EP2AGX125EF35I3G - Arria II GX FPGA, 118K LE, 452 I/O | Intel
부품 번호: EP2AGX125EF35I3G ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $656.62 | $656.62 |
| 10 | $590.96 | $5,909.60 |
| 100 | $525.3 | $52,530.00 |
| 500 | $459.63 | $229,815.00 |
| 1,000 | $410.39 | $410,390.00 |
EP2AGX125EF35I3G 개요
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/ALMs), programmable interconnects, and dedicated hard IP blocks (memory controllers, transceivers, DSP slices). FPGAs sit alongside ASICs and microcontrollers in the digital logic hierarchy, offering hardware-timeliness of ASICs with the flexibility of software-reprogrammable designs. They are used to implement parallel data paths, custom bus protocols, signal processing pipelines, and prototype ASIC functionality before tape-out.
Key features of the EP2AGX125EF35I3G include 118,143 logic elements and 49,640 ALMs, providing roughly 2x the logic density of mid-range Cyclone devices. The 7.93 Mbit embedded memory supports packet buffers, FIFO depth, and DSP coefficient storage, while the integrated transceivers operate up to 3.75 Gbps and 8 SERDES channels at 5 Gbps, enabling PCIe Gen1/Gen2 and 1G/10G Ethernet implementations. The 1152-ball FCBGA package exposes 452 user I/Os, supporting wide parallel buses and high-pin-count memory interfaces.
Architecturally, the Arria II GX family combines 8-input fracturable ALMs, M9K memory blocks, MLAB distributed RAM, and dedicated variable-precision DSP blocks. Hard IP for PCIe Gen2, 10/100/1000 Ethernet MACs, and external memory controllers reduces soft-logic utilization and simplifies timing closure. The 40 nm process balances static and dynamic power, and the 'I3' speed grade places timing performance between I4 and I5 within the Arria II family.
Typical applications include high-speed serial protocol bridging (PCIe Gen2 endpoints, 1G/10G Ethernet MACs), video broadcast and processing pipelines, wireless baseband and digital IF, military radar signal processing, and industrial imaging. The wide logic and transceiver bandwidth also make it well-suited for ASIC prototyping and firmware-accelerated compute.
When designing with this FPGA, ensure the Quartus II design suite (13.0 or later) is used for synthesis and place-and-route, and validate pin assignments against the FCBGA-1152 package pinout. Power planning should budget for both the core (VCC, VCCPT) and transceiver (VCCA, VCCP, VCCH) rails, with decoupling sized per the Arria II GX pin connection guidelines.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate the EP2AGX125EF35I3G against similar mid-range FPGA options.
드롭인 대체품: EP2AGX125EF35I3G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX125EF35I3G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Transceivers, Mounting Type, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX125EF35I5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1190 / 개
데이터시트 보기 →EP2AGX125EF35C7G
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP2AGX125EF35C6G
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2AGX125EF35C5G
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2AGX125EF35C4G
✅ 드롭인✓ 재고 있음
$1290 / 개
데이터시트 보기 →EP2AGX125EF29I5G
✅ 드롭인✓ 재고 있음
$861.62 / 개
데이터시트 보기 →EP2AGX125EF29I3G
✅ 드롭인✓ 재고 있음
$590.9643 / 개
데이터시트 보기 →EP2AGX125EF35I3G 최대 정격 & 전기적 특성
| Series | Arria II GX |
| Logic Elements | 118143 LE |
| Adaptive Logic Modules (ALMs) | 49640 ALM |
| Embedded Memory | 7.93 Mbit |
| Total RAM Bits | 8315904 bit |
| Number of I/O | 452 |
| 패키지 / 케이스 | 1152-BBGA, FCBGA |
| 장착 스타일 | SMD/SMT |
| 동작 온도 | -40C to +100C (Industrial) |
| Speed Grade | I3 |
| Process Node | 40 nm |
| Packaging | Tray |
| RoHS 상태 | Compliant |
| Lead Free | Yes |
| Transceivers | Up to 8 SERDES channels (per family) |
EP2AGX125EF35I3G 1152-bbga, fcbga 핀 구성 가이드
EP2AGX125EF35I3G(1152-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX125EF35I3G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX125EF35I3G 적합 용도: 7 애플리케이션s: PCIe Gen2 Endpoint Card, 1G/10G Ethernet MAC Bridging, Video Broadcast Processing Pipeline, Wireless Baseband and Digital IF, Industrial Imaging and Machine Vision, ASIC Prototyping Platform, Military Radar Signal Processing.
