chassis that run hot during bring-up. The 0.9 V core rail simplifies multi-FPGA power distribution.
Recommended
Wireless Baseband Processing
The 10AX090U1F45E1SG fits 4G LTE and 5G NR small-cell baseband DSP acceleration where 1,518 18x19 multipliers deliver over 2,700 GMACs of signal-processing throughput. The 24 transceivers handle CPRI / eCPRI fronthaul to RRUs at 9.8 Gbps per link, and the 48 fractional PLLs support mixed cellular / GNSS / Wi-Fi clock domains. Extended-temperature operation matches outdoor small-cell thermal envelopes.
Recommended
High-Performance Computing Acceleration
HPC and finance workloads exploit the 10AX090U1F45E1SG's 1,518 DSP blocks and 59 Mbit embedded memory for low-latency kernels: FFT-based risk calculation, HFT order-book processing, and option pricing Monte Carlo engines. The 24 transceivers aggregate multiple 10 GbE or PCIe Gen3 host links; the 0.9 V core keeps per-card power below 35 W at full utilization. Quartus Prime's OpenCL SDK lets finance developers port C kernels to fabric without VHDL expertise.
Recommended
Industrial Test and Measurement
Automated test equipment (ATE) and high-end oscilloscopes leverage the 10AX090U1F45E1SG's 24 transceivers to aggregate up to 48 channels of 6 Gbps digitizer data, while the 900K logic elements process FFT-based spectral analysis in real time. The 48 PLLs provide picosecond-precision trigger clocks, and the embedded M20K memory provides deep capture buffers. Extended-temperature variants are appropriate for rack-mounted factory-floor test instrumentation.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090U1F45E1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090S4F45I3SG | 10AX090S3F45E2SG | 10AX090S2F45E2SG | 10AX090S1F45E1SG | 10AX090N2F45E2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-FCBGA (F45) | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same |
| Logic Elements | 900000 | 900000 | 900000 | 900000 | 900000 | 900000 |
| Speed Grade | -E1 (fastest) | -I3 | -E2 | -E2 | -E1 | -E2 |
| Temperature Grade | Extended | Industrial | Extended | Extended | Extended | Extended |
| Transceivers | 24 | 24 | 24 | 24 | [DATA_NEEDED] | 0 (N-variant, no transceivers) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Process | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
| Approx. Unit Price (USD) | 11369.23 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest Fmax (-E1 speed grade) in the Arria 10 family (vs 10AX090S3F45E2SG)
- 24 transceiver channels at 10.3125 Gbps (vs 10AX090N2F45E2SG)
- Industrial-grade option with same pinout (vs 10AX090S4F45I3SG)
Design Notes
The 10AX090U1F45E1SG draws roughly 25-40 W at full transceiver utilization; use the Intel Arria 10 PowerPlay Early Estimator spreadsheet before committing to a power-supply design. The 0.9 V VCC core requires a buck regulator with at least 40 A peak capability and +/-1 percent voltage accuracy. Decouple VCC with at least eight 47 uF ceramic + 220 uF bulk capacitors placed as close to the package as the BGA land pattern allows. Estimated: at VIN=12 V, VOUT=0.9 V, and 35 W dissipation, input current is approximately 3.5 A and buck-conductor losses should be budgeted at 4-6 percent of output power.
The 1932-ball FCBGA exposes a thermal die-side pad; design the PCB with a top-layer copper pour directly under the BGA and at least eight thermal vias (0.3 mm drill, 0.5 mm pitch) connecting to an internal copper plane. Estimated: at 35 W dissipation, 12-layer FR4 stack-up with 2 oz copper, theta-JA is approximately 1.2 C/W, giving junction-to-ambient temperature rise of 42 C above 25 C ambient - acceptable up to TA = 50 C but requires airflow above 55 C. Refer to the Arria 10 Thermal Management User Guide for layout details.
The 1932-ball FCBGA requires at least a 12-layer PCB with 0.4 mm BGA pitch escape routing, microvia / stacked-via technology for fan-out, and a 1.5 mm minimum keep-away for trace-and-via return-path continuity. Use 100 ohm differential impedance for the SERDES lanes (PCIe Gen3, 10 GbE) and 50 ohm single-ended for control and clock paths. Place configuration flash (EPCQ256 or compatible) within 3 inches of the FPGA dedicated AS configuration pins and series-terminate the DCLK / DATA traces per the Arria 10 Configuration User Guide.
Do not hot-swap the FCBGA during rework without baking the part per JEDEC J-STD-033 (the FCBGA absorbs moisture and is at risk of 'popcorn' damage). Always configure unused transceivers to a no-PI mode in the Quartus QSF to save 0.5-1 W per channel. LVDS I/O standards on 10AX090 require an external 100 ohm termination resistor across each differential pair; the internal termination option only works with SSTL/HSTL. Estimated: forgetting the termination resistor costs approximately 0.5 mA per channel and adds 50 mV of ringing on switching edges.
Compliance Information
RoHS compliant and lead-free per Altera product page. AEC-Q100 not applicable (FPGA, not automotive IC). Halogen-free status not explicitly stated in vendor data - set to unknown.
