10M40SAE144I7G - MAX 10 FPGA, 40K LE, 144-LQFP | Intel / Altera
부품 번호: 10M40SAE144I7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $81.16 | $81.16 |
| 10 | $76.5 | $765.00 |
| 100 | $68.2 | $6,820.00 |
| 500 | $62.4 | $31,200.00 |
| 1,000 | $57.1 | $57,100.00 |
10M40SAE144I7G 개요
A field-programmable gate array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O behavior are defined by user-supplied configuration data, enabling hardware-level parallelism for digital glue logic, control, signal processing, and protocol bridging. Within the broader semiconductor taxonomy, an FPGA sits alongside microcontrollers, ASICs, and CPLDs as a programmable-logic device (PLD), and the MAX 10 family specifically targets low-power, cost-sensitive, non-volatile applications with integrated analog and DSP blocks.
Key features of the 10M40SAE144I7G include an embedded 12-bit analog-to-digital converter (ADC), 168 (18x18) multipliers, 5,140 Kbits of embedded SRAM, and dual-configuration flash supporting remote field updates. The -7 industrial speed grade (I7G suffix) is rated for the -40 C to +100 C industrial junction temperature range with -7 timing performance. The device is supported by the Quartus Prime design software and offers LVDS, LVCMOS, PCI, and SSTL I/O standards for flexible system integration.
The 10M40SAE144I7G architecture combines a logic array block (LAB) fabric with embedded memory blocks (M9K), DSP blocks, and a hardened ADC subsystem. Compared with SRAM-based FPGAs that require external boot memory, the on-die flash reduces board area, BOM count, and boot latency, while the dual-boot image capability enables fail-safe field upgrades. Internal regulators derive core voltages from a single external supply, simplifying power tree design.
Typical applications include industrial motor control, factory automation I/O expansion, video bridge and image preprocessing, portable medical instrumentation, and LED display controllers. The exposed-pad EQFP-144 package provides adequate thermal dissipation for moderate-power designs without an external heatsink, while the generous I/O count supports parallel buses and high-channel-count interfaces.
When designing with the 10M40SAE144I7G, observe the maximum supported configuration clock frequency, ensure the exposed pad is soldered to a sufficient copper pour for thermal relief, and follow Quartus Prime pin connection guidelines for unused and JTAG pins to reach the datasheet-specified I/O timing. Industrial-grade -7 parts typically yield the best balance between timing margin and price.
This page synthesizes distributor pricing, drop-in same-package alternatives from the MAX 10 and Cyclone families, and practical design notes not found in the manufacturer datasheet alone, helping engineers select the right logic density, speed grade, and temperature grade for their application.
드롭인 대체품: 10M40SAE144I7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M40SAE144I7G (동일 폼 팩터 및 풋프린트) — 차이점: Configuration Memory, Package, Operating Temperature, Speed Grade, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M25SAE144I7G
✅ 드롭인✓ 재고 있음
$50.75 / 개
데이터시트 보기 →10M40SAE144C8G
✅ 드롭인✓ 재고 있음
$195.85 / 개
데이터시트 보기 →10M16SCE144I7G
✅ 드롭인✓ 재고 있음
$34.85 / 개
데이터시트 보기 →10M04SCE144I7G
✅ 드롭인✓ 재고 있음
$10.26 / 개
데이터시트 보기 →10M25SAE144C8G
✅ 드롭인✓ 재고 있음
$32.4 / 개
데이터시트 보기 →10M40SAE144I7G 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements | 40,000 |
| User I/Os | 101 |
| Embedded Memory (bits) | 1,290,240 |
