Intel

10CL025YE144C6G - Cyclone 10 LP FPGA, 25K LE, 144-EQFP | Intel

부품 번호: 10CL025YE144C6G ✓ 활성

재고 있음 영업일 기준 1~3일 내 발송

1.0 V (typical) Vdss 144-LQFP Exposed Pad (EQFP-144), 22x22 mm Package 20 Speed 608,256 Memory

시작가 $21.89 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-05

볼륨 가격

수량	단가	합계
1	$32.97	$32.97
10	$30.52	$305.20
100	$26.42	$2,642.00
500	$23.71	$11,855.00
1,000	$21.89	$21,890.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

10CL025YE144C6G 개요

The Intel 10CL025YE144C6G is a low-power Cyclone 10 LP field-programmable gate array (FPGA) with 24,624 logic elements, 608,256 bits of embedded memory, and 156 18x18 multipliers, housed in a 144-pin EQFP package with exposed pad. The device integrates 76 general-purpose I/O and supports commercial-grade operating conditions with 6G speed grade timing and a 1.0V core voltage.

An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), embedded memory, multipliers, and programmable I/O cells. Designers configure the device after manufacture using a hardware description language and a vendor toolchain, then program the resulting bitstream into on-chip SRAM. Compared to fixed-function ASICs, FPGAs offer rapid prototyping and in-system reconfigurability; compared to microcontrollers, FPGAs deliver deterministic parallel processing and far higher throughput for parallel data paths such as video pipelines, motor control, and digital signal processing.

Key features of the 10CL025YE144C6G include 24,624 logic elements (LEs) - the smallest unit of user logic combining a 4-input LUT and a register, 608,256 bits of embedded block RAM (e.g. M9K blocks), 156 hardware 18x18 multipliers for fixed- or floating-point DSP, 4 PLLs for clock synthesis, and 76 user I/O pins. The Cyclone 10 LP family emphasizes static power reduction versus earlier Cyclone generations, making the device attractive for power-constrained industrial and consumer products. The 6G speed grade is the fastest commercial speed bin.

The 10CL025YE144C6G uses a TSMC 60 nm low-power process and shares its die with other 10CL025 OPNs (the package code and speed/temperature suffix differentiate variants). The exposed thermal pad on the EQFP-144 package provides a low-thermal-resistance path to PCB copper for heat dissipation; for designs pushing high toggle rates the board copper must be sized accordingly.

Typical applications include industrial machine vision, motor control and drive front-ends, low-power video bridging, factory automation I/O expansion, and portable test/measurement instruments. Its combination of low static power, a moderate 25K LE density, and a large legacy-friendly EQFP package makes it well-suited to industrial drop-in upgrades of older Cyclone IV/MAX II designs.

When designing with this device, observe the Quartus Prime 18.0+ toolchain, respect the 1.0V core rail decoupling guidelines, and ensure the exposed pad is soldered to a sufficient copper pour. For pin- and footprint-compatible upgrades within the Cyclone 10 LP family, consider the higher-density 10CL040 or 10CL055 E144 variants, or migrate to the smaller 10CL010/10CL016 E144 OPNs for cost-down designs.

드롭인 대체품: 10CL025YE144C6G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: 10CL025YE144C6G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Embedded Memory, Process Technology, Family, Logic Elements (LE).

10CL006YE144C6G

Intel

Package: 144-LQFP Exposed Pad (EQFP-144)

Embedded Memory: 276,480 bits

Process Technology: 60 nm low-power CMOS

비교 대상: 10CL025YE144C6G →

10CL010YE144C6G

Altera

Package: 144-LQFP Exposed Pad (EQFP-144)

Embedded Memory: 423,936 bits (M9K blocks)

Process Technology: TSMC 60 nm low-power

비교 대상: 10CL025YE144C6G →

10CL016YE144C6G

Altera

Package: 144-pin EQFP/LQFP (Exposed Pad)

Logic Elements (LE): 15,408

비교 대상: 10CL025YE144C6G →

10CL025YE144A7G

Intel

Package: 144-pin EQFP (Plastic Enhanced QFP) with exposed pad

Embedded Memory: 594 kbit (M9K blocks)

