10M08SAM153C8G - MAX 10 FPGA, 8K LE, 153-MBGA | Intel / Altera
부품 번호: 10M08SAM153C8G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.2 | $132.00 |
| 100 | $11.8 | $1,180.00 |
| 500 | $10.4 | $5,200.00 |
| 1,000 | $9.1 | $9,100.00 |
10M08SAM153C8G 개요
A field-programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected by programmable interconnect, allowing designers to implement arbitrary digital logic, glue logic, and parallel processing functions after PCB fabrication. Within the broader taxonomy of programmable logic, FPGAs sit alongside CPLDs and SPLDs as non-processor programmable devices; the MAX 10 family in particular targets low-power, instant-on applications by embedding dual-configuration flash on-die, eliminating the need for external boot memory.
The 10M08SAM153C8G delivers up to 8,000 logic elements, 387,072 bits (approximately 378 Kbit user flash), 112 Kbits of block RAM (M9K blocks), and 4 embedded 18x18 multipliers. It integrates an analog-to-digital converter (ADC) block, supports up to 250 user I/O pins (package dependent) and offers 1.2 V core operation with 3.0/3.3 V LVCMOS/LVTTL I/O capability. The 153-ball MBGA package maximizes logic density in a compact surface-mount footprint suitable for space-constrained industrial designs.
Architecturally, MAX 10 devices use non-volatile configuration memory that enables instant-on operation in under 10 ms from a single 1.2 V supply, eliminating boot PROM or external flash. The built-in ADC supports 12-bit SAR conversion at up to 1 MSPS across analog input pins, providing mixed-signal integration that simplifies sensor monitoring and power-supply telemetry. Internal flash can also be partitioned for user data storage, replacing external EEPROMs in many designs.
Typical applications include industrial control and factory automation (motor control glue logic, sensor fusion pre-processing), IoT edge nodes (sensor aggregation and protocol bridging), test and measurement front-ends, consumer electronics with display timing controllers, and portable/battery-powered devices that benefit from instant-on behavior. The on-chip ADC also makes MAX 10 suitable for predictive-maintenance sensor hubs.
When designing with this part, account for power-supply sequencing: MAX 10 devices require a stable 1.2 V core rail and a separate VCCIO bank supply. Use the Intel Quartus Prime toolchain for synthesis, place-and-route, and configuration bitstream generation. The C8G speed grade (commercial, 8 ns internal timing) represents the slowest of the MAX 10 commercial grades; choose faster speed grades only if critical paths demand the additional timing margin.
This page synthesizes distributor pricing, real-time stock, and parametric drop-in alternatives for the 10M08SAM153C8G, plus design notes that go beyond what is in the Intel MAX 10 datasheet alone.
드롭인 대체품: 10M08SAM153C8G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M08SAM153C8G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Mounting Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M08SAM153I7G
✅ 드롭인✓ 재고 있음
$7.4 / 개
데이터시트 보기 →10M08SCM153C8G
✅ 드롭인✓ 재고 있음
$5.45 / 개
데이터시트 보기 →10M08SAM153C7G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M04SAM153C8G
✅ 드롭인✓ 재고 있음
$4.85 / 개
데이터시트 보기 →10M16SAM153C8G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M08SAM153C8G 최대 정격 & 전기적 특성
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 8,000 |
| Embedded User Flash | 387,072 bits (378 Kbit) |
| Block RAM (M9K) | 112 Kbit |
| Embedded Multipliers (18x18) | 4 |
| Maximum User I/O (package-dependent) | 250 |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| On-chip ADC | 12-bit SAR, up to 1 MSPS |
| Configuration Method | Internal flash (instant-on) |
| 패키지 | 153-ball MBGA |
| Speed Grade | C8 (commercial, slowest) |
| 동작 온도 | 0C to +85C (commercial) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
10M08SAM153C8G 153-ball mbga 핀 구성 가이드
10M08SAM153C8G(153-ball mbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M08SAM153C8G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M08SAM153C8G 적합 용도: 6 애플리케이션s: Industrial Motor Control and Factory Automation, IoT Edge Sensor Aggregation Hubs, Test and Measurement Front-End, Display Timing and Bridge Controllers, Portable and Battery-Powered Devices, Communications Protocol Bridging.
