10CL025YE144C6G - Cyclone 10 LP FPGA, 25K LE, 144-EQFP | Intel
Référence : 10CL025YE144C6G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.97 | $32,97 |
| 10 | $30.52 | $305,20 |
| 100 | $26.42 | $2 642,00 |
| 500 | $23.71 | $11 855,00 |
| 1 000 | $21.89 | $21 890,00 |
10CL025YE144C6G Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), embedded memory, multipliers, and programmable I/O cells. Designers configure the device after manufacture using a hardware description language and a vendor toolchain, then program the resulting bitstream into on-chip SRAM. Compared to fixed-function ASICs, FPGAs offer rapid prototyping and in-system reconfigurability; compared to microcontrollers, FPGAs deliver deterministic parallel processing and far higher throughput for parallel data paths such as video pipelines, motor control, and digital signal processing.
Key features of the 10CL025YE144C6G include 24,624 logic elements (LEs) - the smallest unit of user logic combining a 4-input LUT and a register, 608,256 bits of embedded block RAM (e.g. M9K blocks), 156 hardware 18x18 multipliers for fixed- or floating-point DSP, 4 PLLs for clock synthesis, and 76 user I/O pins. The Cyclone 10 LP family emphasizes static power reduction versus earlier Cyclone generations, making the device attractive for power-constrained industrial and consumer products. The 6G speed grade is the fastest commercial speed bin.
The 10CL025YE144C6G uses a TSMC 60 nm low-power process and shares its die with other 10CL025 OPNs (the package code and speed/temperature suffix differentiate variants). The exposed thermal pad on the EQFP-144 package provides a low-thermal-resistance path to PCB copper for heat dissipation; for designs pushing high toggle rates the board copper must be sized accordingly.
Typical applications include industrial machine vision, motor control and drive front-ends, low-power video bridging, factory automation I/O expansion, and portable test/measurement instruments. Its combination of low static power, a moderate 25K LE density, and a large legacy-friendly EQFP package makes it well-suited to industrial drop-in upgrades of older Cyclone IV/MAX II designs.
When designing with this device, observe the Quartus Prime 18.0+ toolchain, respect the 1.0V core rail decoupling guidelines, and ensure the exposed pad is soldered to a sufficient copper pour. For pin- and footprint-compatible upgrades within the Cyclone 10 LP family, consider the higher-density 10CL040 or 10CL055 E144 variants, or migrate to the smaller 10CL010/10CL016 E144 OPNs for cost-down designs.
Alternatives de remplacement direct pour 10CL025YE144C6G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10CL025YE144C6G (même facteur de forme et même empreinte) — différant par Package, Embedded Memory, Process Technology, Family, Logic Elements (LE).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10CL025YE144I7G
✅ Remplacement direct✓ En stock
$35.8 / unité
Voir la fiche technique →10CL025YE144C8G
✅ Remplacement direct✓ En stock
$36.85 / unité
Voir la fiche technique →10CL025YE144A7G
✅ Remplacement direct✓ En stock
$6.3 / unité
Voir la fiche technique →10CL016YE144C6G
✅ Remplacement direct✓ En stock
$23.9 / unité
Voir la fiche technique →10CL010YE144C6G
✅ Remplacement direct✓ En stock
$2.6 / unité
Voir la fiche technique →10CL006YE144C6G
✅ Remplacement direct✓ En stock
$8.15 / unité
Voir la fiche technique →10CL025YE144C6G Valeurs maximales et caractéristiques électriques
| Series | Cyclone 10 LP |
| Family | Cyclone 10 LP Field Programmable Gate Array |
| Logic Elements (LEs) | 24,624 |
| Embedded Memory (bits) | 608,256 |
| Memory Blocks | M9K blocks, 76 total |
| 18x18 Hardware Multipliers | 156 |
| User I/O Count | 76 |
| Logic Array Blocks (LABs) | 1,539 |
| PLLs | 4 |
| Global Clocks | 20 |
| Core Voltage | 1.0 V (typical) |
