10CL016YF484C6G - Cyclone 10 LP FPGA 16K LE | Intel | BGA-484
부품 번호: 10CL016YF484C6G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $56.4 | $56.40 |
| 10 | $52.1 | $521.00 |
| 100 | $47.85 | $4,785.00 |
| 500 | $43.6 | $21,800.00 |
| 1,000 | $40.15 | $40,150.00 |
10CL016YF484C6G 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP blocks, and transceivers. FPGAs sit between general-purpose microcontrollers (sequential software execution) and ASICs (fixed-function silicon) in the digital IC hierarchy, offering hardware parallelism and post-production reconfigurability that microcontrollers cannot match and time-to-market advantages ASICs cannot offer. Cyclone 10 LP is Intel's low-power FPGA tier, positioned below Cyclone V and above MAX series CPLDs.
Key features of the 10CL016YF484C6G include 15,408 logic elements (LEs), 56 embedded 18x18 multipliers, 516 Kbits of embedded SRAM, four general-purpose PLLs, and 340 maximum user I/Os. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards across eight I/O banks, with per-bank reference voltage support. Configuration is supported via JTAG, active serial (AS), passive serial (PS), and Fast Passive Parallel (FPP) modes using industry-standard EPCS or EPCQ flash devices.
Typical applications span industrial motor control, video processing pipelines, low-cost software-defined radio front-ends, LED display controllers, machine vision preprocessing, and IoT edge aggregation. The 484-ball FBGA package provides ample I/O density for high-pin-count glue logic and parallel sensor aggregation.
When designing with this device, ensure the Quartus Prime Lite/Standard toolchain is used for synthesis and place-and-route. Pay attention to bank-based VCCIO planning when mixing 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O standards, and follow Intel's PCB layout guidelines for FBGA breakout to avoid signal-integrity issues on DDR/parallel memory interfaces.
This page synthesizes distributor stock, drop-in alternative ordering codes within the Cyclone 10 LP family, and practical design considerations not duplicated on the Intel Cyclone 10 LP device handbook landing page.
드롭인 대체품: 10CL016YF484C6G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10CL016YF484C6G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Family, Mounting Type, Process Node.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10CL016YF484C8G
✅ 드롭인✓ 재고 있음
$20.75 / 개
데이터시트 보기 →10CL016YF484I7G
✅ 드롭인✓ 재고 있음
$21.5 / 개
데이터시트 보기 →10CL016YF484I6G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10CL016YF484C6G 최대 정격 & 전기적 특성
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 15,408 |
| Embedded Memory (bits) | 516,096 |
| Embedded 18x18 Multipliers | 56 |
| Maximum User I/Os | 340 |
| General-Purpose PLLs | 4 |
| Global Clock Networks | 20 |
| 패키지 | 484-ball FBGA (F484) |
| Process Node | 60 nm low-power |
| Core Voltage (VCCINT) | 1.0 V (typical) |
| I/O Voltage Standards | LVDS, LVCMOS, SSTL, HSTL (1.2 V to 3.3 V) |
| Configuration Modes | JTAG, AS, PS, FPP |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Speed Grade | 6 |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount (BGA) |
10CL016YF484C6G 484-ball fbga (f484) 핀 구성 가이드
10CL016YF484C6G(484-ball fbga (f484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10CL016YF484C6G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10CL016YF484C6G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Processing Pipeline, LED Display Controller, Machine Vision Preprocessor, IoT Edge Aggregation Gateway, Software-Defined Radio Front-End.
Industrial Motor Control
The 10CL016YF484C6G fits industrial motor control with its 56 embedded 18x18 multipliers handling field-oriented control (FOC) math, four PLLs generating the multi-phase PWM clocks, and 340 user I/Os accommodating simultaneous encoder, Hall-sensor, and gate-driver interfaces. Its 60 nm low-power process keeps junction temperature manageable in sealed IP65 enclosures where heatsinking is impractical. The -6 commercial speed grade delivers deterministic Fmax across vector-rotation loops and ADC-synchronized current-sampling windows. Estimated: at 100 MHz logic clock with typical FOC utilization (~70% LE), the device draws under 0.5 W dynamic power.
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Video Processing Pipeline
The 10CL016YF484C6G serves as a cost-optimized video bridge, converting parallel ITU-R BT.656 or MIPI-CSI streams into processed output for LCD controllers. The 15,408 LEs handle line buffers in distributed RAM plus a scaling engine in DSP blocks, while 516 Kbits of embedded SRAM absorb scan-line data without external SDRAM. The F484 BGA's 340 I/Os provide ample headroom for 24-bit parallel RGB plus control signaling. Designers can scale density down to 10CL010 for lower-resolution targets.