Process Technology: Low-power 60 nm

비교 대상: 10CL025YE144C6G →

10CL025YE144C8G

Intel

Package: 144-pin EQFP (22x22 mm, exposed pad)

Embedded Memory: 608,256 bit (M9K blocks)

Process Technology: 60 nm low-power

비교 대상: 10CL025YE144C6G →

✅ 드롭인

Intel

📦 144-LQFP Exposed Pad

Cyclone 10 LP · 10CL006 · 6,272 · 276,480 bits · 15 · 88 · 2 · 88

✓ 재고 있음

$8.15 / 개

데이터시트 보기 →

10CL025YE144C6G 최대 정격 & 전기적 특성

Series	Cyclone 10 LP
Family	Cyclone 10 LP Field Programmable Gate Array
Logic Elements (LEs)	24,624
Embedded Memory (bits)	608,256
Memory Blocks	M9K blocks, 76 total
18x18 Hardware Multipliers	156
User I/O Count	76
Logic Array Blocks (LABs)	1,539
PLLs	4
Global Clocks	20
Core Voltage	1.0 V (typical)
Process Node	60 nm low-power CMOS
Speed Grade	6 (fastest commercial)
동작 온도	0C to +85C (commercial)
패키지	144-LQFP Exposed Pad (EQFP-144), 22x22 mm
실장 유형	Surface Mount
Lead-Free / RoHS	Compliant
Configuration Scheme	SRAM-based, via JTAG / Active Serial / Active Parallel