PCIe Gen2 Endpoint Card
The EP2AGX125EF35I3G's hard PCIe Gen2 IP block and integrated transceivers operating up to 5 Gbps make it a strong fit for PCIe Gen1/Gen2 endpoint implementations such as data acquisition cards, FPGA co-processors, and protocol bridging adapters. The 118,143 logic elements provide ample capacity for DMA engines, scatter-gather controllers, and user applications co-resident with the PCIe hard IP, while the 452 user I/Os support wide local buses to DSPs or memory. Industrial temperature rating allows deployment in server backplanes and test equipment environments.
추천
1G/10G Ethernet MAC Bridging
With integrated 1G/10G Ethernet MAC hard IP and 8 SERDES channels capable of 5 Gbps, the EP2AGX125EF35I3G can implement multi-port Ethernet bridges, network taps, and protocol converters. The 7.93 Mbit embedded memory supports packet buffers for line-rate processing, and the 49,640 ALMs leave enough headroom for L2/L3 switching logic, VLAN tagging, and timestamping. The 1152-ball FCBGA exposes sufficient I/Os for SFP+ cages, management interfaces, and status LEDs.
추천
Video Broadcast Processing Pipeline
The EP2AGX125EF35I3G's variable-precision DSP blocks, large embedded memory, and 452 user I/Os are well-matched to broadcast video pipelines implementing SDI de/embedders, format converters, color-space transformers, and frame synchronizers. The industrial temperature rating suits broadcast equipment racks and outside broadcast vehicles. Quartus II video IP cores accelerate SD/HD/3G-SDI development, and the wide I/O count supports parallel camera sensor interfaces and HDMI/DVI bridge chips.
추천
Wireless Baseband and Digital IF
The EP2AGX125EF35I3G's transceiver channels up to 3.75 Gbps and 5 Gbps SERDES, combined with DSP blocks running at hundreds of MHz, support wireless baseband processing, digital IF down/up-conversion, and CPRI links to remote radio heads. The 118K logic elements handle multi-antenna MIMO equalization, channel coding (LTE turbo, 5G LDPC), and digital predistortion loops. Industrial temperature ensures reliable operation in base station enclosures and tactical radio platforms.
추천
Industrial Imaging and Machine Vision
With 452 user I/Os, 7.93 Mbit of embedded memory for line/frame buffers, and the industrial -40C to +100C temperature range, the EP2AGX125EF35I3G fits machine vision systems in factory automation, semiconductor inspection, and robotics. The fabric can implement Camera Link, CoaXPress, and GigE Vision interfaces alongside real-time image processing (filtering, thresholding, blob analysis). The 40 nm process delivers a favorable power envelope for fanless industrial enclosures.
추천
ASIC Prototyping Platform
Engineers use the EP2AGX125EF35I3G as a building block in multi-FPGA ASIC prototyping platforms because its 118,143 logic elements can absorb 2-5 million ASIC gates, the 452 I/Os ease pin multiplexing between FPGAs, and Quartus II's incremental compile flow supports modular partitioning. The high-speed transceivers simplify chip-to-chip interconnect for partitioned ASIC designs running at hundreds of MHz. Industrial temperature enables prototyping in lab and field environments.