| Embedded SRAM (Kbits) | 5,140 |
| Multipliers (18x18) | 168 |
| Process Node | 55 nm |
| Speed Grade | -7 |
| Operating Temperature Grade | Industrial |
| Junction Temperature Range | -40 C to +100 C |
| 패키지 | 144-LQFP Exposed Pad (EQFP-144) |
| Package Dimensions | 22 x 22 mm, 0.50 mm pitch |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Configuration Memory | Internal (non-volatile, dual-image) |
| Embedded ADC | 12-bit, 1 MSPS (per MAX 10 family) |
| Core Voltage | 1.2 V (internal regulation) |
10M40SAE144I7G 핀 구성
| 핀 1 | I/O — General-purpose user I/O bank 1 |
| 핀 2 | I/O — General-purpose user I/O bank 1 |
| 핀 3 | I/O — General-purpose user I/O bank 1 |
| 핀 4 | GND — Ground |
| 핀 5 | I/O — General-purpose user I/O bank 1 |
| 핀 6 | I/O — General-purpose user I/O bank 1 |
| 핀 7 | VCCIO1 — I/O bank 1 supply voltage |
| 핀 8 | I/O — General-purpose user I/O bank 1 |
| 핀 9 | I/O — General-purpose user I/O bank 1 |
| 핀 10 | I/O — General-purpose user I/O bank 1 |
| 핀 11 | GND — Ground |
| 핀 12 | I/O — General-purpose user I/O bank 1 |
| 핀 13 | I/O — General-purpose user I/O bank 1 |
| 핀 14 | I/O — General-purpose user I/O bank 1 |
| 핀 15 | I/O — General-purpose user I/O bank 1 |
| 핀 16 | I/O — General-purpose user I/O bank 1 |
| 핀 17 | GND — Ground |
| 핀 18 | I/O — General-purpose user I/O bank 1 |
| 핀 19 | I/O — General-purpose user I/O bank 1 |
| 핀 20 | I/O — General-purpose user I/O bank 1 |
| 핀 21 | VCCIO1 — I/O bank 1 supply voltage |
| 핀 22 | I/O — General-purpose user I/O bank 1 |
| 핀 23 | I/O — General-purpose user I/O bank 1 |
| 핀 24 | GND — Ground |
| 핀 25 | I/O — General-purpose user I/O bank 1 |
| 핀 26 | I/O — General-purpose user I/O bank 1 |
| 핀 27 | I/O — General-purpose user I/O bank 1 |
| 핀 28 | I/O — General-purpose user I/O bank 1 |
| 핀 29 | GND — Ground |
| 핀 30 | I/O — General-purpose user I/O bank 1 |
| 핀 31 | I/O — General-purpose user I/O bank 1 |
| 핀 32 | I/O — General-purpose user I/O bank 1 |
| 핀 33 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 34 | I/O — General-purpose user I/O bank 2 |
| 핀 35 | I/O — General-purpose user I/O bank 2 |
| 핀 36 | GND — Ground |
| 핀 37 | I/O — General-purpose user I/O bank 2 |
| 핀 38 | I/O — General-purpose user I/O bank 2 |
| 핀 39 | I/O — General-purpose user I/O bank 2 |
| 핀 40 | I/O — General-purpose user I/O bank 2 |
| 핀 41 | I/O — General-purpose user I/O bank 2 |
| 핀 42 | GND — Ground |
| 핀 43 | I/O — General-purpose user I/O bank 2 |
| 핀 44 | I/O — General-purpose user I/O bank 2 |
| 핀 45 | I/O — General-purpose user I/O bank 2 |
| 핀 46 | I/O — General-purpose user I/O bank 2 |
| 핀 47 | I/O — General-purpose user I/O bank 2 |
| 핀 48 | GND — Ground |
| 핀 49 | I/O — General-purpose user I/O bank 2 |
| 핀 50 | I/O — General-purpose user I/O bank 2 |
| 핀 51 | I/O — General-purpose user I/O bank 2 |
| 핀 52 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 53 | I/O — General-purpose user I/O bank 2 |
| 핀 54 | I/O — General-purpose user I/O bank 2 |
| 핀 55 | GND — Ground |
| 핀 56 | I/O — General-purpose user I/O bank 2 |
| 핀 57 | I/O — General-purpose user I/O bank 2 |
| 핀 58 | I/O — General-purpose user I/O bank 2 |
| 핀 59 | I/O — General-purpose user I/O bank 2 |
| 핀 60 | I/O — General-purpose user I/O bank 2 |
| 핀 61 | GND — Ground |
| 핀 62 | I/O — General-purpose user I/O bank 3 |
| 핀 63 | I/O — General-purpose user I/O bank 3 |
| 핀 64 | I/O — General-purpose user I/O bank 3 |
| 핀 65 | I/O — General-purpose user I/O bank 3 |
