10M16DAF484I7P - MAX 10 FPGA, 16K LE, 484-BGA | Intel / Altera
부품 번호: 10M16DAF484I7P ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.1 | $721.00 |
| 100 | $64.4 | $6,440.00 |
| 250 | $58.2 | $14,550.00 |
| 500 | $53.05 | $26,525.00 |
10M16DAF484I7P 개요
A field-programmable gate array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks (LEs/ALMs), programmable interconnect, and dedicated hard IP such as multipliers, memory blocks, and transceivers. FPGAs sit above microcontrollers and ASICs in the design flexibility hierarchy: more flexible than ASICs, faster than MCUs at parallel DSP tasks, and lower power than GPUs at deterministic logic. The MAX 10 family adds non-volatile configuration, eliminating external boot PROMs.
Key features of the 10M16DAF484I7P include 16,000 logic elements, 549 kbit embedded SRAM, 320 maximum user I/Os, 45 18x18 multipliers, dual ADCs with up to 12-bit resolution and 1 MSPS sampling, integrated PLLs, and embedded flash for instant-on operation. The industrial-grade -40C to +100C temperature range (I7 suffix) supports factory, automotive, and harsh-environment deployments.
Technically, the device uses a TSMC 55 nm embedded-flash process and a Logic Element (LE) fabric with adaptive logic modules (ALMs), 9 Kbit M9K memory blocks, and a hard memory controller that supports DDR3/LPDDR2 external memories. The integrated ADC operates in parallel with logic, enabling closed-loop analog/digital control without external parts.
Typical applications include industrial motor control and PLCs, video bridge and display controllers, automotive driver-assistance systems, portable instrumentation, factory automation I/O expansion, and low-cost ASIC prototyping where instant-on and small footprint matter.
When designing in the 484-FBGA, allocate a 1.2 V core rail with sub-3% tolerance and matched-length DDR traces to maintain signal integrity; the ADC reference must be low-noise to avoid coupling into analog inputs.
This page synthesizes live distributor pricing, package-matched drop-in alternatives from the MAX 10 family, and PCB-level design notes not contained in the Altera MAX 10 datasheet.
드롭인 대체품: 10M16DAF484I7P — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M16DAF484I7P (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Embedded Memory, Mounting Type, Configuration.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M16DAF484I7G
✅ 드롭인✓ 재고 있음
$60.4 / 개
데이터시트 보기 →10M16DAF484C7G
✅ 드롭인✓ 재고 있음
$55.5 / 개
데이터시트 보기 →10M16DAF484A7G
✅ 드롭인✓ 재고 있음
$12.1 / 개
데이터시트 보기 →10M08DAF484I7P
✅ 드롭인✓ 재고 있음
$22.1 / 개
데이터시트 보기 →10M16DAF484I7P 최대 정격 & 전기적 특성
| Product Line | MAX 10 FPGA |
| Device Logic Elements | 16,000 LE |
| Adaptive Logic Modules (ALMs) | 320 ALM |
| Embedded Memory | 549 kbit (M9K blocks) |
| Maximum User I/Os | 320 I/O |
| 패키지 | 484-ball FBGA (F484) |
| Operating Supply Voltage (Core) | 1.2 V |
| 동작 온도 | -40C to +100C (Industrial) |
| 장착 스타일 | SMD/SMT |
| DSP Blocks (18x18 Multipliers) | 45 |
| Configuration Type | Non-volatile (internal flash) |
| Integrated ADC | Dual 12-bit, up to 1 MSPS |
| PLLs | 4 user PLLs |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant |
10M16DAF484I7P 484-ball fbga (f484) 핀 구성 가이드
10M16DAF484I7P(484-ball fbga (f484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M16DAF484I7P.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M16DAF484I7P 적합 용도: 6 애플리케이션s: Industrial Motor Control and PLC, Video Bridge and Display Controller, Automotive Driver-Assistance Subsystem, Factory Automation I/O Expansion, Portable Test and Measurement, Low-Cost ASIC Prototyping.
Industrial Motor Control and PLC
The 10M16DAF484I7P's 16K logic elements, 45 18x18 hardware multipliers, and dual 1 MSPS 12-bit ADCs make it well-suited to closed-loop field-oriented control (FOC) of three-phase PMSM and induction motors. The device drives multiple PWM channels concurrently, samples motor phase currents via the integrated ADC, and executes the FOC transform in hardware with deterministic latency. The industrial -40C to +100C temperature range covers factory-floor enclosures without derating. With 549 kbit embedded SRAM the soft-position-loop fits on-chip, removing external memory from the BOM. The 320 I/Os accept quadrature encoders, Hall sensors, and CAN/RS485 transceivers simultaneously. Quoted as of 2026-09-05 the part provides higher LE density than the 10M08 family at the same 484-FBGA footprint.
추천
Video Bridge and Display Controller
With 16,000 logic elements and 45 dedicated 18x18 multipliers the 10M16DAF484I7P runs real-time format conversion between parallel RGB, LVDS, and MIPI-style interfaces without visible latency. The 549 kbit of block RAM holds frame buffers up to 320x240 at 16 bpp, removing external SRAM in cost-sensitive designs. 320 user I/Os support 24-bit parallel video plus sync, plus a secondary touch-panel interface. Designers can integrate alpha blending, color-space conversion, and on-screen overlay within a single FPGA. Quartus Prime reference designs for HDMI-to-LVDS bridges target this exact device. The 484-FBGA exposes enough balls for dual-display outputs. Real-world deployments include industrial HMI panels and digital signage repeaters.