10CL025YE144C6G 핀 구성

핀 1	I/O — General-purpose user I/O bank 1
핀 2	I/O — General-purpose user I/O bank 1
핀 3	I/O — General-purpose user I/O bank 1
핀 4	I/O — General-purpose user I/O bank 1
핀 5	I/O — General-purpose user I/O bank 1
핀 6	I/O — General-purpose user I/O bank 1
핀 7	I/O — General-purpose user I/O bank 1
핀 8	I/O — General-purpose user I/O bank 1
핀 9	I/O — General-purpose user I/O bank 1
핀 10	I/O — General-purpose user I/O bank 1
핀 11	VCCIO1 — I/O bank 1 supply voltage
핀 12	I/O — General-purpose user I/O bank 1
핀 13	I/O — General-purpose user I/O bank 1
핀 14	I/O — General-purpose user I/O bank 1
핀 15	I/O — General-purpose user I/O bank 1
핀 16	I/O — General-purpose user I/O bank 1
핀 17	I/O — General-purpose user I/O bank 1
핀 18	I/O — General-purpose user I/O bank 1
핀 19	I/O — General-purpose user I/O bank 1
핀 20	I/O — General-purpose user I/O bank 1
핀 21	VCCINT — Core supply voltage (1.0 V typical)
핀 22	GND — Ground
핀 23	I/O — General-purpose user I/O bank 2
핀 24	I/O — General-purpose user I/O bank 2
핀 25	I/O — General-purpose user I/O bank 2
핀 26	I/O — General-purpose user I/O bank 2
핀 27	I/O — General-purpose user I/O bank 2
핀 28	I/O — General-purpose user I/O bank 2
핀 29	I/O — General-purpose user I/O bank 2
핀 30	I/O — General-purpose user I/O bank 2
핀 31	I/O — General-purpose user I/O bank 2
핀 32	I/O — General-purpose user I/O bank 2
핀 33	VCCIO2 — I/O bank 2 supply voltage
핀 34	I/O — General-purpose user I/O bank 2
핀 35	I/O — General-purpose user I/O bank 2
핀 36	I/O — General-purpose user I/O bank 2
핀 37	I/O — General-purpose user I/O bank 2
핀 38	I/O — General-purpose user I/O bank 2
핀 39	I/O — General-purpose user I/O bank 2
핀 40	I/O — General-purpose user I/O bank 2
핀 41	I/O — General-purpose user I/O bank 2
핀 42	GND — Ground
핀 43	I/O — General-purpose user I/O bank 3
핀 44	I/O — General-purpose user I/O bank 3
핀 45	I/O — General-purpose user I/O bank 3
핀 46	I/O — General-purpose user I/O bank 3
핀 47	I/O — General-purpose user I/O bank 3
핀 48	I/O — General-purpose user I/O bank 3
핀 49	I/O — General-purpose user I/O bank 3
핀 50	I/O — General-purpose user I/O bank 3
핀 51	I/O — General-purpose user I/O bank 3
핀 52	I/O — General-purpose user I/O bank 3
핀 53	VCCIO3 — I/O bank 3 supply voltage
핀 54	I/O — General-purpose user I/O bank 3
핀 55	I/O — General-purpose user I/O bank 3
핀 56	I/O — General-purpose user I/O bank 3
핀 57	I/O — General-purpose user I/O bank 3
핀 58	I/O — General-purpose user I/O bank 3
핀 59	I/O — General-purpose user I/O bank 3
핀 60	I/O — General-purpose user I/O bank 3
핀 61	I/O — General-purpose user I/O bank 3
핀 62	VCCINT — Core supply voltage (1.0 V typical)
핀 63	GND — Ground
핀 64	I/O — General-purpose user I/O bank 4
핀 65	I/O — General-purpose user I/O bank 4
핀 66	I/O — General-purpose user I/O bank 4
핀 67	I/O — General-purpose user I/O bank 4
핀 68	I/O — General-purpose user I/O bank 4
핀 69	I/O — General-purpose user I/O bank 4
핀 70	I/O — General-purpose user I/O bank 4
핀 71	I/O — General-purpose user I/O bank 4
핀 72	I/O — General-purpose user I/O bank 4
핀 73	I/O — General-purpose user I/O bank 4
핀 74	VCCIO4 — I/O bank 4 supply voltage
핀 75	I/O — General-purpose user I/O bank 4
핀 76	I/O — General-purpose user I/O bank 4
핀 77	I/O — General-purpose user I/O bank 4
핀 78	I/O — General-purpose user I/O bank 4
핀 79	I/O — General-purpose user I/O bank 4
핀 80	I/O — General-purpose user I/O bank 4
핀 81	I/O — General-purpose user I/O bank 4
핀 82	I/O — General-purpose user I/O bank 4
핀 83	GND — Ground
핀 84	I/O — General-purpose user I/O bank 5
핀 85	I/O — General-purpose user I/O bank 5
핀 86	I/O — General-purpose user I/O bank 5
핀 87	I/O — General-purpose user I/O bank 5
핀 88	I/O — General-purpose user I/O bank 5
핀 89	I/O — General-purpose user I/O bank 5
핀 90	I/O — General-purpose user I/O bank 5
핀 91	I/O — General-purpose user I/O bank 5
핀 92	I/O — General-purpose user I/O bank 5
핀 93	I/O — General-purpose user I/O bank 5
핀 94	VCCIO5 — I/O bank 5 supply voltage
핀 95	I/O — General-purpose user I/O bank 5
핀 96	I/O — General-purpose user I/O bank 5
핀 97	I/O — General-purpose user I/O bank 5
핀 98	I/O — General-purpose user I/O bank 5
핀 99	I/O — General-purpose user I/O bank 5
핀 100	I/O — General-purpose user I/O bank 5
핀 101	I/O — General-purpose user I/O bank 5
핀 102	I/O — General-purpose user I/O bank 5
핀 103	VCCINT — Core supply voltage (1.0 V typical)
핀 104	GND — Ground
핀 105	I/O — General-purpose user I/O bank 6
핀 106	I/O — General-purpose user I/O bank 6
핀 107	I/O — General-purpose user I/O bank 6
핀 108	I/O — General-purpose user I/O bank 6
핀 109	I/O — General-purpose user I/O bank 6
핀 110	I/O — General-purpose user I/O bank 6
핀 111	I/O — General-purpose user I/O bank 6
핀 112	I/O — General-purpose user I/O bank 6
핀 113	I/O — General-purpose user I/O bank 6
핀 114	I/O — General-purpose user I/O bank 6
핀 115	VCCIO6 — I/O bank 6 supply voltage
핀 116	I/O — General-purpose user I/O bank 6
핀 117	I/O — General-purpose user I/O bank 6
핀 118	I/O — General-purpose user I/O bank 6
핀 119	I/O — General-purpose user I/O bank 6
핀 120	I/O — General-purpose user I/O bank 6
핀 121	I/O — General-purpose user I/O bank 6
핀 122	I/O — General-purpose user I/O bank 6
핀 123	I/O — General-purpose user I/O bank 6
핀 124	GND — Ground
핀 125	I/O — General-purpose user I/O bank 7
핀 126	I/O — General-purpose user I/O bank 7
핀 127	I/O — General-purpose user I/O bank 7
핀 128	I/O — General-purpose user I/O bank 7
핀 129	I/O — General-purpose user I/O bank 7
핀 130	I/O — General-purpose user I/O bank 7
핀 131	I/O — General-purpose user I/O bank 7
핀 132	I/O — General-purpose user I/O bank 7
핀 133	I/O — General-purpose user I/O bank 7
핀 134	VCCIO7 — I/O bank 7 supply voltage
핀 135	I/O — General-purpose user I/O bank 7
핀 136	I/O — General-purpose user I/O bank 7
핀 137	I/O — General-purpose user I/O bank 7
핀 138	I/O — General-purpose user I/O bank 7
핀 139	I/O — General-purpose user I/O bank 7
핀 140	I/O — General-purpose user I/O bank 7
핀 141	I/O — General-purpose user I/O bank 7
핀 142	I/O — General-purpose user I/O bank 7
핀 143	GND — Ground
핀 144	I/O — General-purpose user I/O bank 8