추천
Military Radar Signal Processing
The EP2AGX125EF35I3G's combination of DSP blocks, embedded memory, SERDES, and industrial temperature rating makes it a fit for radar pulse compression, moving target indication (MTI), and phased-array beamforming subsystems. The 7.93 Mbit memory supports range-Doppler map storage, while the transceivers handle high-speed ADC/DAC data links. Conformal coating and ruggedization partners typically integrate this part into defense subsystems where lifecycle continuity is critical.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX125EF35I3G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX125EF35C6G | EP2AGX125EF35C5G | EP2AGX125EF35I5G | EP2AGX125EF29I5G |
|---|---|---|---|---|---|
| Manufacturer Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA FCBGA (EF35) | 1152-BBGA FCBGA (EF35) - same | 1152-BBGA FCBGA (EF35) - same | 1152-BBGA FCBGA (EF35) - same | 780-BBGA FCBGA (EF29) - smaller |
| Logic Elements | 118143 LE | 118143 LE | 118143 LE | 118143 LE | 118143 LE |
| Adaptive Logic Modules | 49640 ALM | 49640 ALM | 49640 ALM | 49640 ALM | 49640 ALM |
| Embedded Memory | 7.93 Mbit | 7.93 Mbit | 7.93 Mbit | 7.93 Mbit | 7.93 Mbit |
| User I/Os | 452 | 452 | 452 | 452 | 376 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I3 | C6 | C5 | I5 | I5 |
주요 차별점
- Industrial temperature variant of the highest-density Arria II GX with 118K LE in 1152-ball FCBGA (vs EP2AGX125EF35C6G)
- Mid-range speed grade position with best cost/performance balance for industrial Arria II GX (vs EP2AGX125EF35I5G)
- High pin-count 1152-ball FCBGA option within Arria II GX family (vs EP2AGX125EF29I5G)
설계 노트
The FCBGA-1152 package has a typical theta_JA around 11 C/W with a properly designed thermal via array under the central BGA balls and a heat sink. Estimated: for a 1.0 V core at 4 A (4 W), junction rise is ~44 C above ambient without a heat sink, exceeding the 100 C upper limit in industrial use cases. Always populate the central ground/power via array and follow the Arria II GX pin connection guidelines for thermal relief.
The EP2AGX125EF35I3G requires separate rails for VCC (core), VCCPT (PLL), VCCA (PLL analog), and the transceiver supplies (VCCP, VCCH, VCCA_TX/RX). Estimated: a typical 4-transceiver, 60% utilization design draws 2.5-4 A from VCC and 0.5-1.5 A per transceiver rail. Decouple each rail with bulk (22-47 uF), mid (1-10 uF), and high-frequency (0.1 uF + 1 nF) capacitors placed within 5 mm of the BGA balls, per the Arria II GX pin connection guidelines.
The 1152-ball FCBGA with 1.0 mm pitch requires 6+ layer PCB with controlled impedance (100 ohm differential for transceivers, 50 ohm single-ended for general I/O). All BGA balls must be soldered; missed balls cause open connections that are difficult to debug post-assembly. Use microvia stackups (e.g., 1+6+1) to escape the dense center ball array and provide an uninterrupted ground/power plane reference for controlled impedance.
Transceiver channels operating at 5 Gbps require strict length matching (intra-pair skew <5 mils, pair-to-pair skew <150 mils) and continuous reference plane under the differential pair routing. Per the Arria II GX handbook, use 100 ohm differential impedance and avoid 90-degree bends. Place AC-coupling capacitors as close to the TX balls as possible, with the capacitor body matching trace width to minimize impedance discontinuities.
Do not assume the Arria II GX configuration bitstream is forward-compatible with newer Quartus II versions. Use the Quartus II version certified for the I3 speed grade (typically 13.0-13.1) for bitstream generation. Lock all pin assignments early in the design cycle; package migration to the smaller EF29 package requires re-synthesis and re-layout due to different I/O pinouts.
규정 준수 정보
RoHS and lead-free compliance confirmed per Intel/Altera product declaration. Industrial temperature grade is not equivalent to AEC-Q100 automotive qualification. Last-time-buy status as of 2026-09-08 per distributor listings.