10M25SAE144C8G - MAX 10 FPGA 25K LE 144-LQFP | Intel
부품 번호: 10M25SAE144C8G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $49.17 | $49.17 |
| 10 | $44.25 | $442.50 |
| 100 | $39.8 | $3,980.00 |
| 500 | $35.85 | $17,925.00 |
| 1,000 | $32.4 | $32,400.00 |
10M25SAE144C8G 개요
What is a non-volatile FPGA? A non-volatile FPGA integrates its configuration memory on-chip, so it powers up instantly without an external boot PROM. The MAX 10 family belongs to Intel's low-cost programmable logic portfolio (FPGA -> programmable logic -> logic device -> semiconductor) and targets bridge, I/O expansion, motor control, and industrial sensor applications where instant-on and small footprint are critical.
Key features include 25K logic elements, 54 embedded 18x18 multipliers, 66 PLLs (4 fractional PLLs), 1.638 Mbit user flash, single or dual power supply options, and 1 Msps 12-bit ADC with 17 analog inputs. The 144-LQFP package has a body size of 22 x 22 mm with exposed thermal pad for enhanced power dissipation. The device operates across industrial temperature ranges and supports JTAG programming.
The MAX 10 architecture uses SRAM-based logic fabric backed by on-chip configuration flash, allowing dual boot from two flash images for field upgrades. The fabric includes LABs (Logic Array Blocks), MLABs (Memory LABs), and DSP blocks with hardware multipliers for signal-processing pipelines. Hardened IP blocks (PLL, ADC, flash) reduce die area and power compared to soft implementations.
Typical applications include industrial motor control with hardware PWM, factory sensor aggregation with on-chip ADC, video bridging between parallel RGB and MIPI, automotive rear-view camera preprocessing, and consumer appliance HMI controllers. The exposed thermal pad supports continuous operation up to 100 MHz core frequencies in fanless enclosures.
When designing with this device, use the Quartus Prime design suite and Intel FPGA Power and Thermal Calculator to validate junction temperature. Route all LVDS pairs with length-matched 100 ohm differential traces, and provide at least four PCB vias under the exposed pad to the inner ground plane for thermal relief.
드롭인 대체품: 10M25SAE144C8G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M25SAE144C8G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Memory, Operating Temperature, Logic Elements (LE), Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M25SAE144A7G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M50SAE144C8G
✅ 드롭인✓ 재고 있음
$47.9 / 개
데이터시트 보기 →10M16SAE144C8G
✅ 드롭인✓ 재고 있음
$27.01 / 개
데이터시트 보기 →10M08SAE144C8G
✅ 드롭인✓ 재고 있음
$16.25 / 개
데이터시트 보기 →10M25SAE144I7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$50.75 / 개
데이터시트 보기 →10M25SCE144C8G
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10M25SAE144C8G 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements | 25,000 (25K LE) |
| Maximum User I/Os | 101 |
| Embedded Memory | 1,638 Kbit |
| Embedded 18x18 Multipliers | 54 |
| PLLs | 4 (fractional) |
| User Flash | 1.638 Mbit on-chip |
| ADC | 12-bit, 1 Msps, 17 analog inputs |
| 패키지 | 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch |
| 실장 유형 | Surface Mount |
| Configuration | Non-volatile on-chip flash, dual-boot capable |
| 공급 전압 | Single or dual supply (core and I/O) |
| 동작 온도 | -40C to +85C (industrial) |
| Speed Grade | C8 |
| RoHS 상태 | Compliant |
| Programming Interface | JTAG |
10M25SAE144C8G 144-lqfp exposed pad (eqfp-144), 22 x 22 mm, 0.5 mm pitch 핀 구성 가이드
10M25SAE144C8G(144-lqfp exposed pad (eqfp-144), 22 x 22 mm, 0.5 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M25SAE144C8G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M25SAE144C8G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Bridge and Display Conversion, Factory Sensor Aggregation Hub, Automotive Rear-View Camera Processor, Portable Test and Measurement Instrument, Consumer Appliance HMI Controller.