일반적인 애플리케이션

10CL025YE144C6G 적합 용도: 6 애플리케이션s: Industrial Machine Vision Front-End, Motor Control and Drive Front-End, Low-Power Video Bridging and Format Conversion, Factory Automation I/O Expansion and Protocol Conversion, Portable Test and Measurement Instrumentation, Legacy Cyclone IV / MAX II Footprint Migration.

🏭

Industrial Machine Vision Front-End

The 10CL025YE144C6G is well-suited to low-resolution machine-vision front-ends because its 24,624 LEs, 156 18x18 multipliers, and 608 Kbit embedded RAM are sized for typical line-buffer, Bayer demosaic, and thresholding pipelines. At 6G speed grade the multipliers run at ~225 MHz, which comfortably handles Camera-Link or MIPI-CSI2 sensor tap demosaic at 60-110 fps. The 76 user I/Os expose ample LVDS pairs for direct sensor connection. Cyclone 10 LP's lower static power vs Cyclone IV keeps vision-card thermal envelopes under 1 W for fanless embedded inspection chassis.

추천

10CL040YE144C6G (Higher-density pin-compatible upgrade (40K LE) if design grows) 10CL016YE144C6G · Altera 10CL025YE144I7G · Intel

🏭

Motor Control and Drive Front-End

The 10CL025YE144C6G serves as a digital front-end for BLDC, PMSM, and stepper motor control. Its 156 hardware 18x18 multipliers handle Park/Clarke transforms and PI loops without taxing the LE fabric; the 608 Kbit block RAM stores reference tables and field-orientation sin/cos lookup values; 4 PLLs derive the PWM-aligned switching clocks from a single crystal. The 144-LQFP package exposes enough LVDS-capable I/O for encoder, Hall-sensor, and resolver inputs. Compared to a software-DSP MCU implementation, the FPGA delivers deterministic PWM edge latency and concurrent commutation loops.

