10AX115S3F45E2SG - Arria 10 GX 1150K LE FPGA, 28nm, F45 | Intel
부품 번호: 10AX115S3F45E2SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7450.65 | $7,450.65 |
| 10 | $7150 | $71,500.00 |
| 50 | $6900 | $345,000.00 |
| 100 | $6600 | $660,000.00 |
| 500 | $6200 | $3,100,000.00 |
10AX115S3F45E2SG 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic, interconnect, and I/O behavior are defined by user-supplied configuration data rather than at the factory. FPGAs sit at the top of the programmable logic device (PLD) hierarchy alongside CPLDs and are widely deployed for parallel DSP pipelines, custom high-speed interfaces, and ASIC prototyping. The Arria 10 GX family targets mid-range applications that require both high logic density and integrated transceivers at lower cost than Stratix-class parts.
Key features of the 10AX115S3F45E2SG include 1,150,000 logic elements (LEs), 68.86 Mbits of embedded SRAM, 1,518 embedded DSP blocks (18x19 multipliers), up to 24 high-speed transceiver channels at up to 17.4 Gbps (chip-to-chip and backplane capable), and hard PCI Express Gen3 x8 IP cores. The 'S' suffix indicates transceivers with the highest speed bin, while 'F45' denotes the 1932-ball flip-chip BGA package with 45mm row pitch and lead-free RoHS-compliant balls.
Architecturally, Arria 10 GX uses a coherent 20nm monolithic fabric combined with hardened protocol IP blocks for PCIe, memory controllers, and serial transceivers. The hard IP approach reduces power by up to 40% and die area by 30% compared to soft implementations. The fabric contains Adaptive Logic Modules (ALMs), M20K memory blocks, and variable-precision DSP blocks that can be cascaded to support IEEE 754 single-precision floating-point at full DSP block rate.
Typical applications include 4K UHD video broadcast and pro-AV equipment, 100G/400G optical transport networking line cards, radar and electronic-warfare signal processing, military secure communications, medical imaging accelerators, and ASIC prototyping platforms. The combination of high logic density and 17.4 Gbps transceivers makes it particularly suitable for bandwidth-intensive DSP and packet-processing workloads.
Designers should budget for the 1932-ball FCBGA which requires a multi-layer PCB with microvia and HDI stack-up. Power estimation requires Intel's PowerPlay or Early Power Estimator tools, and the device supports both core and transceiver power rails that must be sequenced per the datasheet. Configuration can be done via JTAG, serial flash, or PCI Express.
This page synthesizes distributor pricing, drop-in same-package alternatives, parametric comparisons, and practical design notes that go beyond the manufacturer datasheet to support faster design-in and sourcing decisions.
드롭인 대체품: 10AX115S3F45E2SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115S3F45E2SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, DSP Blocks, Embedded Memory, Temperature Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115S3F45E2LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7950 / 개
데이터시트 보기 →10AX115S3F45E1SG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AX115S3F45I2SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2020 / 개
데이터시트 보기 →10AX115S2F45E2SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6975.76 / 개
데이터시트 보기 →10AX115S3F45E2SG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Device Model | 10AX115 |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory | 68,857,856 bits (68.86 Mbits) |
| DSP Blocks | 1,518 (18x19 multipliers) |
| User I/Os | 624 |
| High-Speed Transceivers | Up to 24 channels at up to 17.4 Gbps |
| PCIe Hard IP | Gen3 x8 |
| Speed Grade | -2 |
| Process Technology | 20nm TSMC |
| Core Voltage | 0.9 V |
| 패키지 | 1932-ball FCBGA (F45), 45 mm |
| 동작 온도 | -40C to +100C (extended) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
10AX115S3F45E2SG 1932-ball fcbga (f45), 45 mm 핀 구성 가이드
10AX115S3F45E2SG(1932-ball fcbga (f45), 45 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX115S3F45E2SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX115S3F45E2SG 적합 용도: 6 애플리케이션s: 4K UHD Video Broadcast and Pro-AV, 100G/400G Optical Transport Networking, Radar and Electronic Warfare Signal Processing, Medical Imaging Accelerators (CT, MRI, Ultrasound), ASIC Prototyping and Emulation Platforms, High-Performance Computing Acceleration Cards.
4K UHD Video Broadcast and Pro-AV
The 10AX115S3F45E2SG fits 4K UHD video broadcast and pro-AV because of its 1,150K logic elements and 1,518 DSP blocks, which deliver real-time 12G-SDI, SMPTE ST 2110, and JPEG-XS processing without external ASICs. Its 17.4 Gbps transceivers aggregate four 12G-SDI streams at 48 Gbps aggregate, while the PCIe Gen3 x8 hard IP accelerates IP-based playout. Designers typically pair it with external HDMI 2.1 retimers for I/O and use Quartus Prime video IP suites for color-space conversion.
추천
100G/400G Optical Transport Networking
The 10AX115S3F45E2SG targets 100G/400G optical line cards because its 24 transceivers at up to 17.4 Gbps natively support CFP/CFP2 modules and OTU4 long-haul interfaces without external muxes. The hard PCS and FEC engines offload heavy DSP from the fabric, freeing LEs for MAC, packet classification, and queue management. Designers achieve sub-1W per 100G port when using the hard IP plus Arria 10's variable-precision DSP blocks for FEC acceleration.
