10AX115R4F40I3LG - Arria 10 GX FPGA, 1.15M LE, 342 I/O, 1517-FCBGA | Intel
부품 번호: 10AX115R4F40I3LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3995 | $39,950.00 |
| 100 | $3750 | $375,000.00 |
| 500 | $3500 | $1,750,000.00 |
| 1,000 | $3250 | $3,250,000.00 |
10AX115R4F40I3LG 개요
What is an FPGA? A Field-Programmable Gate Array is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and high-speed transceivers connected by a programmable interconnect fabric. FPGAs are positioned between general-purpose microcontrollers (lower performance, fixed architecture) and ASICs (higher performance, non-recurring engineering cost, fixed function). Within the programmable logic hierarchy, the Arria 10 GX family targets mid- to high-end applications requiring a balance of logic density, transceiver bandwidth, and power efficiency - bridging the gap between Cyclone V/10 (low-cost) and Stratix 10 (high-performance).
Key features of the 10AX115R4F40I3LG include up to 28.05 Gbps backplane-capable transceivers, hard PCI Express Gen3 hard IP blocks, hard memory controllers supporting DDR4/DDR3/QDRII+/RLDRAM3, up to 1,518 DSP blocks for fixed- and floating-point signal processing, and partial reconfiguration support. The 'GX' suffix denotes integrated 28 Gbps transceivers optimized for high-speed serial connectivity. The device supports configuration via fast passive parallel (FPP), active serial (AS), passive serial (PS), and JTAG modes, with optional encryption and dual-image boot for secure remote updates.
Typical applications include high-performance digital signal processing (radar, beamforming, software-defined radio), 100G/400G Ethernet line cards, ASIC prototyping, medical imaging accelerators, and test & measurement backplanes. Designers pair the FPGA with external DDR4 memory, a flash configuration device (EPCQ-L), and a power management solution that meets Intel's PowerTree guidelines (typically using Intel Enpirion or Renesas ISL series regulators).
드롭인 대체품: 10AX115R4F40I3LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115R4F40I3LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, DSP Blocks, Process Technology, Family, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115R4F40E3LG
✅ 드롭인✓ 재고 있음
$4588.66 / 개
데이터시트 보기 →10AX115R4F40I3SG
✅ 드롭인✓ 재고 있음
$8470 / 개
데이터시트 보기 →10AX115R3F40I2SG
✅ 드롭인✓ 재고 있음
$6500 / 개
데이터시트 보기 →10AX115R2F40I2LG
✅ 드롭인✓ 재고 있음
$4310 / 개
데이터시트 보기 →10AX090R4F40I3LG
✅ 드롭인✓ 재고 있음
$5690 / 개
데이터시트 보기 →10AX115R4F40I3LG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| DSP Blocks | 1,518 (maximum per family) |
| Maximum User I/O | 342 |
| Transceivers | Up to 28.05 Gbps (GX family) |
| Process Technology | TSMC 20 nm |
| Core Voltage | 0.9 V |
| 패키지 | 1517-ball FCBGA (BBGA) |
| 동작 온도 | -40 °C to +100 °C (Industrial) |
| Hard Memory Controllers | Yes (DDR4, DDR3, QDRII+, RLDRAM3) |
| PCIe Hard IP | PCIe Gen3 x8 (hard IP block) |
| Configuration Modes | FPP, AS, PS, JTAG |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
10AX115R4F40I3LG 1517-ball fcbga (bbga) 핀 구성 가이드
10AX115R4F40I3LG(1517-ball fcbga (bbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX115R4F40I3LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX115R4F40I3LG 적합 용도: 6 애플리케이션s: High-Performance DSP / Radar Signal Processing, Software-Defined Radio Baseband, Medical Imaging Accelerator (Ultrasound / CT), ASIC Prototyping Platform, Test & Measurement Instrumentation, Broadcast Video Processing (4K/8K Studio Routers).
High-Performance DSP / Radar Signal Processing
The 10AX115R4F40I3LG's 1,518 DSP blocks, 28.05 Gbps-capable transceivers, and PCIe Gen3 hard IP make it a strong fit for phased-array radar and beamforming front-ends. Its 1.15M logic elements absorb complex FFT, pulse compression, and beam-steering algorithms in real time, while the -40 °C to +100 °C industrial grading supports outdoor and avionics enclosures. Pair the FPGA with dual-channel DDR4 (4 GB/s per channel) for sample buffering and a Renesas ISL80030 or Intel Enpirion power tree for core and transceiver rails.
추천
Software-Defined Radio Baseband
For 4G/5G small-cell and software-defined radio baseband, the 10AX115R4F40I3LG delivers CPRI/OBSAI connectivity through its 28 Gbps transceivers, plus DSP slices for channelisation, FFT/iFFT, and crest-factor reduction. The hard PCIe Gen3 IP interfaces directly to a host SoC or DSP co-processor, offloading physical-layer processing. The industrial temperature grade supports outdoor unit (ODU) deployment. A configuration device such as the EPCQ-L256 stores the bitstream with optional dual-image support for fail-safe firmware updates.
추천
Medical Imaging Accelerator (Ultrasound / CT)
The 10AX115R4F40I3LG supports multi-channel beamforming in ultrasound front-ends and CT reconstruction pipelines. Its 1,518 DSP blocks perform FIR filtering, Hilbert transforms, and envelope detection at sample rates up to 80 MSPS per channel. The PCIe Gen3 hard IP interfaces to a host PC for high-throughput image streaming at >1 GB/s. The 1517-ball FCBGA package's 0.8 mm ball pitch is compatible with standard JEDEC PCB stackups and 12-layer designs, easing layout for medical-OEM manufacturers.