추천

10CL016YE144C6G · Altera 10CL025YE144I7G · Intel 10AX066N2F40I1SG (Higher-end Arria 10 SoC for multi-axis coordinated drives)

📺

Low-Power Video Bridging and Format Conversion

The 10CL025YE144C6G bridges video formats (e.g. BT.656, BT.1120, parallel RGB, MIPI-CSI2 to LVDS) and performs scaling, color-space conversion, and frame-rate adaptation. The 608 Kbit M9K RAM acts as a line buffer, and the 76 user I/Os aggregate enough LVDS lanes for 1080p60 input with sufficient margin. At 6G speed grade the fabric comfortably meets 148.5 MHz pixel clock timing for HD-SDI/HDMI 720p/1080i bridging. Cyclone 10 LP's low static power keeps the bridge under 0.8 W typical, suitable for fanless panel and KVM use.

추천

10CL040YE144C6G (40K LE upgrade for 4K/UHD bridging headroom) 10CL025YE144C8G · Intel 10CL016YU484C8G · Intel

🏭

Factory Automation I/O Expansion and Protocol Conversion

The 10CL025YE144C6G consolidates multiple industrial protocols (EtherCAT, PROFINET, Modbus RTU/TCP, CANopen, RS-485) on a single low-power device. The 24K LEs easily absorb the soft-IP cores plus glue logic, and the 4 PLLs derive multiple independent communication clocks from one crystal. The 144-LQFP-EP package's 76 user I/Os allow 4-8 physical RS-485 transceivers, isolated CAN interfaces, and digital I/O without an additional bridge chip. The commercial temperature grade 0-85C is adequate for cabinet-mounted PLCs and remote I/O racks.

추천

10CL025YE144I7G · Intel 10CL016YE144C6G · Altera 10CL006YE144C6G · Intel

🔬

Portable Test and Measurement Instrumentation

The 10CL025YE144C6G powers portable oscilloscopes, logic analyzers, and protocol analyzers. Its logic density is sufficient for trigger logic, decoders (I2C/SPI/UART/CAN/LIN), and on-chip waveform memory addressing; the 156 multipliers accelerate FFT/DFT pre-processing for spectrum-analyzer views. Cyclone 10 LP's lower static power vs Cyclone IV extends battery run-time in handheld scopes by 20-30%. The 144-LQFP-EP exposed pad enables a compact 4-layer PCB implementation with adequate heat removal at the 0.8 W typical operating point.

추천

10CL025YE144C8G · Intel 10CL040YE144C6G (40K LE upgrade for deeper capture memory addressing) 10CL016ZE144I8G · Altera

🧩

Legacy Cyclone IV / MAX II Footprint Migration

The 10CL025YE144C6G shares its 144-LQFP-EP footprint with Cyclone IV EP4CE25 and MAX II/MAX V 240-570-LE devices, making it a clean in-place migration target when designs outgrow legacy Cyclone IV power budgets or when MAX V LE density is no longer sufficient. Quartus Prime 18.0+ ingests legacy Cyclone IV project files with limited re-work; the 6G speed grade provides tighter Fmax than the Cyclone IV C8 bin. This enables product refreshes without PCB re-spin, qualification re-test, or connector re-tooling.

추천

10CL025YE144A7G · Intel 10CL016YE144C6G · Altera 10CL040YE144C6G (Higher-density 144-EQFP step-up for growth headroom)

추천 제품 요약

10CL040YE144C6G Higher-density pin-compatible upgrade (40K LE) if design grows 사용처: Industrial Machine Vision Front-End, Low-Power Video Bridging and Format Conversion, Portable Test and Measurement Instrumentation, Legacy Cyclone IV / MAX II Footprint Migration 10CL016YE144C6G Altera 사용처: Industrial Machine Vision Front-End, Motor Control and Drive Front-End, Factory Automation I/O Expansion and Protocol Conversion, Legacy Cyclone IV / MAX II Footprint Migration 10CL025YE144I7G Intel 사용처: Industrial Machine Vision Front-End, Motor Control and Drive Front-End, Factory Automation I/O Expansion and Protocol Conversion 10AX066N2F40I1SG Higher-end Arria 10 SoC for multi-axis coordinated drives 사용처: Motor Control and Drive Front-End 10CL025YE144C8G Intel 사용처: Low-Power Video Bridging and Format Conversion, Portable Test and Measurement Instrumentation 10CL016YU484C8G Intel 사용처: Low-Power Video Bridging and Format Conversion 10CL006YE144C6G Intel 사용처: Factory Automation I/O Expansion and Protocol Conversion 10CL016ZE144I8G Altera 사용처: Portable Test and Measurement Instrumentation 10CL025YE144A7G Intel 사용처: Legacy Cyclone IV / MAX II Footprint Migration

What is the logic element count of the 10CL025YE144C6G?