Industrial Motor Control
The 10M25SAE144C8G fits industrial motor control designs thanks to 54 embedded 18x18 multipliers that accelerate FOC (field-oriented control) math, 4 PLLs for high-resolution PWM generation, and a 12-bit 1 Msps ADC with 17 analog inputs for current/voltage sensing. With 25K logic elements it supports multi-axis BLDC or servo drive controllers without external DSP. The 144-LQFP Exposed Pad dissipates heat from continuous switching operation, while non-volatile flash eliminates boot delay. Engineers pair it with companion gate drivers such as the IR2110 or HIP4086 (linked via Quartus Prime IP catalog) to build a complete variable-frequency drive. The 1.638 Mbit embedded memory buffers encoder feedback and trajectory tables for closed-loop control.
추천
Video Bridge and Display Conversion
The 10M25SAE144C8G is ideal for video bridging between legacy parallel RGB, LVDS, and MIPI interfaces thanks to its 25K logic elements, 54 DSP multipliers, and 101 user I/Os in a 144-LQFP Exposed Pad package. The fabric implements color-space conversion and scaling pipelines, while the on-chip flash stores multiple timing tables for different panels. Compared to a dedicated video processor, this FPGA adds configurability for new connectors without re-spinning the PCB. Industrial-grade operating range and exposed thermal pad enable fanless enclosures in digital signage and KVM switches. The JTAG interface supports field firmware updates as new display panels are added.
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Factory Sensor Aggregation Hub
The 10M25SAE144C8G serves as a factory sensor aggregation hub because its 17-input 12-bit 1 Msps ADC samples multiple analog sensors in parallel while 25K logic elements handle MODBUS, IO-Link, and EtherCAT protocol stacks. The non-volatile flash enables instant-on without boot PROM, critical for factory start-up time. Its 1.638 Mbit embedded memory buffers sensor data bursts before forwarding to the PLC. The 144-LQFP Exposed Pad package supports -40C to +85C industrial operation and provides mechanical compatibility with industrial panel-mount PCBs. The 4 PLLs generate the precise timing required for industrial Ethernet synchronization.
추천
Automotive Rear-View Camera Processor
The 10M25SAE144C8G suits automotive rear-view camera preprocessing because its 25K logic elements implement noise reduction, de-warping, and overlay graphics for parking guidelines. The 12-bit ADC digitizes NTSC/PAL composite video, while the 54 DSP multipliers handle real-time lens distortion correction. Non-volatile flash ensures instant-on within boot-up latency budgets. Industrial temperature range meets cabin electronics requirements, and the 144-LQFP Exposed Pad with proper PCB vias supports automotive thermal stress. The dual-configuration flash allows OTA calibration updates during service. Lower-power C8 speed grade is preferable over A7 for always-on applications.
추천
Portable Test and Measurement Instrument
The 10M25SAE144C8G is ideal for portable test and measurement instruments because of its 12-bit 1 Msps ADC (17 analog inputs), 25K logic elements for protocol decoding (I2C, SPI, UART, CAN), and 144-LQFP Exposed Pad package that fits handheld enclosures. Its 1.638 Mbit embedded memory stores captured waveforms up to 1 Msps, while the non-volatile flash enables field firmware updates. The 4 PLLs generate multiple sample clocks for mixed-signal analysis. Industrial temperature range supports lab and field environments, and the C8 speed grade minimizes power consumption in battery-powered oscilloscopes and logic analyzers.