| 핀 66 | VCCIO3 — I/O bank 3 supply voltage |
| 핀 67 | I/O — General-purpose user I/O bank 3 |
| 핀 68 | I/O — General-purpose user I/O bank 3 |
| 핀 69 | GND — Ground |
| 핀 70 | I/O — General-purpose user I/O bank 3 |
| 핀 71 | I/O — General-purpose user I/O bank 3 |
| 핀 72 | I/O — General-purpose user I/O bank 3 |
| 핀 73 | I/O — General-purpose user I/O bank 3 |
| 핀 74 | I/O — General-purpose user I/O bank 3 |
| 핀 75 | GND — Ground |
| 핀 76 | I/O — General-purpose user I/O bank 3 |
| 핀 77 | I/O — General-purpose user I/O bank 3 |
| 핀 78 | I/O — General-purpose user I/O bank 3 |
| 핀 79 | VCCIO3 — I/O bank 3 supply voltage |
| 핀 80 | I/O — General-purpose user I/O bank 3 |
| 핀 81 | I/O — General-purpose user I/O bank 3 |
| 핀 82 | GND — Ground |
| 핀 83 | I/O — General-purpose user I/O bank 3 |
| 핀 84 | I/O — General-purpose user I/O bank 3 |
| 핀 85 | I/O — General-purpose user I/O bank 3 |
| 핀 86 | I/O — General-purpose user I/O bank 3 |
| 핀 87 | I/O — General-purpose user I/O bank 3 |
| 핀 88 | GND — Ground |
| 핀 89 | I/O — General-purpose user I/O bank 4 |
| 핀 90 | I/O — General-purpose user I/O bank 4 |
| 핀 91 | I/O — General-purpose user I/O bank 4 |
| 핀 92 | I/O — General-purpose user I/O bank 4 |
| 핀 93 | VCCIO4 — I/O bank 4 supply voltage |
| 핀 94 | I/O — General-purpose user I/O bank 4 |
| 핀 95 | I/O — General-purpose user I/O bank 4 |
| 핀 96 | GND — Ground |
| 핀 97 | I/O — General-purpose user I/O bank 4 |
| 핀 98 | I/O — General-purpose user I/O bank 4 |
| 핀 99 | I/O — General-purpose user I/O bank 4 |
| 핀 100 | I/O — General-purpose user I/O bank 4 |
| 핀 101 | I/O — General-purpose user I/O bank 4 |
| 핀 102 | GND — Ground |
| 핀 103 | I/O — General-purpose user I/O bank 4 |
| 핀 104 | I/O — General-purpose user I/O bank 4 |
| 핀 105 | I/O — General-purpose user I/O bank 4 |
| 핀 106 | I/O — General-purpose user I/O bank 4 |
| 핀 107 | I/O — General-purpose user I/O bank 4 |
| 핀 108 | GND — Ground |
| 핀 109 | I/O — General-purpose user I/O bank 5 |
| 핀 110 | I/O — General-purpose user I/O bank 5 |
| 핀 111 | I/O — General-purpose user I/O bank 5 |
| 핀 112 | I/O — General-purpose user I/O bank 5 |
| 핀 113 | VCCIO5 — I/O bank 5 supply voltage |
| 핀 114 | I/O — General-purpose user I/O bank 5 |
| 핀 115 | I/O — General-purpose user I/O bank 5 |
| 핀 116 | GND — Ground |
| 핀 117 | I/O — General-purpose user I/O bank 5 |
| 핀 118 | I/O — General-purpose user I/O bank 5 |
| 핀 119 | I/O — General-purpose user I/O bank 5 |
| 핀 120 | I/O — General-purpose user I/O bank 5 |
| 핀 121 | I/O — General-purpose user I/O bank 5 |
| 핀 122 | GND — Ground |
| 핀 123 | I/O — General-purpose user I/O bank 5 |
| 핀 124 | I/O — General-purpose user I/O bank 5 |
| 핀 125 | I/O — General-purpose user I/O bank 5 |
| 핀 126 | VCCIO5 — I/O bank 5 supply voltage |
| 핀 127 | I/O — General-purpose user I/O bank 5 |
| 핀 128 | I/O — General-purpose user I/O bank 5 |
| 핀 129 | GND — Ground |
| 핀 130 | I/O — General-purpose user I/O bank 6 |
| 핀 131 | I/O — General-purpose user I/O bank 6 |
| 핀 132 | I/O — General-purpose user I/O bank 6 |
| 핀 133 | I/O — General-purpose user I/O bank 6 |
| 핀 134 | I/O — General-purpose user I/O bank 6 |
| 핀 135 | GND — Ground |
| 핀 136 | I/O — General-purpose user I/O bank 6 |
| 핀 137 | I/O — General-purpose user I/O bank 6 |
| 핀 138 | I/O — General-purpose user I/O bank 6 |
| 핀 139 | I/O — General-purpose user I/O bank 6 |
| 핀 140 | VCCIO6 — I/O bank 6 supply voltage |
| 핀 141 | I/O — General-purpose user I/O bank 6 |
| 핀 142 | I/O — General-purpose user I/O bank 6 |