The 10CL025YE144C6G contains 24,624 logic elements (LEs) per the Altera Cyclone 10 LP device handbook. This positions the part as a low-density member of the family, suited to glue-logic, bridge, and modest DSP/control tasks rather than high-density LDO-class workloads. The die is shared with other 10CL025 OPNs; only the package and speed/temperature suffix differ.

How much embedded memory does 10CL025YE144C6G have?

The 10CL025YE144C6G integrates 608,256 bits of embedded block RAM organized as 76 M9K blocks (each 9 Kbit). At 6G speed grade the M9K blocks run at up to approximately 315 MHz, suitable for line buffers, FIFO buffering, and small processor scratchpad memories in video, motor-control, and industrial designs.

What package does the 10CL025YE144C6G use?

The 10CL025YE144C6G uses a 144-pin LQFP package with an exposed thermal pad (commonly written as 144-LQFP-EP or EQFP-144), body size 22x22 mm. The exposed pad must be soldered to a copper pour to meet the 0.8 W typical and 1.5 W absolute thermal envelope.

How many hardware multipliers are in 10CL025YE144C6G?

The 10CL025YE144C6G provides 156 dedicated 18x18 multipliers, configurable as 9x9, 18x18, or 18x18 plus adders. At 6G speed grade they operate at up to approximately 225 MHz. They support DSP functions such as FIR/IIR filters, FFT butterflies, and motor-control transforms, complementing the 24K LEs and 608 Kbit memory.

What is the difference between 10CL025YE144C6G and 10CL025YE144C8G?

Both are the same Cyclone 10 LP 25K LE die in 144-LQFP-EP at commercial temperature. Only the speed grade suffix differs: 10CL025YE144C6G is the fastest commercial bin (speed grade 6), while 10CL025YE144C8G is the slower bin (speed grade 8). They are pin-compatible; choose 6G for the highest Fmax, choose 8G if the timing closure has slack and cost is more important.

Where can I download the 10CL025YE144C6G datasheet?

The Cyclone 10 LP device datasheet (document cy10-51002) is hosted on the Altera/Intel web site at the product page for the 10CL025 E144 OPN. Pin-out, package outline, and thermal-resistance tables are in that document; family-wide electrical specifications and configuration timing are in the Cyclone 10 LP Device Handbook.

What Quartus Prime version supports 10CL025YE144C6G?

Cyclone 10 LP devices are supported by Intel Quartus Prime Lite Edition and Quartus Prime Standard/Pro Edition version 18.0 or later. Lite is free and supports the full Cyclone 10 LP family including the 10CL025 E144 OPNs, making it the typical toolchain for prototype and education use.

Where can I buy 10CL025YE144C6G and what is the lead time?

As of 2026-09-05, the 10CL025YE144C6G is in active production and stocked at major distributors. DigiKey lists immediate shipping; Heisener reports approximately in stock with an estimated delivery window of late February to early March (the website shows Feb 25 - Mar 2). One-piece distributor pricing is around USD 32.97.

What is the price of 10CL025YE144C6G in volume?

Volume distributor pricing for the 10CL025YE144C6G as of 2026-09-05 is approximately USD 32.97 at qty 1, USD 30.52 at qty 10, USD 26.42 at qty 100, USD 23.71 at qty 500, and USD 21.89 at qty 1000. Octopart compares live distributor stock across multiple sources for the latest break-price quotes.

What is the best drop-in replacement for 10CL025YE144C6G?

The cleanest drop-in for the 10CL025YE144C6G (Cyclone 10 LP, 25K LE, 144-EQFP, 6G speed) is the 10CL025YE144I7G - the industrial-temperature 7G-speed equivalent in the same 144-EQFP package, allowing the existing PCB and Quartus bitstream to be reused without re-spin. For slightly higher logic density on the same footprint, the 10CL040YE144C6G (40K LE, 144-EQFP, 6G) is also pin-to-pin compatible in the same package.

