10AX115U3F45E2LG - Arria 10 GX FPGA 1150K LE | Intel | 1932-FCBGA
부품 번호: 10AX115U3F45E2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $10587.44 | $10,587.44 |
| 5 | $9800 | $49,000.00 |
| 10 | $9250 | $92,500.00 |
| 25 | $8900 | $222,500.00 |
| 100 | $8500 | $850,000.00 |
10AX115U3F45E2LG 개요
What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect. FPGAs differ from Application-Specific Integrated Circuits (ASICs) in that their function is defined after manufacturing, via a hardware description language (HDL) bitstream loaded into on-chip SRAM configuration memory. Modern high-end FPGAs like the Arria 10 family integrate hard IP blocks for transceivers, DSP, memory controllers, and processor cores, blurring the line between FPGA and SoC.
The Arria 10 GX family targets mid-range, transceiver-rich applications. The 10AX115U3F45E2LG delivers up to 28.05 Gbps backplane-capable transceivers, a hardened ARM Cortex-A9 dual-core processor subsystem option (on SoC variants), and variable-precision DSP blocks capable of 1.5 TFLOPs of single-precision floating-point performance. The 20 nm process enables higher logic density at lower static power than the prior 28 nm Cyclone V / Stratix V generations.
Typical applications for the 10AX115U3F45E2LG include 100G/400G optical line cards, high-performance test and measurement instrumentation, military radar signal processing, broadcast video processing engines, and PCIe Gen3 x8/x16 host acceleration cards. The combination of dense logic, abundant embedded SRAM, and high-speed serial I/O makes it well suited for data-plane acceleration where latency and throughput dominate design decisions.
Designers should plan power delivery around the 20A peak core current and use the Quartus Prime PowerPlay early power estimator before PCB layout. The 1932-FCBGA requires multilayer PCB stack-up with buried vias, microvia stack-ups, or hybrid PCB construction; standard 4-layer boards are not feasible for this pin-count.
This page synthesizes distributor pricing, Arria 10 family cross-references, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: 10AX115U3F45E2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115U3F45E2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, DSP Blocks, Speed Grade, Embedded Memory Bits, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115U2F45E2LG
✅ 드롭인✓ 재고 있음
$7380 / 개
데이터시트 보기 →10AX115U2F45E2SG
✅ 드롭인✓ 재고 있음
$6920.66 / 개
데이터시트 보기 →10AX115U2F45I2LG
✅ 드롭인✓ 재고 있음
$9589.87 / 개
데이터시트 보기 →10AX115U3F45E2SG
✅ 드롭인✓ 재고 있음
$5800 / 개
데이터시트 보기 →10AX115U4F45I3LG
✅ 드롭인✓ 재고 있음
$5920 / 개
데이터시트 보기 →10AX115U3F45E2LG 최대 정격 & 전기적 특성
| Series | Arria 10 GX |
| Family | Arria 10 |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| User I/O Count | 480 |
| Speed Grade | U3 (medium-performance, transceiver-focused) |
| Package Code | F45 (45 × 45 mm FCBGA) |
| Package Type | 1932-ball FCBGA (Flip-Chip BGA) |
| Process Technology | 20 nm TSMC |
| Transceiver Data Rate | Up to 28.05 Gbps |
| DSP Blocks | Variable-precision, 1.5 TFLOPs FP32 |
| PCIe Hard IP | Gen3 x8/x16 |
| Memory Interfaces | DDR4, DDR3, QDR IV, RLDRAM 3 |
| 동작 온도 | 0C to +100C (Industrial, E2 grade) |
| 실장 유형 | Surface Mount (BGA) |
| Configuration Method | SRAM-based, loaded via JTAG / AS / PS |
| RoHS 상태 | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
10AX115U3F45E2LG 핀 구성
| 핀 A1 | USER IO — Multi-purpose user I/O pin (LVDS-25/3.3V); exact function per Pin Connection Guidelines |
| 핀 A33 | USER IO — Multi-purpose user I/O pin (LVDS-25/3.3V) |
| 핀 AA1 | GXB_RX — High-speed transceiver differential receive pair (lane 0) |
| 핀 AA33 | GXB_TX — High-speed transceiver differential transmit pair (lane 0) |
| 핀 AB31 | VCCH_GXB — Transceiver high-voltage power supply |
| 핀 AC30 | VCC — Core voltage supply (0.95 V typical) |
| 핀 AC34 | VCCA_PLL — PLL analog power supply (1.12 V typical) |
| 핀 AD32 | GND — Ground reference |
| 핀 AE2 | nCONFIG — Configuration control (active-low FPGA reset) |
| 핀 AE33 | MSEL0 — Configuration mode select bit 0 |
| 핀 AF1 | MSEL1 — Configuration mode select bit 1 |
| 핀 AF33 | MSEL2 — Configuration mode select bit 2 |
| 핀 AG32 | TCK — JTAG Test Clock |
| 핀 AH2 | TDO — JTAG Test Data Out |
| 핀 AH34 | TMS — JTAG Test Mode Select |
| 핀 AJ3 | TDI — JTAG Test Data In |
일반적인 애플리케이션
10AX115U3F45E2LG 적합 용도: 6 애플리케이션s: 100G/400G Optical Line Card, High-Performance Test & Measurement, Military Radar / Signal Processing, Broadcast Video Processing Engine, PCIe Gen3 Acceleration Card, Medical Imaging (CT / MRI / Ultrasound).