추천
ASIC Prototyping Platform
The Arria 10 GX with 1.15M LE and 28 Gbps transceivers is widely adopted as an ASIC prototyping substrate, mapping large SoC RTL blocks for in-system verification. The F40 (1517-ball FCBGA) variant provides the highest user-I/O count in the family, supporting multi-bridge chip-to-chip connections. The hard memory controllers and PCIe Gen3 IP accelerate bring-up of typical SoC interfaces (DDR4, PCIe, USB 3.1, SATA). Combined with Intel's Quartus Prime Pro software and Bluespec SystemVerilog support, the 10AX115R4F40I3LG is a turnkey choice for pre-silicon validation.
추천
Test & Measurement Instrumentation
High-end oscilloscopes, BERTs, and protocol analyzers use the 10AX115R4F40I3LG for real-time serial pattern generation and decoding. The 28 Gbps transceivers support PCIe Gen3, USB 3.1 Gen2, SATA, and 10/25/100 GbE protocol analysis. The 1,518 DSP blocks accelerate eye-diagram rendering and jitter decomposition. Industrial temperature grading suits factory-floor and lab environments. A reference design typically pairs the FPGA with a multi-gigabit ADC, an EPCQ configuration flash, and an Intel Enpirion EM2xx series power management IC.
추천
Broadcast Video Processing (4K/8K Studio Routers)
Broadcast video routers and 8K frame synchronisers use the 10AX115R4F40I3LG for SDI de-embedding, audio muxing, and frame-store processing. The 342 user I/O allow dense multi-channel SDI (up to 36 simultaneous 12G-SDI links), while the 68 Mb embedded memory serves as line/frame buffers. Industrial temperature grading supports broadcast-van and outdoor-events deployment. Pair with M-LVDS or fiber transceivers, plus an EPCQ-L for configuration with golden-image redundancy.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX115R4F40I3LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115R4F40E3LG | 10AX115R4F40I3SG | 10AX115R3F40I2SG | 10AX115R2F40I2LG | 10AX090R4F40I3LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Speed Grade | 3 | 3 | 3 | 2 | 2 | 3 |
| Temperature Grade | Industrial (-40 to +100 °C) | Enhanced | Industrial | Industrial | Industrial | Industrial |
| Embedded Memory (bits) | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 53,248,000 |
| DSP Blocks | 1,518 (max family) | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
| User I/O | 342 | 342 | 342 | 342 | 342 | 342 |
| Process / Family | 20 nm Arria 10 GX | 20 nm Arria 10 GX | 20 nm Arria 10 GX | 20 nm Arria 10 GX | 20 nm Arria 10 GX | 20 nm Arria 10 GX |
주요 차별점
- 1.15M logic elements - highest in Arria 10 GX family (vs 10AX090R4F40I3LG)
- Speed grade 3 - higher worst-case Fmax than speed-grade 2 (vs 10AX115R3F40I2SG)
- Industrial temperature grade in standard lead-free package (vs 10AX115R4F40E3LG)
설계 노트
Estimated: at full utilisation (1.15M LE switching at 200 MHz toggle rate and full transceiver activity) the 10AX115R4F40I3LG can dissipate 25-35 W. The 1517-ball FCBGA requires a thermal management solution: pair the device with a 30x30 mm heatsink and 200 LFM airflow, or design a heat-spreader per Intel's Arria 10 thermal design guide. Use the integrated on-die temperature diode and external MAX31760 fan controller for closed-loop thermal regulation.
Intel's PowerTree for the 10AX115R4F40I3LG mandates separate rails for VCC (0.9 V core), VCCPT (0.85 V periphery/PLL), VCCBAT (battery/backup), VCCA_PLL (2.5 V analog PLL), VCCIO (1.2-3.3 V I/O bank), VCCR/VCCP/VCCPT_GXB (1.0-1.2 V transceiver), and VCCH_GXB (1.5 V transceiver helper). Use a multi-rail PMIC such as the Intel Enpirion EM2xx or Renesas ISL8225M to meet the strict power-on sequencing (VCC before VCCPT before VCCIO) specified in the datasheet.
The 1517-ball FCBGA uses a 0.8 mm ball pitch. Route signals on a 12-layer or 14-layer PCB stackup with microvia-in-pad for the breakout. Use Intel's pin connection guidelines (.pcf file) to determine which pins are no-connects and which differential pairs require length matching within 5 mil. Power-rail decoupling requires 0402/0201 capacitors placed as close to each ball as possible, plus 220 µF bulk capacitors at each rail entry point.
Do not assume all 342 user I/O are simultaneously available - the actual usable count depends on which transceiver and memory pins you enable. Do not enable both the AS and FPP configuration modes simultaneously without consulting the configuration handbook. Always read back the configuration bitstream via the CRC check feature and verify the design ID before user-mode execution to catch configuration memory corruption in field updates.
규정 준수 정보
RoHS and REACH compliance per Intel Arria 10 product environmental information. AEC-Q100 not applicable (FPGA is not an automotive-qualified part). Lead-free (Pb-free) FCBGA package, halogen-free per JEDEC JS709B.