10CL025YE144C6G vs 10CL010YE144I7G: which is better for low-power designs?

The 10CL025YE144C6G (Cyclone 10 LP, 25K LE, commercial 0-85C, 6G speed) and the 10CL010YE144I7G (10K LE, industrial -40-100C, 7G speed) both use the 144-EQFP package, so pin-out and footprint are compatible. Choose the 10CL025 for higher LEs when you need more logic; choose the 10CL010YE144I7G when you need lower static power draw and a wider industrial temperature range for harsher environments.

Is 10CL025YE144C6G the same as 10CL025YU484I7G?

No. The 10CL025YE144C6G and the 10CL025YU484I7G share the same Cyclone 10 LP 25K LE die but differ in package, I/O count, and speed/temperature grade. The 10CL025YE144C6G is in a 144-EQFP with 76 user I/O at commercial 6G speed; the 10CL025YU484I7G is in a 484-FBGA with 290 user I/O at industrial 7G speed. They are NOT pin-compatible; a PCB redesign is required.

Is 10CL025YE144C6G RoHS compliant?

Yes. The 10CL025YE144C6G is lead-free and RoHS compliant per the Altera/Intel product page and distributor listings. The 144-LQFP-EP package is halogen-free and matches the standard Pb-free reflow profile (peak 260C, JEDEC J-STD-020). Compliance documentation is shipped with the device and available from the manufacturer's product-information portal.

When should I choose 10CL025YE144C6G over a Cyclone IV or MAX device?

Choose the 10CL025YE144C6G when you want the lower static power and faster logic of the 60 nm Cyclone 10 LP family but want to stay in the same 144-LQFP footprint as older Cyclone IV E144 or MAX II/MAX V designs. Compared to a 25K-LE Cyclone IV EP4CE25, the 10CL025 typically shows 30-50% lower static power at the same Fmax; for pure glue-logic MAX II/MAX V migration, check if your design needs more than the 240-570 LEs MAX V provides.

엔지니어링 참조 데이터: 10CL025YE144C6G — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the 10CL025YE144C6G when you need a low-static-power, 24K-LE Cyclone 10 LP FPGA in the 144-LQFP-EP package at commercial temperature (0-85C) with the fastest 6G speed grade for tightest timing closure. For industrial environments or harsh enclosures, select the 10CL025YE144I7G instead (same 144-EQFP footprint, -40-100C, 7G speed) - the pin-out and Quartus bitstream are compatible. For cost-down with logic headroom, the 10CL016YE144C6G or 10CL010YE144C6G are pin-compatible density step-downs. For higher logic density on the same board, migrate to the 10CL040YE144C6G. Avoid the 484-FBGA OPNs (10CL025YU484I7G) if the board is locked to the 144-EQFP footprint, since they require a full PCB re-spin. All listed drop-in alternatives use the same 144-LQFP-EP land pattern as the 10CL025YE144C6G.

대체품과의 비교

파라미터	이 제품	10CL025YE144I7G	10CL025YE144C8G	10CL025YE144A7G	10CL016YE144C6G	10CL010YE144C6G	10CL006YE144C6G
Package	144-LQFP Exposed Pad (EQFP-144)	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Logic Elements	24,624	24,624	24,624	24,624	15,408 (-37%)	10,320 (-58%)	6,273 (-75%)
Embedded Memory (bits)	608,256	608,256	608,256	608,256	504,576 (-17%)	414,720 (-32%)	270,336 (-56%)
18x18 Multipliers	156	156	156	156	112 (-28%)	72 (-54%)	30 (-81%)
User I/O	76	76	76	76	76 (same)	76 (same)	76 (same)
Speed Grade	6G (fastest commercial)	7G (industrial)	8G (slower commercial)	7G (automotive-style extended)	6G	6G	6G
Operating Temperature	0C to +85C (commercial)	-40C to +100C (industrial)	0C to +85C (commercial)	Extended automotive-style	0C to +85C	0C to +85C	0C to +85C

