10M08DAF484C8G - MAX 10 FPGA, 8K LEs, 484-FBGA | Intel
부품 번호: 10M08DAF484C8G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $39.1 | $391.00 |
| 100 | $33.85 | $3,385.00 |
| 250 | $30.2 | $7,550.00 |
| 500 | $27.65 | $13,825.00 |
10M08DAF484C8G 개요
What is a non-volatile FPGA? A non-volatile FPGA is a programmable logic device that retains its configuration bitstream in on-die flash memory, eliminating the need for an external boot PROM and enabling instant-on operation at power-up. Within the broader taxonomy it belongs to programmable logic -> FPGAs -> non-volatile FPGAs -> CPLDs/PLD hybrids. MAX 10 devices sit at the intersection of FPGAs and microcontrollers, integrating hard IP such as ADC, PLLs, and flash that historically required separate companion chips, thereby reducing BOM cost and PCB area.
Key features include 8,000 logic elements, 387 Kbits embedded SRAM, 1,540 Kbits user flash, 250 maximum user I/Os, two PLLs, 8-channel 12-bit ADC with up to 1 MSPS sample rate, and DSP blocks. The integrated dual-configuration flash supports remote field upgrades and RSU (remote system update) for in-system reconfiguration. I/O banks support LVDS, LVTTL, LVCMOS, SSTL, and other industry-standard single-ended and differential interfaces, simplifying memory and sensor bridging.
The MAX 10 architecture pairs a logic fabric of 8K adaptive logic modules (ALMs) with embedded memory blocks (M9K), DSP blocks, and hard IP blocks. The 55 nm process yields an excellent cost-per-logic-element ratio suitable for mid-volume glue-logic, motor control, and industrial I/O expansion. The internal flash subsystem also supports Nios II soft-core configuration and user data storage, allowing on-chip firmware persistence without an external EEPROM.
Typical applications include industrial motor control, factory automation I/O expansion, video processing bridges, telecom line cards, low-cost ASIC replacement, and portable test instruments. The combination of on-chip ADC and flash makes MAX 10 a frequent choice for sensor aggregation nodes, predictive-maintenance modules, and battery-powered edge devices where board area, BOM, and power are constrained.
When designing with this device, reserve sufficient PCB area for the 484-ball FineLine BGA and follow Intel's PCB layout guide for BGA breakout routing, including via-in-pad and microvia stackup recommendations. Use Quartus Prime software for synthesis, place-and-route, and programming; the device is supported by both the Quartus Prime Lite (free) and Pro editions. Decouple each VCC/VCCIO/GXB power pin with 0.1 uF and 10 uF capacitors placed as close as possible.
This page synthesizes current distributor pricing, drop-in MAX 10 same-package alternatives, and practical design notes not aggregated on the Intel datasheet or on a single distributor page.
드롭인 대체품: 10M08DAF484C8G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M08DAF484C8G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, PLLs, Speed Grade, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M08DAF484C8GES
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M08DAF484C7G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M16DAF484C8G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M08SAF484C8G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LCMXO2-4000HC-4FTG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M08DAF484C8G 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements (LE) | 8000 |
| Embedded Memory | 387,072 bits (378 Kbits) |
| User Flash | 1,540 Kbits |
| Maximum User I/O | 250 |
| ADC | 8-channel, 12-bit |
| PLLs | 2 |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| I/O Bank Voltage | 1.2 V to 3.3 V |
| 패키지 | 484-ball FBGA (FineLine BGA) |
| Speed Grade | -C8 |
| 동작 접합 온도 | -40 C to +100 C (industrial) |
| Configuration | Internal flash, dual-configuration, RSU support |
| DSP Blocks | Yes |
| RoHS 상태 | Compliant |
10M08DAF484C8G 484-ball fbga (fineline bga) 핀 구성 가이드
10M08DAF484C8G(484-ball fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M08DAF484C8G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M08DAF484C8G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Factory Automation I/O Expansion, Video Processing Bridge, Telecom Line Card Glue Logic, Low-Cost ASIC Replacement, Portable Test & Measurement.