100G/400G Optical Line Card
The 10AX115U3F45E2LG's 28.05 Gbps transceivers and 1.15M logic elements make it ideal for 100G and 400G optical line cards. Designers use CAUI-4 (4×25.78 Gbps) or CAUI-10 (10×10.31 Gbps) configurations routed directly to QSFP28 / CFP2 / CFP4 cages via the device's 28 Gbps SerDes. The hard PCIe Gen3 x8/x16 IP blocks provide host-side connectivity to system CPUs or packet processors. Compared to discrete SERDES + CPLD solutions, the Arria 10 GX achieves >70% lower latency for 100G MAC aggregation. The 480 user I/Os handle 4×10G SFP+ plus several management interfaces simultaneously.
추천
High-Performance Test & Measurement
The 10AX115U3F45E2LG is well suited for high-speed oscilloscopes, logic analyzers, and protocol testers that demand parallel DSP throughput. Each variable-precision DSP block runs at up to 600 MHz, aggregating to ~1.5 TFLOPs single-precision floating-point performance across the 1,513 DSP blocks. The 68.8 Mbit embedded SRAM provides on-chip buffering for deep capture memory, while 480 user I/Os support LVDS-25 parallel front-end sampling. Compared to a pure DSP-ASIC, the FPGA offers field-reprogrammability that lets manufacturers ship one platform and many firmware variants.
추천
Military Radar / Signal Processing
The 10AX115U3F45E2LG fits military radar, electronic warfare, and SIGINT applications where the 20 nm process's high logic density at low static power is mission-critical. The 1.15M LE provides headroom for beamforming FFTs and pulse-compression correlators, while 28 Gbps transceivers route digitizer data from RF front-end ADCs directly into the FPGA. The device's -40C to +100C operating range (in the I-temperature suffix) supports ground-mobile and airborne platforms. Compared to ASICs, the FPGA enables field upgrades as threat libraries evolve.
추천
Broadcast Video Processing Engine
The 10AX115U3F45E2LG is widely used in broadcast-grade 4K/UHD video processing engines, where multi-channel SDI aggregation and HEVC/H.265 mezzanine compression live on the same chip. The 480 user I/Os handle 8+ 12G-SDI channels simultaneously, and the 68.8 Mbit embedded SRAM buffers multiple frames of uncompressed video at 4K60. The hard PCIe Gen3 x16 connection to a system CPU or GPU offloads the host's I/O burden. The Arria 10 GX's transceiver speed grades are tuned for SDI jitter compliance at 12 Gbps.
추천
PCIe Gen3 Acceleration Card
The 10AX115U3F45E2LG's hard PCIe Gen3 x8/x16 IP enables drop-in acceleration cards for machine-learning inference, financial trading, and database query engines. Up to 8 GB of DDR4 is typically backed by the FPGA's hardened memory controller, providing low-latency scratchpad memory. The 480 user I/Os route to high-speed DACs/ADCs for direct RF or optical interface to the host CPU. Compared to GPU acceleration, Arria 10 GX offers deterministic latency and lower per-watt logic throughput.