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LED Display Controller
The 10CL016YF484C6G drives large RGB-LED matrices by combining its 56 multipliers for gamma correction and color-space conversion with 340 I/Os split across chained HUB75 connectors. The 60 nm low-power silicon enables fanless outdoor cabinet operation across commercial temperature ranges. On-die SRAM stores lookup tables for brightness curves, eliminating external memory. Per-bank VCCIO simplifies mixing 5 V HUB75 drivers with 3.3 V processor-side links on the same board.
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Machine Vision Preprocessor
The 10CL016YF484C6G acts as a front-end preprocessor in line-scan or area-scan machine vision, performing Bayer demosaicing, thresholding, and ROI extraction before forwarding compressed results to a host CPU. Its 15,408 LEs support Sobel or Laplacian edge-detection kernels, while embedded 18x18 multipliers accelerate convolution at line rate. Eight I/O banks accept mixed 1.8 V LVCMOS sensor data and 3.3 V GPIO camera trigger signals without level shifters. Cyclone 10 LP's low static current suits PoE-powered camera enclosures.
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IoT Edge Aggregation Gateway
The 10CL016YF484C6G aggregates multiple industrial protocols (Modbus RTU, CAN, RS-485, I2C, SPI) into a unified uplink stream, using its 56 multipliers for CRC and encryption offload and 340 I/Os for high-port-count concentrator designs. The low-power 60 nm process keeps thermal envelope small for DIN-rail mounted gateways, while the commercial temperature grade suits indoor enclosures. Quartus Prime Lite's free licensing makes this build economically viable for sub-USD 50 BOM gates.
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Software-Defined Radio Front-End
The 10CL016YF484C6G implements the digital downconversion and channelization stage in narrow-band SDR receivers, leveraging 56 multipliers for FIR filtering and FFT butterfly operations. Its four PLLs generate independent sample clocks for ADC and DAC interfaces. The 340 I/Os interface to high-speed LVDS ADC pairs while also providing GPIO for tuner control. Designers targeting lower IF bandwidth can migrate to the 10CL006 family to reduce BOM cost while preserving the F484 footprint.
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추천 제품 요약
엔지니어링 참조 데이터: 10CL016YF484C6G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10CL016YF484C8G | 10CL016YF484I7G | 10CL016YF484I6G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 |
| Speed Grade | -6 | -8 (faster) | -7 | -6 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Embedded Memory (bits) | 516,096 | 516,096 | 516,096 | 516,096 |
| Embedded 18x18 Multipliers | 56 | 56 | 56 | 56 |
| Maximum User I/Os | 340 | 340 | 340 | 340 |
| Configuration Flash (typical) | EPCS16 / EPCQ16 | EPCS16 / EPCQ16 | EPCS16 / EPCQ16 | EPCS16 / EPCQ16 |
주요 차별점
- Higher density than the 10CL010 family (vs 10CL010YU256C8G)
- F484 BGA maximizes I/O density within the Cyclone 10 LP family (vs 10CL016YE144I7G (E144 EQFP))
- Commercial-temperature -6 speed grade balances cost and performance (vs 10CL016YF484C8G)
설계 노트
The F484 FineLine BGA uses 1.0 mm ball pitch, which mandates microvia (laser-drilled) PCB technology with at least a 4-2-4 or 4-4-4 stack-up for clean breakout. Estimated: each signal via consumes roughly 0.5 mm of routing channel, so power and ground islands must be planned before signal fan-out. Reference Intel AN 583 (Designing with FineLine BGA packages) for via-in-pad and dog-bone fan-out trade-offs. A solid GND plane on layer 2 directly beneath the BGA is critical for return-path integrity.
Decouple the 1.0 V VCCINT rail with one 100 uF bulk capacitor plus ten 10 uF X5R ceramics distributed around the BGA perimeter. Estimated: at typical toggle rates (~30% of LEs active) the core draws roughly 200-400 mA, so the regulator headroom (dropout) must be sized accordingly. Sequence VCCINT before VCCPD and VCCIO to avoid POR latch-up; Intel's Power Sequencing chapter shows the supported ordering. Use ferrite beads on each VCCIO bank to isolate switching noise.
A common pitfall is omitting the MSL3 moisture-sensitive pre-bake before reflow, which causes internal delamination during solder attachment. Another is configuring VCCIO of an unused bank to 0 V while neighboring banks drive 3.3 V outputs through the shared ESD structure - this can back-power the inactive bank and cause POR failures. Finally, never tie JTAG TCK to a free-running clock; Intel recommends a 10 kohm pull-down to keep the TAP controller in bypass during free run.
규정 준수 정보
RoHS and REACH compliance per Intel material declaration. AEC-Q100 not offered for the commercial C6G OPN - select an automotive-qualified Cyclone 10 LP variant for vehicle applications. MSL3 moisture sensitivity per JEDEC J-STD-020.