Industrial Motor Control
The 10M08DAF484C8G's integrated 8-channel 12-bit ADC, dual PLLs, and 250 user I/Os make it well-suited for multi-axis industrial motor control and BLDC/PMSM drive boards. The ADC samples back-EMF, phase current, and temperature sensors at up to 1 MSPS aggregate, replacing an external ADC and shrinking BOM. The 8K logic elements implement field-oriented control (FOC) state machines and PWM generation, while the 387 Kbits of embedded SRAM buffer control loops. Designers mount the device on FR-4 with a 4-layer stackup, route the 484-ball FineLine BGA with via-in-pad microvias, and use the internal flash for instant-on configuration without an external PROM.
추천
Factory Automation I/O Expansion
In factory automation the 10M08DAF484C8G aggregates up to 250 user I/Os across LVTTL, LVCMOS, RS-485, and LVDS interfaces, eliminating discrete logic and CPLDs. The integrated ADC monitors analog sensors (pressure, temperature, vibration) directly, while the 1,540 Kbits of user flash stores calibration tables and Modbus configuration. According to Intel's MAX 10 industrial reference designs, the device's 55 nm process and -40 C to +100 C junction rating suit conveyor, PLC, and machine-vision backplanes. Quartus Prime supports industrial IP libraries (EtherCAT, PROFINET soft IP) and the internal dual-configuration flash enables fail-safe remote firmware updates.
추천
Video Processing Bridge
The 10M08DAF484C8G bridges parallel CMOS camera interfaces, MIPI virtual channels, and HDMI/DVI auxiliary channels with up to 250 I/Os and LVDS support. Its 8K logic elements and embedded DSP blocks implement color-space conversion, frame buffers, and timing generators without external memory. The 387 Kbits of SRAM buffer scan-line data for deinterlacing and scaling, while the 1,540 Kbits of user flash stores EDID tables and look-up tables. Designers use the PLL pair to generate pixel clocks for DSI/CSI-2 and the on-chip ADC to monitor backlight current.
추천
Telecom Line Card Glue Logic
Telecom line cards use the 10M08DAF484C8G as glue logic between framers, SERDES, and backplane transceivers, taking advantage of 250 user I/Os and the 1.2 V low-power core. The device's I/O banks support 1.2 V to 3.3 V standards, simplifying interfacing with legacy 3.3 V ASICs alongside modern 1.8 V SERDES. The internal dual-configuration flash and remote system update (RSU) IP allow in-field firmware upgrades without service interruption - critical for carrier-grade equipment.
추천
Low-Cost ASIC Replacement
The 10M08DAF484C8G replaces mid-volume custom ASICs with 8K LEs, integrated ADC, and on-die flash, eliminating NRE costs and shortening time-to-market. The 484-FBGA package supports high-pin-count glue logic for IoT gateways, appliances, and consumer devices. Engineers can fit a full custom SoC-style design - including a Nios II soft-core CPU, custom peripherals, and ADC-driven sensor fusion - in a single chip, then re-target the same design to a higher-density MAX 10 (10M16, 10M25, 10M50) if the design grows.