Industrial Motor Control and Factory Automation
The 10M08SAM153C8G's 8,000 logic elements and 4 embedded 18x18 multipliers make it well-suited for industrial motor-control glue logic in factory automation. The MAX 10's instant-on configuration from internal flash (<10 ms) is critical for safety-rated machinery that must enter a deterministic safe state on power-up. The integrated 12-bit ADC samples motor current and back-EMF directly, eliminating external analog ICs. Combined with up to 250 user I/O pins, the 153-MBGA package can drive multi-axis stepper and BLDC controllers while logging diagnostic data into the 387 Kbit user flash.
추천
IoT Edge Sensor Aggregation Hubs
The 10M08SAM153C8G serves as a sensor-aggregation hub for IoT edge nodes by combining I2C/SPI/UART bridging, local decision logic, and data buffering in 112 Kbit block RAM before forwarding to a host MCU or wireless module. The non-volatile MAX 10 architecture eliminates external boot flash, reducing BOM cost and PCB area. The on-chip 12-bit ADC reads temperature, humidity, and battery voltage alongside digital sensors. Power dissipation is low enough for battery-powered sensor nodes, and instant-on wake-up is faster than SRAM-based FPGAs.
추천
Test and Measurement Front-End
In test and measurement equipment, the 10M08SAM153C8G provides programmable digital signal conditioning, custom protocol decoding, and timing generation between an analog front-end and a host processor. The 8,000 logic elements and 4 hardware multipliers enable FIR filtering and CRC computation in real time. The internal flash stores multiple personalities for different DUT protocols, allowing field reconfiguration via JTAG. Up to 250 user I/O pins accommodate parallel LVDS interfaces in the 153-MBGA package.
추천
Display Timing and Bridge Controllers
The 10M08SAM153C8G implements custom display timing controllers, video format converters, and bridging between MIPI, LVDS, RGB, and HDMI-style interfaces. Its 4 embedded 18x18 multipliers handle scaling math, and 112 Kbit block RAM stores line buffers for color-space conversion. The 153-MBGA package exposes enough LVDS pairs to drive dual-channel displays. Designers can update the configuration flash via JTAG to add new display modes without a board spin.
추천
Portable and Battery-Powered Devices
The MAX 10's low static power and instant-on behavior make the 10M08SAM153C8G well-suited for portable, battery-powered devices such as handheld instruments, wearables charging cradles, and ruggedized data loggers. Internal flash eliminates external boot memory, saving standby current. The on-chip ADC monitors battery voltage and pack temperature without an external fuel gauge IC. The 153-MBGA package delivers this functionality in a footprint suitable for compact handhelds.