| Process Node | 60 nm low-power CMOS |
| Speed Grade | 6 (fastest commercial) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Boîtier | 144-LQFP Exposed Pad (EQFP-144), 22x22 mm |
| Type de montage | Surface Mount |
| Lead-Free / RoHS | Compliant |
| Configuration Scheme | SRAM-based, via JTAG / Active Serial / Active Parallel |
Configuration des broches de 10CL025YE144C6G
| Broche 1 | I/O — General-purpose user I/O bank 1 |
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| Broche 11 | VCCIO1 — I/O bank 1 supply voltage |
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| Broche 21 | VCCINT — Core supply voltage (1.0 V typical) |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — General-purpose user I/O bank 2 |
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| Broche 33 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 34 | I/O — General-purpose user I/O bank 2 |
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| Broche 42 | GND — Ground |
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| Broche 53 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 54 | I/O — General-purpose user I/O bank 3 |
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| Broche 60 | I/O — General-purpose user I/O bank 3 |
| Broche 61 | I/O — General-purpose user I/O bank 3 |
| Broche 62 | VCCINT — Core supply voltage (1.0 V typical) |
| Broche 63 | GND — Ground |
| Broche 64 | I/O — General-purpose user I/O bank 4 |
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| Broche 74 | VCCIO4 — I/O bank 4 supply voltage |
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| Broche 83 | GND — Ground |
| Broche 84 | I/O — General-purpose user I/O bank 5 |
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| Broche 94 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 95 | I/O — General-purpose user I/O bank 5 |
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| Broche 101 | I/O — General-purpose user I/O bank 5 |
| Broche 102 | I/O — General-purpose user I/O bank 5 |
| Broche 103 | VCCINT — Core supply voltage (1.0 V typical) |
| Broche 104 | GND — Ground |
| Broche 105 | I/O — General-purpose user I/O bank 6 |
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| Broche 115 | VCCIO6 — I/O bank 6 supply voltage |
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| Broche 122 | I/O — General-purpose user I/O bank 6 |
| Broche 123 | I/O — General-purpose user I/O bank 6 |
| Broche 124 | GND — Ground |
| Broche 125 | I/O — General-purpose user I/O bank 7 |
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| Broche 133 | I/O — General-purpose user I/O bank 7 |
| Broche 134 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 135 | I/O — General-purpose user I/O bank 7 |
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| Broche 142 | I/O — General-purpose user I/O bank 7 |
| Broche 143 | GND — Ground |
| Broche 144 | I/O — General-purpose user I/O bank 8 |
Applications typiques
10CL025YE144C6G convient pour 6 applications: Industrial Machine Vision Front-End, Motor Control and Drive Front-End, Low-Power Video Bridging and Format Conversion, Factory Automation I/O Expansion and Protocol Conversion, Portable Test and Measurement Instrumentation, Legacy Cyclone IV / MAX II Footprint Migration.
Industrial Machine Vision Front-End
The 10CL025YE144C6G is well-suited to low-resolution machine-vision front-ends because its 24,624 LEs, 156 18x18 multipliers, and 608 Kbit embedded RAM are sized for typical line-buffer, Bayer demosaic, and thresholding pipelines. At 6G speed grade the multipliers run at ~225 MHz, which comfortably handles Camera-Link or MIPI-CSI2 sensor tap demosaic at 60-110 fps. The 76 user I/Os expose ample LVDS pairs for direct sensor connection. Cyclone 10 LP's lower static power vs Cyclone IV keeps vision-card thermal envelopes under 1 W for fanless embedded inspection chassis.