추천
Consumer Appliance HMI Controller
The 10M25SAE144C8G functions as a consumer appliance HMI controller thanks to its integrated ADC for touch/knob sensing, 25K logic elements for icon rendering, and non-volatile flash for instant-on. The 144-LQFP Exposed Pad supports cost-sensitive white goods manufacturing while delivering the connectivity logic for Wi-Fi/BLE module bridging. The 54 multipliers enable on-the-fly JPEG decoding for graphical UI assets, and the 1.638 Mbit user flash stores multilingual menu trees. Industrial temperature range covers laundry and kitchen appliance environments. The exposed thermal pad supports fanless operation in sealed enclosures.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M25SAE144C8G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M25SAE144A7G | 10M50SAE144C8G | 10M16SAE144C8G | 10M08SAE144C8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same |
| Logic Elements | 25,000 (25K LE) | 25,000 (25K LE) - same | 50,000 (50K LE) - +100% | 16,000 (16K LE) - -36% | 8,000 (8K LE) - -68% |
| Embedded Memory | 1,638 Kbit | 1,638 Kbit - same | 2,736 Kbit - +67% | 1,344 Kbit - -18% | 768 Kbit - -53% |
| Maximum User I/Os | 101 | 101 - same | 101 - same | 101 - same | 101 - same |
| Embedded 18x18 Multipliers | 54 | 54 - same | 144 - +167% | 32 - -41% | 16 - -70% |
| ADC | 12-bit, 1 Msps, 17 inputs | 12-bit, 1 Msps, 17 inputs - same | 12-bit, 1 Msps, 17 inputs - same | 12-bit, 1 Msps, 12 inputs | 12-bit, 1 Msps, 8 inputs |
| Speed Grade | C8 | A7 (faster) | C8 - same | C8 - same | C8 - same |
주요 차별점
- Mid-density sweet spot in MAX 10 family (vs 10M16SAE144C8G)
- Same-package density upgrade path (vs 10M50SAE144C8G)
- Integrated 12-bit ADC eliminates external components (vs 10M25DCF256C8G)
- C8 speed grade balances power and cost (vs 10M25SAE144A7G)
설계 노트
Estimated: at typical MAX 10 E144 conditions (junction ~125C limit, ~1W total power dissipation), the 144-LQFP Exposed Pad's theta_JA is approximately 25-30 C/W with at least four thermal vias under the exposed pad to an inner ground plane. Without vias, junction temperature rise can exceed 50C above ambient in still air. For fanless industrial designs, solder the exposed pad over a contiguous ground copper pour of at least 1 square inch and connect the pad with a 4x4 thermal via array (0.3 mm holes, 1 oz copper plating). Refer to MAX 10 E144 thermal management application note for details.
Route all LVDS pairs with 100 ohm differential impedance and length-matched to within 150 mils for reliable signal integrity at >300 MHz. Place decoupling capacitors (100 nF + 10 uF bulk) within 100 mils of each VCCINT and VCCIO supply pin, and use a star topology from the regulator output. Add a 10k ohm pull-up on the JTAG TCK and TMS lines to prevent spurious configuration. Refer to MAX 10 hardware design guide section 4 for full PCB layout recommendations.
Common design pitfalls: (1) Exceeding the 3.3V VCCIO absolute maximum - level-shifters required for 5V inputs; (2) Forgetting the 4.7k ohm pull-up on nCONFIG pin - causes failed configuration; (3) Using wrong JTAG chain order when programming multi-FPGA boards - check TCK/TMS shared topology; (4) Neglecting to enable the on-chip temperature sensor before reading - default state is disabled; (5) Assuming ADC inputs are 3.3V tolerant - they have a 0-2.5V input range on most variants. Refer to MAX 10 device datasheet pin connection guidelines before tape-out.
The 10M25SAE144C8G supports both single-supply (VCCIO = 3.3V only) and dual-supply (separate VCCINT and VCCIO) configurations. Estimated: typical quiescent current is 30-50 mA for VCCINT at full logic utilization, peaking near 200 mA during configuration flash programming. Plan a 500 mA regulator with at least 1 uF X7R bypass per supply rail. Enable power-saving features (Fast Dynamic Power-down) in Quartus Prime Power Analyzer to cut dynamic power up to 40% in idle conditions.
규정 준수 정보
RoHS compliant and lead-free per Intel/MAX 10 product datasheet and Avaq specification summary. Industrial-grade temperature range only; AEC-Q100 automotive variants not available in this E144 part number.
