10AX115S3F45E2LG - Arria 10 GX 1150K LE FPGA | Intel | 1932-FCBGA
부품 번호: 10AX115S3F45E2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8928.97 | $8,928.97 |
| 10 | $8710 | $87,100.00 |
| 100 | $8450 | $845,000.00 |
| 500 | $8200 | $4,100,000.00 |
| 1,000 | $7950 | $7,950,000.00 |
10AX115S3F45E2LG 개요
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic, interconnect, I/O, and DSP blocks are configured by the customer after manufacture. FPGAs sit at the top of the programmable-logic hierarchy (FPGA -> programmable logic -> digital IC -> semiconductor) and combine parallel hardware fabric, embedded memory blocks, DSP slices, and (in the Arria 10 GX case) multi-gigabit transceivers, allowing a single device to implement functions that would otherwise require multiple ASICs, processors, and serializer/deserializer chips. The Arria 10 GX family in particular targets mid-range transceiver-heavy applications between Cyclone V and Stratix 10.
Key features of the 10AX115S3F45E2LG include up to 28.05 Gbps backplane-capable transceivers, hardened floating-point DSP blocks, partial reconfiguration, and dedicated PCIe Gen3 hard IP blocks. The 1932-ball FCBGA package supports the full -2 extended temperature range while exposing the device's high I/O count and transceiver channels needed for parallel processing and serial connectivity.
Architecturally, the Arria 10 GX device uses a 20 nm SoC-style fabric with hard ARM-friendly memory controllers and high-speed serial interface tiles. The 10AX115 tier is the high-density variant, providing roughly 1.15 M logic elements with the standard transceiver-to-logic ratio, optimized for data-pipeline, video, and digital-signal-processing workloads where both serial bandwidth and parallel compute matter.
Typical applications include high-speed video broadcast equipment, medical imaging, 4K/8K video processing, test and measurement instruments with embedded FPGA data acquisition, and mid-range wireless baseband pre-processing. Designers choose the 10AX115S3F45E2LG when they need the high logic capacity and transceiver bandwidth of Arria 10 GX but in the lower-cost -2 speed grade rather than the fastest -1 grade.
When designing with this device, pay close attention to PCB stackup, transceiver channel routing, and power delivery: Arria 10 devices require multiple voltage rails (typically 0.9 V core, 1.1 V auxiliary, and 1.8 V I/O) with strict sequencing. Reference Intel's Arria 10 GX Device Design Guidelines and the Arria 10 Transceiver PHY User Guide for power-tree and signal-integrity recommendations.
This page synthesizes distributor pricing, qualified same-footprint drop-in alternatives from the Arria 10 family, and design notes not found in the manufacturer datasheet, helping engineers source, substitute, and validate the 10AX115S3F45E2LG for new and existing designs.
드롭인 대체품: 10AX115S3F45E2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115S3F45E2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Embedded Memory, Speed Grade, DSP Blocks, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115S3F45E2SG
✅ 드롭인✓ 재고 있음
$6200 / 개
데이터시트 보기 →10AX115S3F45E1SG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AX115S3F45I1SG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AX115S2F45E2LG
✅ 드롭인✓ 재고 있음
$7100 / 개
데이터시트 보기 →10AX115S2F45E2SG
✅ 드롭인✓ 재고 있음
$6975.76 / 개
데이터시트 보기 →10AX115S3F45I2SG
✅ 드롭인✓ 재고 있음
$2020 / 개
데이터시트 보기 →10AX115S3F45E2LG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits |
| User I/O | 624 |
| Core Voltage | 0.9 V |
| Process Technology | 20 nm |
| 패키지 | 1932-BBGA, FCBGA |
| Footprint | F45 |
| Speed Grade | -2 (Extended) |
| Temperature Grade | Extended |
| Transceivers | Up to 28.05 Gbps backplane-capable |
| DSP Blocks | Hardened floating-point DSP |
| PCIe Hard IP | PCIe Gen3 x8 hard IP |
| Lead-Free / RoHS | Yes (lead-free finish, RoHS compliant) |
| 실장 유형 | Surface Mount (BGA) |
10AX115S3F45E2LG 핀 구성
| 핀 1 | IO_xxx — User I/O ball; refer to Quartus Prime pin planner for exact ball coordinates in the F45 footprint |
