10AX115R4F40E3LG - Arria 10 GX FPGA, 1.15M LE, 1517-FCBGA | Intel / Altera
부품 번호: 10AX115R4F40E3LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6555.23 | $6,555.23 |
| 10 | $6227.47 | $62,274.70 |
| 100 | $5768.6 | $576,860.00 |
| 500 | $5112.95 | $2,556,475.00 |
| 1,000 | $4588.66 | $4,588,660.00 |
10AX115R4F40E3LG 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP slices, and hardened IP blocks such as transceivers and PCIe interfaces. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) within integrated circuits, sitting alongside ASICs and ASSPs in the silicon design landscape. Unlike fixed-function ASICs, FPGAs are re-programmed in the field via HDL bitstreams, enabling rapid prototyping, hardware acceleration, and time-to-market advantages in compute-intensive designs.
Key features of the 10AX115R4F40E3LG include 28.05 Gbps backplane-capable transceivers, hardened Gen3 PCIe x8 IP blocks, up to 1,518 18x19 multipliers in the variable-precision DSP blocks, and a 0.9V core voltage with on-chip voltage regulation. The device is built on TSMC's 20nm process and integrates 1.5 Tbps of serial bandwidth, making it suitable for 100G/400G datapath aggregation, broadcast video processing, and PCIe Gen3 accelerator cards. The 1517-ball FCBGA (also denoted F40) uses flip-chip packaging for superior signal integrity at multi-gigahertz speeds.
The architecture combines a mid-range logic capacity with high-end serial transceivers, providing a balanced cost/performance profile for applications that need both parallel DSP throughput and high-speed serial I/O. Designers leverage the hardened Gen3 PCIe IP and the high-DSP-count fabric to accelerate signal-processing pipelines, while the embedded memory subsystem (68.8 Mbits) eliminates the need for external SRAM in many workloads.
Typical applications include 100G/400G Ethernet line cards, broadcast Studio and 4K/8K video processing, military radar and electronic-warfare DSP, medical imaging accelerators, and high-performance compute (HPC) co-processors. The Arria 10 GX family is also widely deployed in 5G fronthaul/backhaul equipment and ASIC prototyping platforms.
When designing with the 10AX115R4F40E3LG, plan the PCB stack-up carefully: the FCBGA-1517 package requires high-density interconnect (HDI) with micro-vias and matched impedance routing for the transceiver channels. Use Altera's Quartus Prime design suite for synthesis, place-and-route, and timing closure. Expect multi-month lead times due to the silicon wafer allocation cycle.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not consolidated on the official Altera/Intel product page.
드롭인 대체품: 10AX115R4F40E3LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115R4F40E3LG (동일 폼 팩터 및 풋프린트) — 차이점: DSP Blocks, Package, Process Technology, Embedded Memory Bits, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115R3F40E3LG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AX115R4F40E3SG
✅ 드롭인✓ 재고 있음
$3925 / 개
데이터시트 보기 →10AX115R4F40I3LG
✅ 드롭인✓ 재고 있음
$3250 / 개
데이터시트 보기 →10AX115R2F40E3LG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AX115R1F40E3LG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AX115R4F40E3LG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 |
| Embedded Memory Bits | 68,857,856 (68.86 Mbit) |
| User I/O Pins | 342 |
| Transceiver Data Rate (max) | 28.05 Gbps |
| Number of Transceivers | 24 |
| DSP Blocks | 1,518 variable-precision 18x19 multipliers |
| Hardened PCIe IP | Gen3 x8 |
| Process Technology | TSMC 20nm |
| Core Voltage | 0.9 V |
| 패키지 | 1517-ball FCBGA (F40, flip-chip BGA) |
| 동작 온도 | 0C to +100C (E3 commercial) |
| RoHS 상태 | Compliant |
| Speed Grade | 4 (mid) |
10AX115R4F40E3LG 1517-ball fcbga (f40, flip-chip bga) 핀 구성 가이드
10AX115R4F40E3LG(1517-ball fcbga (f40, flip-chip bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX115R4F40E3LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX115R4F40E3LG 적합 용도: 7 애플리케이션s: 100G/400G Ethernet Line Cards, Broadcast Studio and 4K/8K Video Processing, PCIe Gen3 Accelerator Cards, Military Radar and Electronic Warfare DSP, Medical Imaging Accelerators (CT, MRI, Ultrasound), 5G Fronthaul and Backhaul Equipment, ASIC Prototyping and Emulation.
100G/400G Ethernet Line Cards
The 10AX115R4F40E3LG is purpose-built for 100G and 400G Ethernet line cards thanks to its 24 transceivers at 28.05 Gbps and ~1.5 Tbps aggregate serial bandwidth. The hardened 100G MAC + PCS IP core, available as a Quartus reference design, accelerates time-to-market for OTN/PTN transport and data-center top-of-rack switches. The 1,518 variable-precision DSP blocks also handle FEC and packet classification at line rate without external co-processors.
추천
Broadcast Studio and 4K/8K Video Processing
The 1.15M logic elements, 1,518 DSP blocks and 68.86 Mbit of embedded memory make the 10AX115R4F40E3LG a strong fit for 4K/8K broadcast video processors, multi-channel SDI/HDMI aggregation and real-time video effects. The hardened PCIe Gen3 x8 IP enables high-bandwidth host links for ingest/playout servers, while the M20K memory blocks serve as line buffers for color-space conversion and scaling. Designers commonly pair this device with external 12G-SDI cable equalizers.