추천
Portable Test & Measurement
The 10M08DAF484C8G powers portable oscilloscopes, logic analyzers, and bench multimeters, integrating 8 ADC channels for simultaneous voltage/current capture and 250 I/Os for display/keypad multiplexing. The non-volatile internal flash enables instant-on, eliminating boot delays in field-service environments. Low dynamic power from the 55 nm process extends battery life in handheld instruments, while the 1,540 Kbits of user flash stores calibration data, custom test routines, and user-defined measurement scripts.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M08DAF484C8G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M08DAF484C8GES | 10M08DAF484C7G | 10M16DAF484C8G | 10M08SAF484C8G | LCMXO2-4000HC-4FTG484I |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Lattice Semiconductor |
| Package | 484-ball FBGA | 484-ball FBGA (same) | 484-ball FBGA (same) | 484-ball FBGA (same) | 484-ball FBGA (same) | 484-ball FTBGA (same) |
| Logic Elements | 8000 | 8000 | 8000 | 16000 | 8000 | 4320 LUTs |
| Embedded SRAM | 387,072 bits | 387,072 bits | 387,072 bits | 549,888 bits | 387,072 bits | 92,160 bits |
| User Flash | 1540 Kbits | 1540 Kbits | 1540 Kbits | 2368 Kbits | 1540 Kbits | 0 (no internal flash) |
| Integrated ADC | 8-ch, 12-bit | 8-ch, 12-bit | 8-ch, 12-bit | 8-ch, 12-bit | 8-ch, 12-bit | None |
| Maximum User I/O | 250 | 250 | 250 | 320 | 250 | 278 |
| Speed Grade | -C8 | -C8 | -C7 | -C8 | -C8 | -4 |
| Process | 55 nm | 55 nm | 55 nm | 55 nm | 55 nm | 65 nm |
주요 차별점
- Integrated 8-channel 12-bit ADC eliminates external ADC (vs LCMXO2-4000HC-4FTG484I)
- Non-volatile configuration in on-die flash (vs Cyclone 10 LP (10CL080YF484C8G))
- Doubled logic capacity available in same footprint (vs 10M16DAF484C8G)
설계 노트
The 484-ball FineLine BGA requires a 4-layer to 6-layer PCB stackup with via-in-pad or microvia technology for reliable breakout routing. Estimated: at a 1.0 mm ball pitch, four signal layers escape roughly 60-80% of balls using dog-bone fanouts; a 0.8 mm pitch version requires laser-drilled microvias. Route 50 ohm controlled-impedance traces for LVDS pairs, length-matched within 150 mil per Intel MAX 10 hardware design guidelines. Always include a continuous GND plane on layer 2 directly under the BGA to minimize return-path discontinuities.
Decouple each VCCINT (1.2 V core), VCCIO (I/O banks), VCCA (2.5 V analog), and VCCPD pin with a 0.1 uF X7R ceramic capacitor placed within 50 mil of the package ball. Add 10 uF bulk capacitors near each power rail entry point. For designs drawing above 500 mA from VCCINT, use at least 4 oz copper pour or a heatsink/thermal via array under the BGA. The integrated ADC requires a clean 2.5 V analog supply - place a ferrite bead between VCCIO and VCCA and use a separate analog ground island to avoid digital switching noise coupling into ADC samples.
Do not exceed the 1.2 V core supply tolerance of +/-5%; undervoltage causes configuration failures, overvoltage risks long-term reliability. The MAX 10's dual-configuration flash supports two images, but engineers must verify image-load timing with the watchdog timer to avoid bricking. Always specify the correct speed grade (-C7 vs -C8) in Quartus Prime; mixing parts with different speed grades on the same design requires fitter re-targeting. The ADC analog inputs are not 5 V tolerant; use external resistor dividers or op-amp buffers for signals above 2.5 V.
Place the JTAG header or USB-Blaster connector within 6 inches of the FPGA to keep JTAG signal integrity within the IEEE 1149.1 specification. Use a 10 kohm pull-up on TCK and TMS per Intel's programming guide. Route configuration-related signals (nCONFIG, nSTATUS, CONF_DONE) away from high-speed switching nets to avoid false triggering during power-up. If using Active Serial configuration, keep the AS_CLK trace below 1 inch for reliable boot at the highest supported clock rate.
Estimated: at 25 C ambient, a typical 10M08DAF484C8G design consuming 0.5 W static and 1.5 W dynamic power dissipates roughly 2 W. With the 484-FBGA package theta_JA of approximately 18 C/W on a 4-layer JEDEC test board, junction temperature rises about 36 C. For industrial applications at 85 C ambient, ensure junction remains below 100 C by including thermal vias under the BGA and adequate copper pour. For full industrial range operation above 85 C ambient, conduct thermal characterization in a real enclosure.
규정 준수 정보
RoHS and lead-free compliant per Intel product declaration page. Not AEC-Q100 qualified - MAX 10 targets commercial and industrial embedded, not automotive. Halogen-free per JEDEC JS709B.