| 핀 2 | IO_xxx — User I/O ball; refer to Quartus Prime pin planner for exact ball coordinates in the F45 footprint |
| 핀 3 | IO_xxx — User I/O ball; refer to Quartus Prime pin planner for exact ball coordinates in the F45 footprint |
| 핀 4 | IO_xxx — User I/O ball; refer to Quartus Prime pin planner for exact ball coordinates in the F45 footprint |
| 핀 5 | IO_xxx — User I/O ball; refer to Quartus Prime pin planner for exact ball coordinates in the F45 footprint |
| 핀 6 | IO_xxx — User I/O ball; refer to Quartus Prime pin planner for exact ball coordinates in the F45 footprint |
| 핀 7 | IO_xxx — User I/O ball; refer to Quartus Prime pin planner for exact ball coordinates in the F45 footprint |
| 핀 8 | IO_xxx — User I/O ball; refer to Quartus Prime pin planner for exact ball coordinates in the F45 footprint |
| 핀 9 | IO_xxx — User I/O ball; refer to Quartus Prime pin planner for exact ball coordinates in the F45 footprint |
| 핀 10 | IO_xxx — User I/O ball; refer to Quartus Prime pin planner for exact ball coordinates in the F45 footprint |
| 핀 11 | IO_xxx — User I/O ball; refer to Quartus Prime pin planner for exact ball coordinates in the F45 footprint |
| 핀 12 | IO_xxx — User I/O ball; refer to Quartus Prime pin planner for exact ball coordinates in the F45 footprint |
일반적인 애플리케이션
10AX115S3F45E2LG 적합 용도: 6 애플리케이션s: High-Speed Video Broadcast and Processing, Medical Imaging and Diagnostic Equipment, Test and Measurement Instrumentation, Wireless Baseband Pre-Processing, Defense and Aerospace Signal Processing, Industrial Control and High-Speed Data Acquisition.
High-Speed Video Broadcast and Processing
The 10AX115S3F45E2LG fits 4K/8K video broadcast and processing because its 1,150,000 logic elements and embedded DSP blocks can sustain multi-stream HEVC/AVC pipelines at full frame rate, while the 28.05 Gbps transceivers carry uncompressed video over SMPTE ST 2082 (12G-SDI) links. Designers place the device on a multi-layer PCB with matched-length SDI traces and route the transceiver channels through AC-coupled connectors to preserve signal integrity at 12 Gbps. Compared with a discrete CPU+GPU stack, the Arria 10 GX delivers deterministic latency and lower per-frame jitter, which is critical for live broadcast timing.
추천
Medical Imaging and Diagnostic Equipment
The 10AX115S3F45E2LG suits medical imaging because its hardened floating-point DSP slices accelerate CT, MRI, and ultrasound reconstruction kernels (filtered back-projection, beamforming) in deterministic cycles. The Extended temperature grade supports the thermal envelope inside an imaging cabinet, and the 68,857,856 bits of embedded memory hold image-line buffers close to the logic, cutting external DRAM round-trips. Engineers typically pair it with a JESD204B ADC front end, clocked from the FPGA's transceiver PLLs, and stream samples into on-chip memory for real-time processing at frame rates above 30 fps.
추천
Test and Measurement Instrumentation
The 10AX115S3F45E2LG is widely deployed in oscilloscopes, logic analyzers, and protocol testers because its 624 user I/O plus 28.05 Gbps transceivers handle multi-channel analog front-end capture and PCIe Gen3 host upload in parallel. The high logic density supports deep on-chip acquisition memory and real-time trigger logic at sample rates above 5 GSPS, while the PCIe hard IP block offloads waveform data to the host CPU without tying up transceiver resources. Designers use the FPGA's partial-reconfiguration feature to swap between protocol analyzer personalities (PCIe, USB, Ethernet) in the field.
추천
Wireless Baseband Pre-Processing
The 10AX115S3F45E2LG supports wireless baseband pre-processing because its hardened DSP and CPRI/OBSAI-capable transceivers handle multi-antenna radio front-haul at up to 9.8 Gbps per channel. The 1,150,000 logic elements implement crest-factor reduction (CFR) and digital pre-distortion (DPD) engines that linearize power amplifiers in 4G/5G small-cell radios. Engineers typically pair the FPGA with a host SoC over PCIe Gen3 and run the pre-processing pipeline at line rate without loading the SoC, preserving headroom for stack-layer processing.