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PCIe Gen3 Accelerator Cards
The 10AX115R4F40E3LG integrates a hardened Gen3 x8 PCIe IP block that delivers up to 8 Gbps per lane (64 Gbps aggregate) without consuming FPGA logic resources. This frees the 1.15M LE fabric to implement custom accelerators such as compression, machine-learning inference, or database query engines. The device is widely used in hyperscale data centers for FPGA-as-a-service (FaaS) deployments where card hot-swap and partial reconfiguration are required.
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Military Radar and Electronic Warfare DSP
The Arria 10 GX family is widely used in military radar and electronic-warfare systems where its 28.05 Gbps transceivers feed wideband ADC/DAC front-ends and the 1,518 DSP blocks run pulse-compression, MTI, and beamforming algorithms. The 68.86 Mbit of embedded memory serves as range-Doppler map storage, reducing reliance on external SRAM. Ruggedized boards built around the 10AX115R4F40I3LG (industrial temp) are deployed in naval and airborne platforms.
추천
Medical Imaging Accelerators (CT, MRI, Ultrasound)
CT, MRI and ultrasound systems use the 10AX115R4F40E3LG to accelerate image-reconstruction algorithms such as filtered back-projection and parallel MRI (SENSE/GRAPPA). The variable-precision DSP blocks deliver up to 1.5 TFLOPs of DSP throughput, while the on-chip M20K memory buffers 3D voxel data. PCIe Gen3 x8 connects the FPGA to the host CPU for streaming DICOM image reconstruction in real time, with FDA/IEC 60601 compliance handled at the system level.
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5G Fronthaul and Backhaul Equipment
5G fronthaul (CPRI/eCPRI) and backhaul routers rely on the 10AX115R4F40E3LG for high-density CPRI aggregation, with each 28.05 Gbps transceiver supporting 24x CPRI option 10 or multiple eCPRI 25G links. The hardened 100G MAC IP enables direct handoff to transport networks. Compared to ASICs, the FPGA path lets operators support multiple functional splits (Option 7-2, 8) with a single board design, reducing SKU proliferation.
추천
ASIC Prototyping and Emulation
The 10AX115R4F40E3LG is a popular target for ASIC and SoC prototyping platforms because its 1.15M LE fabric can host multi-million-gate ASIC designs with realistic timing. Multiple Arria 10 GX FPGAs can be cascaded via 28.05 Gbps transceivers to build capacity-scalable prototyping boards, with Quartus Prime Pro providing TDM-based multi-FPGA partitioning. The hardened PCIe Gen3 IP also serves as a high-bandwidth debug interface to the host workstation.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX115R4F40E3LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115R3F40E3LG | 10AX115R4F40E3SG | 10AX115R4F40I3LG | 10AX115R2F40E3LG | 10AX115R1F40E3LG |
|---|---|---|---|---|---|---|
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | 4 (mid) | 3 | 4 | 4 | 2 | 1 |
| Temperature Grade | E3 (commercial 0C to +100C) | E3 (commercial) | E3 (commercial, SG variant) | I3 (industrial -40C to +100C) | E3 (commercial) | E3 (commercial) |
| Transceiver Count | 24 | 24 | 24 | 24 | 24 | 24 |
| Embedded Memory | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit |
| Hardened PCIe IP | Gen3 x8 | Gen3 x8 | Gen3 x8 | Gen3 x8 | Gen3 x8 | Gen3 x8 |
주요 차별점
- Highest speed grade (4) in the F40 footprint family (vs 10AX115R3F40E3LG)
- Commercial temperature (E3) optimization (vs 10AX115R4F40I3LG)
- Hardened Gen3 x8 PCIe IP (vs 10AX090R4F40E3LG)
설계 노트
The 1517-ball FCBGA F40 package requires an HDI PCB stack-up with micro-via-in-pad and matched-length routing for the 28.05 Gbps transceiver channels. Use a 14-16 layer stack-up with the transceiver balls routed to break-out vias on inner layers; reference the Altera Arria 10 GX pin connection guidelines for via pattern, antipad dimensions, and AC-coupled capacitor placement. Estimated: at 1.0mm pitch, breakout routing typically requires 4-6 routing layers to escape cleanly.
For 28.05 Gbps links, controlled-impedance differential routing (typically 85 ohm or 100 ohm) with length matching within 0.127mm (5 mil) is essential. Insert AC-coupling capacitors at the transmitter output or receiver input as defined in the Arria 10 GX transceiver user guide. Estimated: total channel insertion loss budget at 14 GHz is roughly 10 dB for backplane applications. Run 3D EM simulation (ANSYS HFSS or Cadence Clarity) before tape-out.
Power estimation: Arria 10 GX FPGAs with 24 transceivers and high logic utilization typically consume 30-50 W under full load. The FCBGA-1517 package requires a thermal management solution such as a heat spreader or direct-attach heatsink with thermal interface material. Estimate junction temperature using the Quartus Prime PowerPlay early power estimator and verify on hardware with on-die thermal diodes connected to the MAX10 EM100 temperature monitor.
Do not confuse the Arria 10 GX (R) family with the Arria 10 GT (N) family - they use different transceiver types and pin assignments despite sharing the F40 package outline. Always verify the OPN against the Quartus Prime device database before PCB layout. Also note that 0.9V core rails require a tolerance of +/-3% and may need dedicated PMIC sequencing for multi-rail power-up - consult the Arria 10 GX power management user guide for proper ramp ordering.
규정 준수 정보
RoHS compliance per Altera/Intel product page. AEC-Q100 not applicable - this is a high-end FPGA, not an automotive-qualified IC. Halogen-free status not explicitly stated in the verified web data; refer to the official Intel material declaration. REACH SVHC statements available from Intel upon request.