추천
Automotive Driver-Assistance Subsystem
The 10M16DAF484I7P industrial grade operates across -40C to +100C, supporting ADAS sensor fusion nodes mounted behind the bumper. When AEC-Q100 qualification is required, designers migrate to the 10M16DAF484A7G automotive variant which shares the same die and 484-FBGA footprint. The integrated dual ADC samples up to 12 bits at 1 MSPS, ideal for ultrasonic-park-assist echo capture and battery-monitoring channels. 16K LE perform sensor-fusion DSP and CAN-FD message filtering concurrently. 320 I/Os accept multiple CSI-style camera lanes plus CAN/LIN transceivers. The non-volatile flash allows instant-on within 10 ms after power-up, critical for rear-camera wake-up. Pin-compatible migration to AEC-Q100 is a single OPN change.
추천
Factory Automation I/O Expansion
Programmable logic controllers (PLCs) and remote I/O blocks use the 10M16DAF484I7P to implement 32+ channels of isolated digital input debouncing, pulse counting, and PWM output generation in a single chip. The 320 user I/Os comfortably accommodate Profibus, RS-485, Ethernet, and discrete I/O without external muxing. 549 kbit of block memory buffers high-speed event logs locally. The integrated ADC reads 4-20 mA analog inputs for process-control loops. Industrial temperature grade -40C to +100C supports cabinet-free mounting on the factory floor. The non-volatile MAX 10 configuration ensures deterministic boot for safety PLCs requiring IEC 61131-3 compliance.
추천
Portable Test and Measurement
Handheld oscilloscopes, logic analyzers, and protocol testers use the 10M16DAF484I7P for capture buffering and triggering. The 549 kbit embedded memory stores pre-trigger samples and decodes I2C, SPI, UART, and CAN-FD frames in real time. 16K LE implement hardware decoders for parallel buses up to 32 bits wide. Dual ADCs at 1 MSPS handle analog front-end sampling for entry-level scopes. Industrial temperature grade supports outdoor field-service use cases. The instant-on flash configuration eliminates boot delays at customer sites. USB and Ethernet MAC IP cores from Quartus Prime fit comfortably within the 16K LE budget.
추천
Low-Cost ASIC Prototyping
Engineers validate ASIC RTL on the 10M16DAF484I7P before committing to mask costs, leveraging 16K LE for medium-complexity SoC prototypes and 45 multipliers for DSP pre-silicon verification. The 484-FBGA exposes 320 I/Os to connect to real-world peripherals and DDR3 memory for early software bring-up. Non-volatile configuration allows rapid board-spin iteration - designers reprogram via JTAG in seconds. Quartus Prime supports the same synthesis flow used for Cyclone V and Cyclone 10 LP families, easing downstream migration. The industrial temperature grade enables prototype validation in target environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M16DAF484I7P — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M16DAF484I7G | 10M16DAF484C7G | 10M16DAF484A7G | 10M08DAF484I7P |
|---|---|---|---|---|---|
| Package | 484-FBGA (F484) | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 16,000 LE | 16,000 LE | 16,000 LE | 16,000 LE | 8,000 LE (-50%) |
| Embedded Memory | 549 kbit | 549 kbit | 549 kbit | 549 kbit | 378 kbit (-31%) |
| User I/Os | 320 | 320 | 320 | 320 | 250 (-22%) |
| 18x18 Multipliers | 45 | 45 | 45 | 45 | 24 (-47%) |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Automotive -40C to +125C (AEC-Q100) | Industrial -40C to +100C |
| Configuration Type | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash |
주요 차별점
- Highest-density 10M16 die with 16K LE and 549 kbit memory (vs 10M08DAF484I7P)
- Industrial temperature grade I7 with -40C to +100C operation (vs 10M16DAF484C7G)
- AEC-Q100 migration path to 10M16DAF484A7G (vs 10M16DAF484I7G)
설계 노트
Estimated: at 50% toggle rate and 25C ambient, the 10M16DAF484I7P core draws roughly 0.8-1.2 A from the 1.2 V supply, while the 2.5 V/3.3 V I/O banks can add another 0.3 A. Use a 3% tolerance LDO such as Intel Enpirion EM2130 or a switching regulator with output ripple below 30 mV pk-pk. Decouple each VCCINT pin with a 0.1 uF X7R plus a 10 uF bulk; place 0.1 uF within 1 mm of each ball. Separately filter VCCA (analog PLL/ADC supply) from VCCD to avoid digital switching noise coupling into the ADC reference.
The 484-FBGA uses 1.0 mm ball pitch and requires microvia or HDI PCB stack-up with 4-6 routing layers. Match all DDR3/LPDDR2 traces within +/-25 mil length, route address/control in matched groups, and provide proper 50 ohm single-ended or 100 ohm differential impedance. Expose a thermal pad array under the package to inner ground planes for heat spreading; at 1.5 W dissipation the junction-to-ambient rise is approximately 15-20 C with proper copper. Recommended footprint per IPC-7351 FBGA-484 1.0 mm pitch.
Do not leave the nCONFIG, nSTATUS, or MSEL pins floating - tie MSEL[3:0] to GND/3.3 V to select FPP-x16 or AS-x4 configuration mode per MAX 10 handbook Table 8-1. The CONF_DONE pin requires a 5 kohm pull-up to 3.3 V. For JTAG boundary-scan, connect TCK with a 1 kohm pull-down and TMS with a 10 kohm pull-up. Failing to follow MSEL rules is the most common cause of 'device not detected' issues during programming.
규정 준수 정보
Pb-free and RoHS compliant per Altera/Intel product page. Industrial-grade I7 part is NOT AEC-Q100 qualified; choose 10M16DAF484A7G automotive variant for that certification.