10AX115R3F40I2SG - Arria 10 GX FPGA, 1.15M LE, F40 FCBGA | Intel
MPN: 10AX115R3F40I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8281.05 | $8,281.05 |
| 10 | $7800 | $78,000.00 |
| 100 | $7200 | $720,000.00 |
| 500 | $6800 | $3,400,000.00 |
| 1,000 | $6500 | $6,500,000.00 |
Drop-in alternatives for 10AX115R3F40I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115R3F40E2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4925 / Unit
View Datasheet →10AX115R3F40I2LG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AX115R2F40I2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$7189.2 / Unit
View Datasheet →10AX115R2F40I2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4310 / Unit
View Datasheet →10AX115R2F40I1SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3490 / Unit
View Datasheet →10AX115N3F40I2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$7100 / Unit
View Datasheet →10AX115R3F40E2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1425 / Unit
View Datasheet →10AX115R2F40E2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$5410 / Unit
View Datasheet →10AX115R3F40I2SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Family | 10AX115 |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits |
| User I/O Count | 342 |
| Package | 1517-BBGA, FCBGA (F40) |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | I2 |
| Transceiver Channels | 24 (up to 17.4 Gbps) |
| Hard Memory Controllers | Yes (DDR4/DDR3) |
| PCIe Hard IP | Gen3 |
| DSP Blocks | Yes (variable-precision) |
| Process Node | 20 nm (TSMC) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
10AX115R3F40I2SG 1517-bbga, fcbga (f40) Pin Configuration Guide
Complete pinout information for 10AX115R3F40I2SG (1517-bbga, fcbga (f40) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115R3F40I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115R3F40I2SG is suitable for 6 applications: 100G/400G Optical Transport Network Line Cards, 4K/8K Broadcast Video Processing, 5G Baseband and Fronthaul Processing, Radar and Electronic Warfare Front-Ends, High-Performance Test & Measurement, Industrial High-Speed Protocol Bridging.
100G/400G Optical Transport Network Line Cards
The 10AX115R3F40I2SG's 24 transceiver channels at up to 17.4 Gbps natively support 100GbE (CAUI-4 / CAUI-10) and OTU4 line-rate processing without external muxponders, while its 1.15M LE fabric handles MAC framing, FEC, and OTN mapping. Hard PCIe Gen3 blocks ease co-processing with a host ASIC. Designers place the FPGA between optical modules and a switch ASIC, with the F40 FCBGA footprint providing ample balls for the high-lane-count SERDES. The industrial temperature grade supports outdoor OTN shelf deployments.
Recommended
4K/8K Broadcast Video Processing
The 10AX115R3F40I2SG provides 1.15M logic elements plus variable-precision DSP slices that accelerate 4K/8K video codecs, color space conversion, and HDR processing pipelines in broadcast studio and contribution equipment. Embedded memory of 68 Mbit absorbs line and frame buffers without external DDR, reducing BOM cost. The 17.4 Gbps transceivers route 12G-SDI or SMPTE 2110 uncompressed video streams between production switchers and playout servers.
Recommended
5G Baseband and Fronthaul Processing
The 10AX115R3F40I2SG's hard PCIe Gen3 blocks interface with baseband SoCs while the 17.4 Gbps transceivers support CPRI and eCPRI fronthaul links to remote radio heads at 4G/5G base stations. Hard DDR4 controllers feed massive IQ sample buffers at line rate. The 1.15M LE fabric implements L1 PHY, MAC, and scheduling algorithms in a single device. Industrial temperature grade suits outdoor small-cell and macro-cell deployments.
Recommended
Radar and Electronic Warfare Front-Ends
The 10AX115R3F40I2SG's combination of 24 transceivers at 17.4 Gbps and high DSP block density enables digital array radar beamforming, pulse compression, and electronic countermeasure signal processing in a single device. Hard memory controllers feed wideband ADC/DAC sample streams while the 1.15M LE fabric implements adaptive beam-steering weights in real time. Industrial-grade operation supports airborne and ground-mobile radar platforms.