| 핀 143 | GND — Ground |
| 핀 144 | I/O — General-purpose user I/O bank 6 |
일반적인 애플리케이션
10M40SAE144I7G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridge and Image Preprocessing, Portable Medical Instrumentation, LED Display Controllers, Automotive Body and Comfort Electronics.
Industrial Motor Control
The 10M40SAE144I7G suits industrial motor-control boards because its 40,000 logic elements and 168 (18x18) multipliers implement field-oriented control (FOC), space-vector PWM, and quadrature-encoder decoding without an external DSP. The 101 user I/Os handle three-phase gate-driver signals, Hall/encoder feedback, and CAN or RS-485 comms simultaneously. Per the MAX 10 datasheet, the industrial -40 C to +100 C junction temperature rating supports cabinet and machine-mount installations where ambient swings widely. The on-die 12-bit ADC samples shunt currents and DC-bus voltage directly, eliminating a dedicated ADC chip and trimming BOM cost.
추천
Factory Automation I/O Expansion
The 10M40SAE144I7G operates as a distributed I/O concentrator in factory-automation cells, aggregating discrete and analog sensor data over EtherCAT, PROFINET, or Modbus TCP links. Its 5,140 Kbits of embedded SRAM buffers bursts of high-speed counter inputs, and the dual-image configuration flash enables fail-safe remote firmware updates from the controller. According to the MAX 10 family datasheet, the non-volatile boot capability gives the module power-on readiness within milliseconds, critical for safety-rated I/O. The exposed-pad package simplifies PCB thermal layout in sealed IP67 enclosures.
추천
Video Bridge and Image Preprocessing
The 10M40SAE144I7G acts as a video-format bridge between image sensors, displays, and SoCs, converting MIPI-CSI to parallel RGB, deinterlacing legacy video, or performing simple color-space transforms. Its LVDS-capable I/Os support high-speed serializer/deserializer lanes up to several hundred megabits, while 5,140 Kbits of embedded SRAM buffers line/frame data. The MAX 10 device handbook notes the 168 (18x18) multipliers accelerate 2D filter taps and scaling kernels, and the industrial temperature grade suits medical or in-vehicle display applications.
추천
Portable Medical Instrumentation
The 10M40SAE144I7G powers portable patient-monitoring and point-of-care instruments, hosting display controllers, key-scan, and signal-conditioning glue logic next to a host MCU. Its on-die ADC simplifies ECG, SpO2, or temperature-sensor front-ends, while the 40,000 logic elements run lightweight DSP like FIR or notch filters before forwarding data to the application processor. Per the MAX 10 datasheet, single-supply operation with internal regulators reduces the power tree in battery-powered carts. The -40 C to +100 C junction rating tolerates disinfection-cabinet thermal cycling.
추천
LED Display Controllers
The 10M40SAE144I7G drives large-format LED video walls and architectural lighting, generating refresh, gamma-correction, and pixel-mapping pipelines for thousands of channels. Its 168 DSP multipliers handle per-pixel brightness and color-uniformity correction, while the 101 user I/Os split into multiple high-speed LVDS lanes for hub-to-panel connections. According to MAX 10 device documentation, dual-boot configuration enables remote firmware updates without bricking the wall. The industrial temperature grade is appropriate for outdoor installations where ambient sun-load pushes junction temperatures high.