추천
Communications Protocol Bridging
The 10M08SAM153C8G bridges between industrial communication protocols such as RS-485, CAN, Modbus, and EtherCAT by implementing protocol conversion in programmable logic. The 8,000 LEs provide headroom for protocol stacks plus custom extensions, while 4 hardware accelerators handle CRC and Manchester encoding. With up to 250 user I/O pins, multiple buses can be terminated and monitored simultaneously in the 153-MBGA package. Field updates via JTAG allow adding protocol revisions without hardware changes.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M08SAM153C8G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M08SAM153I7G | 10M08SCM153C8G | 10M08SAM153C7G | 10M04SAM153C8G | 10M16SAM153C8G |
|---|---|---|---|---|---|---|
| Package | 153-MBGA | 153-MBGA - same | 153-MBGA - same | 153-MBGA - same | 153-MBGA - same | 153-MBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | MAX 10 | MAX 10 | MAX 10 | MAX 10 | MAX 10 | MAX 10 |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 | 16,000 |
| Block RAM (M9K) | 112 Kbit | 112 Kbit | 112 Kbit | 112 Kbit | 75 Kbit | 236 Kbit |
| Embedded User Flash | 387,072 bits | 387,072 bits | 387,072 bits | 387,072 bits | 235,929 bits | 549,888 bits |
| Embedded Multipliers (18x18) | 4 | 4 | 4 | 4 | 2 | 8 |
| Speed Grade | C8 (slowest commercial) | I7 (industrial, slowest) | C8 | C7 (~12% faster) | C8 | C8 |
| On-chip ADC | 12-bit SAR, up to 1 MSPS | 12-bit SAR, up to 1 MSPS | 12-bit SAR, up to 1 MSPS | 12-bit SAR, up to 1 MSPS | 12-bit SAR, up to 1 MSPS | 12-bit SAR, up to 1 MSPS |
주요 차별점
- Internal dual-configuration flash eliminates external boot memory (vs 10CL080YU484C8G (Cyclone 10 LP))
- Integrated 12-bit ADC at no extra cost (vs 10M16SAM153C8G (10M16 MAX 10, same family))
- Compact 153-MBGA package maximizes logic density per board area (vs 10M08SAE144C8G (EQFP-144 variant))
- Commercial temperature grade optimized for cost-sensitive applications (vs 10M08SAM153I7G (industrial temp grade))
설계 노트
The MAX 10 requires multiple supplies: a 1.2 V VCC core rail (derived from the integrated LDO or external regulator), a 2.5 V VCCA analog rail for the ADC, and per-bank VCCIO rails for I/O (1.2 V to 3.3 V). Decouple each rail with 0.1 uF X7R ceramic capacitors placed within 5 mm of each supply pin; add a bulk 10 uF capacitor near the package. Power-on sequence is flexible, but VCC must reach 1.0 V within 100 ms to guarantee proper configuration. Estimated: at 25C ambient and 50% toggle activity, the 10M08 dissipates approximately 0.3 W to 0.6 W; derate to 70% for industrial layouts.
The 153-MBGA is a fine-pitch BGA package that requires microvia or via-in-pad PCB technology for reliable assembly. Use 0.4 mm pitch BGA land patterns with NSMD (non-solder-mask-defined) pads to improve self-alignment during reflow. Place decoupling capacitors on the opposite PCB side directly under the supply balls to minimize loop inductance. Maintain a 4-layer stackup with continuous VCC and GND planes under the FPGA to provide a low-impedance return path and reduce EMI. According to Intel MAX 10 hardware design guidelines, signal trace impedance should be 50 ohm single-ended and 100 ohm differential.
Common MAX 10 design mistakes include (1) leaving JTAG TCK floating, which causes random configuration failures - always pull TCK high through a 10 kohm resistor; (2) using the user flash as a generic EEPROM without enabling ECC, which risks undetected bit errors - enable the hardware ECC feature for any data-critical storage; (3) assuming all MAX 10 speed grades are timing-identical - the C8 grade is the slowest and may not meet timing at 100 MHz or above; choose C7 or C6 for higher-speed designs; (4) failing to program the security fuses during production, allowing bitstream readback; (5) connecting ADC analog inputs to signals above VCCA without external clamping, which can permanently damage the analog front-end.
For LVDS pairs on the MAX 10, maintain 100 ohm differential impedance and match lengths within 150 mil (3.8 mm). Use 2 mil-to-4 mil spacing between pairs to minimize crosstalk. Keep high-speed SERDES or LVDS traces on the top PCB layer directly over a continuous GND plane, avoiding splits or voids. According to Intel MAX 10 device handbook section on I/O timing, set input pin delay chains via the Quartus fitter to compensate for PCB trace skew. When using the ADC, route analog inputs away from switching signals and add a ferrite bead on the VCCA supply to prevent digital switching noise from coupling into the SAR converter.
규정 준수 정보
RoHS compliant per the 'G' suffix in the MPN (Intel convention: G = lead-free RoHS). Halogen-free per JEDEC JS709B. Conflict-mineral reporting per Intel annual CMRT filings. AEC-Q100 not applicable - the part is not automotive-qualified; the 10M08 family does not currently include an AEC-Q100 variant.