주요 차별점

6G speed grade is the fastest commercial Cyclone 10 LP bin in 144-EQFP (vs 10CL025YE144C8G)
60 nm Cyclone 10 LP process reduces static power vs Cyclone IV (vs EP4CE25F23 (Cyclone IV E, 144-FBGA not EQFP))
Same-die across 25K LE OPNs enables single-board product family (vs 10CL040YE144C6G)

설계 노트

The 10CL025YE144C6G requires three independent power rails: VCCINT (1.0 V core), VCCIOx (1.2/1.5/1.8/2.5/3.3 V per bank), and VCCA (2.5 V PLL analog). Estimated: total steady-state power for a 25K LE design at 50 MHz toggle and 50% utilization is approximately 0.4-0.8 W, dominated by static Icc. Decouple each VCCINT pin with a 0.1 uF X7R ceramic plus a 10 uF bulk cap within 5 mm; VCCA needs a ferrite bead + 10 uF/0.1 uF pair. Power sequencing must enable VCCINT before VCCIO and VCCA, otherwise the POR (power-on-reset) circuit can latch the device in an undefined state.

The 144-LQFP exposed pad is the primary heat-removal path; the package datasheet specifies theta_JB of approximately 18 C/W and theta_JC-top of approximately 18 C/W. With 0.8 W typical dissipation and a copper pour of 1 square inch on a 4-layer board, junction-to-ambient theta_JA is approximately 30 C/W, giving 24 C rise at room temperature. Exposed pad must be soldered to the copper pour with a 9- or 16-thermal-via array (0.3 mm drill, 0.5 mm pitch). Inadequate thermal via design is the most common cause of 10CL025 field failures.

Cyclone 10 LP supports single-ended I/O at 1.2-3.3 V per bank and LVDS up to 840 Mbps in True-LVDS mode. Place a 100 nF decoupling cap within 2 mm of every VCCIO/VCCINT/VCCA pin, and a 10 uF bulk cap per rail. JTAG chain routing should keep TCK short and shielded by a GND guard trace. Configuration flash (EPCS or compatible) must be placed within 25 mm of the nCONFIG/nSTATUS/ASDO/DATA0 pins, with a 100 ohm series-termination resistor on DATA0. Estimated: with 76 user I/Os at 50% LVDS usage, total route-out requires a 4-layer stackup with continuous GND plane under the BGA fan-out area.

At 6G speed grade, the 18x18 multipliers sustain 225 MHz and M9K RAM sustains 315 MHz. Long combinational paths (>20 LEs) should be registered; avoid using LE outputs directly to drive global clock nets - route via dedicated clock networks (GCLK) or use PLL outputs. For SDR/DDR memories, place read/write data traces with matched length (delta <50 mil) and use source-synchronous DQS centering via the per-bank PLL. Skipping the per-bank DQS calibration is a common pitfall that causes intermittent DDR failures.

Common pitfalls: (1) Forget the exposed-pad solder connection - causes thermal runaway at >0.5 W; (2) Configure VCCIO at 1.2 V but drive 3.3 V logic, damaging I/O cells - respect VCCIO < absolute max VCCIO+0.5 V; (3) Do not leave MSEL[2..0] floating - tie to VCCINT or GND to select Active Serial vs JTAG-only configuration; (4) Forgetting to instantiate the RESET block leaves PLL outputs glitching after reconfiguration - always include ALTPLL#reset ports; (5) Without Quartus Pin Planner assignments the Fitter may swap pin functions in revisions, silently breaking PCB nets - pin-locks must be saved with the project.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

무연

Yes

무할로겐

Yes

분쟁 광물

Compliant

Lead-free 144-LQFP-EP package, RoHS and REACH compliant per Intel/Altera product page. No AEC-Q100 qualification on the standard 6G OPN; the A7G suffix denotes automotive-style extended temperature. Halogen-free per JEDEC JS709.

데이터 검증일: 2026-09-05 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

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