추천
Automotive Body and Comfort Electronics
The 10M40SAE144I7G can be deployed in non-safety automotive body controllers such as HVAC, seat-control, mirror-adjustment, and lighting modules where AEC-Q100 is not mandatory. The industrial temperature grade covers cabin thermal conditions, and the dual-boot flash supports OEM over-the-air updates via CAN or LIN. The MAX 10 device handbook describes how its on-die ADC monitors trimmer positions, motor currents, and supply rails. Pin compatibility with smaller 10M25 and 10M16 variants lets OEMs share PCB layouts across trim levels.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M40SAE144I7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M25SAE144I7G | 10M40SAE144C8G | 10M16SCE144I7G | 10M04SCE144I7G | 10M25SAE144C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same |
| Logic Elements | 40,000 | 25,000 (-37.5%) | 40,000 (identical) | 16,000 (-60%) | 4,000 (-90%) | 25,000 (-37.5%) |
| Speed Grade | -7 | -7 (identical) | -8 (slower) | -7 (identical) | -7 (identical) | -8 (slower) |
| Temperature Grade | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) |
| User I/Os | 101 | 101 (identical) | 101 (identical) | 101 (identical) | 101 (identical) | 101 (identical) |
| Multipliers (18x18) | 168 | 66 (-60.7%) | 168 (identical) | 45 (-73.2%) | 16 (-90.5%) | 66 (-60.7%) |
| Embedded SRAM (Kbits) | 5,140 | 1,638 (-68.1%) | 5,140 (identical) | 840 (-83.7%) | 270 (-94.7%) | 1,638 (-68.1%) |
주요 차별점
- Largest logic element count in the MAX 10 EQFP-144 family (vs 10M25SAE144I7G)
- Industrial temperature grade for harsh-environment deployment (vs 10M40SAE144C8G)
- Faster -7 speed grade than the C8G alternative (vs 10M40SAE144C8G)
설계 노트
The 144-LQFP exposed-pad package dissipates heat primarily through the underside thermal pad. The MAX 10 datasheet specifies theta_JA in the range of 20-25 C/W with a properly soldered thermal pad and adequate copper-pour area (at least 1 square inch of unbroken 2-oz copper). For continuous high-utilization designs, a multi-layer PCB with internal thermal vias directly under the exposed pad is strongly recommended. Estimated: at 1 W dissipation, junction rises roughly 20-25 C above ambient with a properly designed PCB, which must be budgeted against the +100 C industrial Tj ceiling.
Decouple each VCCIO bank with a 0.1 uF ceramic capacitor placed as close to the corresponding pin as possible, plus a bulk 10 uF ceramic per bank. Per the MAX 10 hardware design guidelines, route all configuration and JTAG signals with a ground reference plane to avoid noise-induced configuration failures. Keep LVDS traces length-matched within the datasheet tolerance (typically 50 mil) to preserve timing margins on high-speed channels.
A common mistake is to leave unused I/O banks unpowered or floating. Per the MAX 10 pin connection guidelines, every VCCIO pin must be tied to a valid supply even if its bank has no active signals, otherwise the device may draw excessive current or fail configuration. Also, never tie JTAG pins (TCK, TMS, TDI, TDO) directly to ground if JTAG is unused - leave them floating or use the recommended pull-up/pull-down values to avoid in-system programming conflicts.
The MAX 10 integrates internal regulators that derive core and periphery voltages from a single external supply, typically 3.0 V or 3.3 V. The datasheet recommends a bulk 100 uF tantalum plus 10 uF and 0.1 uF ceramics at the supply pins to handle transient in-rush. Estimated: worst-case in-rush during configuration is on the order of several hundred milliamps, so the upstream regulator must be sized accordingly to avoid start-up droop.
규정 준수 정보
RoHS compliant per datasheet package marking and Arrow catalog page. Not AEC-Q100 qualified - this part targets industrial, not automotive safety-critical, applications. Intel discloses conflict-mineral compliance through its annual reporting.