Recommended
High-Performance Test & Measurement
The 10AX115R3F40I2SG powers protocol-aware test instruments (oscilloscopes, BERT, protocol analyzers) where its 17.4 Gbps transceivers drive high-speed serial stimulus and capture, and its 1.15M LE fabric implements multi-protocol decoding. Hard PCIe Gen3 connects to host processors for real-time waveform upload. Industrial temperature ensures stable operation in lab and field test environments.
Recommended
Industrial High-Speed Protocol Bridging
The 10AX115R3F40I2SG bridges between industrial protocols (EtherCAT, PROFINET, TSN) and high-speed serial standards (PCIe Gen3, USB 3.1, SATA) in factory automation controllers. The hard PCIe Gen3 and high-density fabric enable low-latency protocol translation without software intervention. Industrial temperature grade supports shop-floor deployment from -40C to +100C.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115R3F40I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115R3F40E2SG | 10AX115R3F40I2LG | 10AX115R2F40I2SG | 10AX115N3F40I2SG |
|---|---|---|---|---|---|
| Package | 1517-BBGA, FCBGA (F40) | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Temperature Grade | Industrial (-40C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I2 | E2 | I2 | I2 | I2 |
| Transceiver Variant | R3 (24 ch @ 17.4 Gbps) | R3 (24 ch @ 17.4 Gbps) | R3 (24 ch @ 17.4 Gbps) | R2 (reduced ch count) | N3 (no transceivers) |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| User I/O Count | 342 | 342 | 342 | 342 | 342 |
Key Differentiators
- Highest transceiver count within F40 industrial family (vs 10AX115R2F40I2SG)
- Industrial temperature grade for harsh environments (vs 10AX115R3F40E2SG)
- R3 transceivers enable higher-margin SERDES links (vs 10AX115R2F40I2SG)
Design Notes
The 1517-ball F40 FCBGA package requires substantial copper thermal management. Estimated: at 1.15M LE utilization near 100% with 24 transceivers active, the device can dissipate 20-30W. The exposed-die flip-chip BGA needs a top-side heatsink or high-density PCB inner copper planes connected via thermal vias to the central ball grid. Use Intel's power-estimator tools (PowerPlay Early Power Estimator) early in the design cycle to size cooling.
Power sequencing is mandatory for Arria 10 devices. Core supply (0.95V VCC), transceiver supplies (VCCR/VCCP/VCCT at 1.0-1.2V), and I/O supplies (1.2V-2.5V VCCIO) must ramp in a specific order per Intel's Pin Connection Guidelines. Use a dedicated sequencer IC or a properly-configured PMIC to avoid latch-up. Inrush current through the monolithic regulator (POR) must be limited to the datasheet's monotonic-ramp specification.
Place 0.1uF + bulk-decoupling caps within the package footprint for each power rail group. SERDES reference clock routing requires 100-ohm differential impedance and length matching to within 5 mils per Intel's guidelines. The configuration pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) must be pulled to known states at power-up; consult the Arria 10 configuration user guide for the AS, PS, JTAG, and FPP modes.
Do not confuse 'I2' (industrial speed grade 2) with 'I2C' (the inter-IC bus). Industrial-grade Arria 10 FPGAs require MSL handling per JEDEC J-STD-033. Re-balling or re-flowing the F40 FCBGA is not supported - any board-level rework should replace the entire component. Designers must also avoid routing high-speed SERDES lanes across power-plane splits; use a contiguous GND reference plane under all transceiver channels.
Compliance Information
RoHS and lead-free compliance per Intel Arria 10 product family specifications. AEC-Q100 is not applicable for FPGAs; industrial-grade temperature rating is the relevant qualification for harsh-environment use. LG-suffix variants (e.g., 10AX115R3F40I2LG) denote lead-free/green compound.