추천
Medical Imaging (CT / MRI / Ultrasound)
The 10AX115U3F45E2LG is used in high-end medical imaging front-ends where parallel DSP across many transducer or detector channels is essential. The 1,513 variable-precision DSP blocks enable beamforming in ultrasound front-ends and back-projection in CT reconstructors. 480 user I/Os aggregate LVDS data from 64-128 analog front-end channels. Compared to a custom ASIC, the Arria 10 GX supports field-upgradeable clinical protocols as medical imaging standards evolve. Operating temperature range (industrial E2) covers typical imaging-room environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX115U3F45E2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115U2F45E2LG | 10AX115U2F45E2SG | 10AX115U2F45I2LG | 10AX115U3F45E2SG | 10AX115U4F45I3LG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) |
| Speed Grade | U3 | U2 | U2 | U2 | U3 | U4 |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Operating Temperature | 0C to +100C (E2) | 0C to +100C (E2) | 0C to +100C (E2) | -40C to +100C (I2) | 0C to +100C (E2) | -40C to +100C (I3) |
| Transceiver Fmax | 28.05 Gbps | 25.78 Gbps (typical U2) | 25.78 Gbps (typical U2) | 25.78 Gbps (typical U2) | 28.05 Gbps | 17.4 Gbps (typical U4) |
| Core Logic Fmax | ~700 MHz (U3) | ~750 MHz (U2) | ~750 MHz (U2) | ~750 MHz (U2) | ~700 MHz (U3) | ~620 MHz (U4) |
| Pin/Finish Suffix | LG (Pb-free, E2 temp) | LG (Pb-free, E2 temp) | SG (Pb-free, E2 temp, matte Sn) | LG (Pb-free, I2 industrial) | SG (Pb-free, E2 temp, mat finish) | LG (Pb-free, I3 ext industrial) |
주요 차별점
- Highest transceiver Fmax in the 10AX115 family (vs 10AX115U2F45E2LG)
- Industrial E2 temperature range with lead-free LG finish (vs 10AX115U2F45I2LG)
- Same die as alternatives — fully bitstream compatible (vs 10AX115U3F45E2SG)
설계 노트
The 1932-ball FCBGA at 1.0 mm ball pitch requires a multilayer PCB stack-up (typically 8-12 layers) with either microvia HDI or any-layer-via construction. Standard 4-layer boards will not work — escape routing alone consumes 6-8 routing layers. Plan for laser-drilled microvias, staggered or stacked. Pad finish (ENIG vs OSP vs immersion Sn) affects solder joint reliability; follow IPC-9701 thermal cycling guidelines for BGA reliability.
Estimated: Core current peaks around 20-25 A in U3 speed grade with 80% logic utilization at 600 MHz. Plan at least 8 power pins per VCC rail with 4-8 wide copper pours and low-impedance stitching capacitors (0.1 uF X7R + 22 uF polymer + 470 uF bulk). The VCCA_PLL (1.12 V) and VCC_HSSI (1.0-1.12 V) rails must be isolated with ferrite beads and have < 2 mV RMS noise. Use the Quartus Prime PowerPlay Early Power Estimator before PCB layout.
The 1932-ball FCBGA (F45) has a typical theta_JA of 4-6 C/W with a 4×4 inch 12-layer board and 100% solid ground plane. At 25 W typical power, junction temperature rises 100-150C above ambient. Active cooling (heatsink with 200+ LFM airflow) is mandatory for most designs. Consider a copper lid or integrated heat-spreader (IHS) variant. Use thermal vias in the BGA land pattern for PCB-side dissipation.
Do not populate the FCBGA part on a board designed for an Arria 10 GT or SX variant — these families share the same 1932-ball FCBGA (F45) outline but differ in die and IP. Verify the part's IDCODE against the Quartus Prime supported-devices list before committing. Also note the U3 grade's transceiver channel placement — the F45 package routes transceivers to specific quadrants; consult the Pin Connection Guidelines document when planning the PCB layout.
High-speed transceiver traces (28 Gbps) require 85-100 ohm differential impedance with < 0.15 mm trace-length matching within a pair. DC blocking capacitors are NOT required at 28 Gbps rates on the Arria 10 GX receiver but ARE recommended on the transmit side to bias the channel. Reference plane discontinuity under transceivers causes severe jitter; maintain a solid ground plane under all SerDes lanes with no splits or voids.
규정 준수 정보
RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations confirmed on Altera/Intel Arria 10 ordering information page (F45 family, E2/LG suffix). Not AEC-Q100 qualified — Arria 10 FPGAs are not automotive-grade parts.