Recommandé
Motor Control and Drive Front-End
The 10CL025YE144C6G serves as a digital front-end for BLDC, PMSM, and stepper motor control. Its 156 hardware 18x18 multipliers handle Park/Clarke transforms and PI loops without taxing the LE fabric; the 608 Kbit block RAM stores reference tables and field-orientation sin/cos lookup values; 4 PLLs derive the PWM-aligned switching clocks from a single crystal. The 144-LQFP package exposes enough LVDS-capable I/O for encoder, Hall-sensor, and resolver inputs. Compared to a software-DSP MCU implementation, the FPGA delivers deterministic PWM edge latency and concurrent commutation loops.
Recommandé
Low-Power Video Bridging and Format Conversion
The 10CL025YE144C6G bridges video formats (e.g. BT.656, BT.1120, parallel RGB, MIPI-CSI2 to LVDS) and performs scaling, color-space conversion, and frame-rate adaptation. The 608 Kbit M9K RAM acts as a line buffer, and the 76 user I/Os aggregate enough LVDS lanes for 1080p60 input with sufficient margin. At 6G speed grade the fabric comfortably meets 148.5 MHz pixel clock timing for HD-SDI/HDMI 720p/1080i bridging. Cyclone 10 LP's low static power keeps the bridge under 0.8 W typical, suitable for fanless panel and KVM use.
Recommandé
Factory Automation I/O Expansion and Protocol Conversion
The 10CL025YE144C6G consolidates multiple industrial protocols (EtherCAT, PROFINET, Modbus RTU/TCP, CANopen, RS-485) on a single low-power device. The 24K LEs easily absorb the soft-IP cores plus glue logic, and the 4 PLLs derive multiple independent communication clocks from one crystal. The 144-LQFP-EP package's 76 user I/Os allow 4-8 physical RS-485 transceivers, isolated CAN interfaces, and digital I/O without an additional bridge chip. The commercial temperature grade 0-85C is adequate for cabinet-mounted PLCs and remote I/O racks.
Recommandé
Portable Test and Measurement Instrumentation
The 10CL025YE144C6G powers portable oscilloscopes, logic analyzers, and protocol analyzers. Its logic density is sufficient for trigger logic, decoders (I2C/SPI/UART/CAN/LIN), and on-chip waveform memory addressing; the 156 multipliers accelerate FFT/DFT pre-processing for spectrum-analyzer views. Cyclone 10 LP's lower static power vs Cyclone IV extends battery run-time in handheld scopes by 20-30%. The 144-LQFP-EP exposed pad enables a compact 4-layer PCB implementation with adequate heat removal at the 0.8 W typical operating point.
Recommandé
Legacy Cyclone IV / MAX II Footprint Migration
The 10CL025YE144C6G shares its 144-LQFP-EP footprint with Cyclone IV EP4CE25 and MAX II/MAX V 240-570-LE devices, making it a clean in-place migration target when designs outgrow legacy Cyclone IV power budgets or when MAX V LE density is no longer sufficient. Quartus Prime 18.0+ ingests legacy Cyclone IV project files with limited re-work; the 6G speed grade provides tighter Fmax than the Cyclone IV C8 bin. This enables product refreshes without PCB re-spin, qualification re-test, or connector re-tooling.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10CL025YE144C6G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10CL025YE144I7G | 10CL025YE144C8G | 10CL025YE144A7G | 10CL016YE144C6G | 10CL010YE144C6G | 10CL006YE144C6G |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 24,624 | 24,624 | 24,624 | 24,624 | 15,408 (-37%) | 10,320 (-58%) | 6,273 (-75%) |
| Embedded Memory (bits) | 608,256 | 608,256 | 608,256 | 608,256 | 504,576 (-17%) | 414,720 (-32%) | 270,336 (-56%) |
| 18x18 Multipliers | 156 | 156 | 156 | 156 | 112 (-28%) | 72 (-54%) | 30 (-81%) |
| User I/O | 76 | 76 | 76 | 76 | 76 (same) | 76 (same) | 76 (same) |