추천
Defense and Aerospace Signal Processing
The 10AX115S3F45E2LG meets defense signal-processing needs because its Extended temperature range, hardened DSP blocks, and high logic capacity allow radar pulse compression, electronic-warfare channelization, and SIGINT demodulation in a single device. Designers implement polyphase filter banks and FFT engines on-chip and stream processed data via the 28.05 Gbps transceivers to a downstream recorder or display processor. Compared with a discrete DSP cluster, the Arria 10 GX reduces SWaP-C by collapsing multiple boards into one BGA, an important advantage in size-constrained platforms.
추천
Industrial Control and High-Speed Data Acquisition
The 10AX115S3F45E2LG is well suited to industrial data acquisition because its 624 user I/O and high-density logic can interface with parallel ADC/DAC banks, while the transceivers serialize the resulting streams to a host controller. Designers implement deterministic real-time control loops in the FPGA fabric, bypassing the jitter of a CPU-based PLC, and use partial reconfiguration to switch between sensor configurations on the line. Compared with a microcontroller stack, the Arria 10 GX gives deterministic sub-microsecond loop times and deterministic GPIO-to-transceiver latency.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX115S3F45E2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115S3F45E2SG | 10AX115S3F45E1SG | 10AX115S3F45I1SG | 10AX115S2F45E2LG |
|---|---|---|---|---|---|
| Package | 1932-BBGA FCBGA (F45) | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -2 (Extended) | -2 (Extended) | -1 (Extended) | -1 (Industrial) | -2 (Extended) |
| Temperature Grade | Extended | Extended | Extended | Industrial | Extended |
| Lead-Free Finish | Yes (RoHS) | No (non-RoHS finish) | No (non-RoHS finish) | No (non-RoHS finish) | Yes (RoHS) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| User I/O | 624 | 624 | 624 | 624 | 624 |
| Transceiver Class | S3 (highest transceiver count) | S3 (same) | S3 (same) | S3 (same) | S2 (reduced transceivers) |
| Approx. Unit Price (qty 1) | $8,928.97 | Similar (~$8,500-$9,000) | Higher (~$9,500-$10,500) | Higher (~$10,000-$11,000) | Lower (~$7,500-$8,500) |
주요 차별점
- Lead-free, RoHS-compliant Extended-temperature grade (vs 10AX115S3F45E2SG)
- Speed grade -2 for lower cost vs -1 (vs 10AX115S3F45E1SG)
- Highest transceiver class (S3) in the 10AX115 family (vs 10AX115S2F45E2LG)
설계 노트
The Arria 10 GX device requires multiple voltage rails (0.9 V core, 1.1 V auxiliary, 1.8 V I/O, plus transceiver rails). Power-on sequencing is mandatory per the Arria 10 datasheet: bring up the 1.8 V rail before the 0.9 V core, and respect the monotonic-rising requirement. Use the Intel-supplied PowerTree Designer tool and reference the Arria 10 GX Device Design Guidelines for sequencing and ramp-rate values.
For 28.05 Gbps backplane operation, the PCB stackup must be a low-loss material (e.g., Megtron 6 or equivalent) with controlled-impedance 100-ohm differential channels and continuous reference planes. Per Intel's Arria 10 Transceiver PHY User Guide, transceiver channels must use AC coupling and matched lengths within the lane-to-lane skew budget; violations will close the eye at 28 Gbps.
At full transceiver utilization the Arria 10 GX 1150K-LE part can dissipate 20-30 W. The 1932-ball FCBGA requires a properly designed heatsink or cold plate with thermal interface material rated for the package. Reference the Arria 10 Thermal Management User Guide and use the junction-to-ambient thermal resistance from the device datasheet to size the cooling solution.
Do not assume the 10AX115S3F45E2LG and a non-LE Arria 10 device are interchangeable: the LE suffix denotes the standard logic-to-transceiver ratio, while the non-LE variants have fewer transceivers. Mixing them will cause Quartus Prime fitter errors and uncorrected pin mismatches. Always confirm the full MPN (10AX115S3F45E2LG, with the 'S3' transceiver code) matches the device order code in the BOM.
규정 준수 정보
RoHS-compliant lead-free finish per Intel product page; the LG suffix denotes lead-free per Arria 10 ordering information. AEC-Q100 not applicable for FPGAs.