추천
Radar and Electronic Warfare Signal Processing
In radar and EW applications, the 10AX115S3F45E2SG's 1,150K LEs and 1,518 DSP blocks deliver thousands of parallel FFT/iFFT channels required for phased-array beamforming. The 68.86 Mbits of embedded SRAM provides multi-stage data buffering between antenna elements and DSP pipelines, while the 17.4 Gbps transceivers feed ADCs and DACs at multi-GSPS sample rates. Designers combine the FPGA with high-speed JESD204B ADC/DACs for direct-RF front-end sampling, achieving sub-microsecond latency in the signal-processing path.
추천
Medical Imaging Accelerators (CT, MRI, Ultrasound)
The 10AX115S3F45E2SG accelerates medical imaging because its DSP-rich fabric delivers parallel back-projection, beamforming, and image-reconstruction kernels at medical-real-time rates. For a 256-channel ultrasound system, the 1,518 DSP blocks handle 256-channel parallel beamforming while the 68.86 Mbits of embedded memory holds sample data and intermediate coefficient arrays. Designers integrate it with high-speed JESD204B ADCs and use partial reconfiguration to switch between imaging modes (B-mode, Doppler, elastography) at sub-100ms latency.
추천
ASIC Prototyping and Emulation Platforms
The 10AX115S3F45E2SG serves as an ASIC prototyping engine because its 1,150K LEs emulate multi-million-gate ASIC designs in conjunction with companion FPGAs via 17.4 Gbps transceivers for chip-to-chip tiling. The hard PCIe Gen3 x8 IP connects the prototype board to a host workstation for accelerated co-simulation, while abundant M20K memory maps ASIC SRAM. Designers often stack 2-4 FPGAs in a single prototype card with HSSI links achieving 12.5 Gbps+ across the fabric, dramatically shortening ASIC verification cycles.
추천
High-Performance Computing Acceleration Cards
The 10AX115S3F45E2SG powers HPC and data-center accelerator cards because its PCIe Gen3 x8 hard IP delivers 8 GT/s host connectivity while the 1,518 DSP blocks accelerate HPC kernels (compression, encryption, genomics). The 24 transceivers at 17.4 Gbps link to host CPUs via optical or QSFP+ cages, and the 0.9V core voltage keeps total board power under 45W for typical workloads. Designers use OpenCL SDK or HLS compiler to port compute kernels, achieving 10-50x speedup over CPU-only execution.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX115S3F45E2SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115S3F45E2LG | 10AX115S3F45E1SG | 10AX115S3F45I2SG | 10AX115S2F45E2SG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Logic/Memory Configuration | S3 (high logic+memory) | S3 (high logic+memory) | S3 (high logic+memory) | S3 (high logic+memory) | S2 (lower logic+memory) |
| Speed Grade | -2 | -2 | -1 (slower, ~15% Fmax reduction) | -2 | -2 |
| Temperature Grade | Extended (-40C to +100C) | Extended (-40C to +100C) | Extended (-40C to +100C) | Industrial | Extended (-40C to +100C) |
| Ball Finish | SG (RoHS-Green SnAgCu) | LG (Lead-free matte Sn) | SG (RoHS-Green SnAgCu) | SG (RoHS-Green SnAgCu) | SG (RoHS-Green SnAgCu) |
| Approx. Unit Price (USD, qty 1) | $7,450.65 | $7,450 (similar) | $6,800 (lower) | $7,600 (similar) | $6,500 (lower) |
주요 차별점
- Highest logic+memory configuration in 10AX115 family (vs 10AX115S2F45E2SG)
- Higher speed grade than -1 variant (vs 10AX115S3F45E1SG)
- Extended temperature grade supports broader deployment (vs 10AX115S3F45I2SG)
설계 노트
The 10AX115S3F45E2SG can dissipate 25-40W in typical transceiver-rich designs. Use Intel's Early Power Estimator (EPE) tool to model worst-case power, then select a heatsink rated for at least 1.5x the estimated dissipation. The 1932-ball FCBGA exposed die requires a thermal interface material (TIM) with conductivity >= 3.0 W/mK; thermal pads with conductivity below 1.0 W/mK will cause thermal throttling under sustained load.
The 1932-ball F45 FCBGA requires >=14 PCB layers with HDI microvia stack-up. Use 0.4mm pitch BGA escape routing with via-in-pad (VIPPO) for the inner rows. Maintain 100-ohm differential impedance for transceiver channels with at least 3W differential line width-to-spacing. Place DC blocking capacitors within 100 mil of the transceiver ball pads and keep the AC-coupling cap reference plane unbroken to avoid impedance discontinuities.
Sequence the core and transceiver power rails per Intel's power-up sequencing specification to avoid latch-up. The 0.9V core rail must ramp within 100ms of the 1.8V/2.5V/3.3V auxiliary rails; failure to sequence properly can permanently damage the device. Use a dedicated FPGA power controller such as Intel's Enpirion EN6362QI or Texas Instruments TPS6508641 to guarantee correct sequencing. Add bulk decoupling of at least 600 uF of ceramic capacitance near the device to handle load-transient events.
For 17.4 Gbps transceiver channels, use Megtron 6 or equivalent low-loss PCB material with Dk=3.6, Df=0.004 at 5 GHz. Maintain at least 3W line width-to-spacing for 100-ohm differential pairs and limit intra-pair skew to < 2 ps. Pre-emphasis and equalization settings should be tuned using Intel's Transceiver Toolkit; start with default settings and iterate with eye-diagram measurements at the receiver.
규정 준수 정보
RoHS compliant per Intel product page; lead-free FCBGA balls (SG suffix). AEC-Q100 not applicable - Arria 10 FPGAs are not automotive-qualified. Industrial temp variants (I suffix) are available for MIL-spec applications.