| Speed Grade | 6G (fastest commercial) | 7G (industrial) | 8G (slower commercial) | 7G (automotive-style extended) | 6G | 6G | 6G |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | Extended automotive-style | 0C to +85C | 0C to +85C | 0C to +85C |
Principaux différenciateurs
- 6G speed grade is the fastest commercial Cyclone 10 LP bin in 144-EQFP (vs 10CL025YE144C8G)
- 60 nm Cyclone 10 LP process reduces static power vs Cyclone IV (vs EP4CE25F23 (Cyclone IV E, 144-FBGA not EQFP))
- Same-die across 25K LE OPNs enables single-board product family (vs 10CL040YE144C6G)
Notes de conception
The 10CL025YE144C6G requires three independent power rails: VCCINT (1.0 V core), VCCIOx (1.2/1.5/1.8/2.5/3.3 V per bank), and VCCA (2.5 V PLL analog). Estimated: total steady-state power for a 25K LE design at 50 MHz toggle and 50% utilization is approximately 0.4-0.8 W, dominated by static Icc. Decouple each VCCINT pin with a 0.1 uF X7R ceramic plus a 10 uF bulk cap within 5 mm; VCCA needs a ferrite bead + 10 uF/0.1 uF pair. Power sequencing must enable VCCINT before VCCIO and VCCA, otherwise the POR (power-on-reset) circuit can latch the device in an undefined state.
The 144-LQFP exposed pad is the primary heat-removal path; the package datasheet specifies theta_JB of approximately 18 C/W and theta_JC-top of approximately 18 C/W. With 0.8 W typical dissipation and a copper pour of 1 square inch on a 4-layer board, junction-to-ambient theta_JA is approximately 30 C/W, giving 24 C rise at room temperature. Exposed pad must be soldered to the copper pour with a 9- or 16-thermal-via array (0.3 mm drill, 0.5 mm pitch). Inadequate thermal via design is the most common cause of 10CL025 field failures.
Cyclone 10 LP supports single-ended I/O at 1.2-3.3 V per bank and LVDS up to 840 Mbps in True-LVDS mode. Place a 100 nF decoupling cap within 2 mm of every VCCIO/VCCINT/VCCA pin, and a 10 uF bulk cap per rail. JTAG chain routing should keep TCK short and shielded by a GND guard trace. Configuration flash (EPCS or compatible) must be placed within 25 mm of the nCONFIG/nSTATUS/ASDO/DATA0 pins, with a 100 ohm series-termination resistor on DATA0. Estimated: with 76 user I/Os at 50% LVDS usage, total route-out requires a 4-layer stackup with continuous GND plane under the BGA fan-out area.
At 6G speed grade, the 18x18 multipliers sustain 225 MHz and M9K RAM sustains 315 MHz. Long combinational paths (>20 LEs) should be registered; avoid using LE outputs directly to drive global clock nets - route via dedicated clock networks (GCLK) or use PLL outputs. For SDR/DDR memories, place read/write data traces with matched length (delta <50 mil) and use source-synchronous DQS centering via the per-bank PLL. Skipping the per-bank DQS calibration is a common pitfall that causes intermittent DDR failures.
Common pitfalls: (1) Forget the exposed-pad solder connection - causes thermal runaway at >0.5 W; (2) Configure VCCIO at 1.2 V but drive 3.3 V logic, damaging I/O cells - respect VCCIO < absolute max VCCIO+0.5 V; (3) Do not leave MSEL[2..0] floating - tie to VCCINT or GND to select Active Serial vs JTAG-only configuration; (4) Forgetting to instantiate the RESET block leaves PLL outputs glitching after reconfiguration - always include ALTPLL#reset ports; (5) Without Quartus Pin Planner assignments the Fitter may swap pin functions in revisions, silently breaking PCB nets - pin-locks must be saved with the project.
Informations de conformité
Lead-free 144-LQFP-EP package, RoHS and REACH compliant per Intel/Altera product page. No AEC-Q100 qualification on the standard 6G OPN; the A7G suffix denotes automotive-style extended temperature. Halogen-free per JEDEC JS709.
