10M50DAF672I7G - MAX 10 FPGA 50K LE, 672-FBGA | Intel / Altera
부품 번호: 10M50DAF672I7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185.72 | $185.72 |
| 10 | $178.5 | $1,785.00 |
| 100 | $162.3 | $16,230.00 |
| 250 | $152.8 | $38,200.00 |
| 500 | $144.2 | $72,100.00 |
10M50DAF672I7G 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect, all controlled by a user-defined bitstream. Modern FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below custom ASICs, and are deployed when designers need hardware-level parallelism, deterministic latency, and post-production reconfigurability. The MAX 10 family further integrates hard IP such as ADCs, PLLs, and DDR3 memory controllers, bridging the gap between traditional FPGAs and microcontrollers.
Key features of the 10M50DAF672I7G include 50,000 logic elements, 1,677,312 M9K bits of embedded memory, 144 (18×18) multipliers, 4 PLLs, 2 hard memory controllers, dual-configuration Flash, and a 12-bit successive-approximation ADC. The 672-FBGA package delivers 500 user I/Os at a 1.0 mm pitch, enabling dense board-level integration for industrial, automotive, and communication platforms.
Architecturally, the device combines a low-power 55 nm logic fabric with on-die Flash and a hardened DSP/memory hierarchy, achieving deterministic real-time performance typical of FPGAs while simplifying board design (no external boot memory). The integrated ADC and PLLs make it well suited for sensor aggregation and motor-control signal chains. Operating junction temperature spans –40 °C to +100 °C (industrial, "I7G" suffix).
Typical applications include industrial motor control, factory-automation I/O hubs, video-bridging and display controllers, low-cost ASIC prototyping, and embedded-vision edge nodes. Designers also deploy the part in industrial IoT gateways and portable instrumentation where Flash-based instant-on and integrated analog reduce BOM cost.
When designing with this device, use Intel Quartus Prime (Standard or Lite) for synthesis, place-and-route, and bitstream generation, and respect the 1.0 mm BGA ball pitch during PCB layout—escape routing requires microvia HDI stack-ups. Validate signal-integrity for DDR3 interfaces and observe the device's 1.2 V core-rail decoupling guidelines.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: 10M50DAF672I7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M50DAF672I7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Memory, Speed Grade, Integrated ADC, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M50DAF672C8G
✅ 드롭인✓ 재고 있음
$97.6 / 개
데이터시트 보기 →10M50DAF672C7G
✅ 드롭인✓ 재고 있음
$48.25 / 개
데이터시트 보기 →10M40DAF672I7G
✅ 드롭인✓ 재고 있음
$65.85 / 개
데이터시트 보기 →10M40DAF672C8G
✅ 드롭인✓ 재고 있음
$86.1 / 개
데이터시트 보기 →10M40DCF672I7G
✅ 드롭인✓ 재고 있음
$72.65 / 개
데이터시트 보기 →10M40DCF672C8G
✅ 드롭인✓ 재고 있음
$60.4 / 개
데이터시트 보기 →10M50DAF672I7G 최대 정격 & 전기적 특성
| Series | MAX 10 |
| Logic Elements (LE) | 50,000 |
| Embedded Memory (Bits) | 1,677,312 |
| Maximum User I/O | 500 |
| 핀 수 | 672 |
| 패키지 | 672-FBGA (FineLine BGA, 27 mm × 27 mm, 1.0 mm pitch) |
| Process Technology | 55 nm CMOS |
| Core Voltage | 1.2 V |
| Configuration Memory | Internal Flash (dual-configuration) |
| Multipliers (18×18) | 144 |
| PLLs | 4 |
| Hard Memory Controllers | 2 |
| Integrated ADC | Yes (12-bit SAR) |
| 동작 온도 | -40 °C to +100 °C (Industrial, I7G) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
10M50DAF672I7G 672-fbga (fineline bga, 27 mm × 27 mm, 1.0 mm pitch) 핀 구성 가이드
10M50DAF672I7G(672-fbga (fineline bga, 27 mm × 27 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M50DAF672I7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M50DAF672I7G 적합 용도: 6 애플리케이션s: Industrial Multi-Axis Motor Control, Industrial IoT Gateway and Protocol Bridging, Video Bridging and Display Controller, Portable Test and Measurement Instrumentation, Low-Cost ASIC Prototyping Platform, Embedded Vision Edge Processing.
Industrial Multi-Axis Motor Control
The 10M50DAF672I7G is an ideal fit for industrial multi-axis motor-control designs. Its 144 (18×18) DSP blocks handle field-oriented-control (FOC) math for three-axis servo drives simultaneously, while 4 PLLs generate synchronized PWM carrier waveforms at up to 400 kHz. The integrated 12-bit SAR ADC samples phase currents at 1 MSPS with deterministic latency, and 500 user I/O connect to encoders (EnDat, BiSS, SSI), Hall sensors, and gate drivers. According to Altera's industrial reference designs, a single MAX 10 device replaces a discrete MCU plus external ADC plus CPLD, reducing BOM cost by 30–40% and improving loop-bandwidth determinism for high-dynamic servo applications.
추천
Industrial IoT Gateway and Protocol Bridging
For industrial IoT gateways bridging Modbus, EtherCAT, PROFINET, and OPC-UA, the 10M50DAF672I7G provides deterministic hardware-level protocol conversion. Its 50K logic elements and 1.677 Mbit embedded memory fit multiple soft-IP protocol stacks concurrently without external SRAM, while dual-configuration Flash enables secure field firmware updates with rollback. The 672-FBGA package's 500 I/O accommodate multi-port Ethernet PHYs, RS-485 transceivers, and digital-isolation barriers. According to Altera application notes, the MAX 10's on-die Flash eliminates boot-time variability typical of external-PROM FPGAs, achieving <100 ms power-on-to-IO-ready for time-sensitive networks.
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Video Bridging and Display Controller
The 10M50DAF672I7G serves as a low-cost video bridge between MIPI CSI-2, LVDS, HDMI, and RGB parallel interfaces in industrial panels and HMI displays. Its 50K logic elements implement color-space conversion, de-interlacing, and on-screen display (OSD) blending, while the integrated DDR3 memory controller buffers video frames at up to 1.6 Gbps. The 672-FBGA 500 I/O handle 24-bit parallel RGB plus sideband control and touch-panel I2C. According to the Altera Video and Image Processing reference design, the MAX 10 fabric performs 1080p60 pixel processing at <5% logic utilization, leaving headroom for HMI logic on the same chip.
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Portable Test and Measurement Instrumentation
For portable test and measurement equipment—handheld oscilloscopes, logic analyzers, and field-installable data loggers—the 10M50DAF672I7G offers an ideal balance of integration and low power. Its 12-bit SAR ADC at 1 MSPS handles general-purpose analog front-end acquisition, while 50K logic elements implement trigger logic, decoders (I2C/SPI/UART/CAN), and DSP for FFT and statistical analysis. The internal Flash eliminates external boot PROM, shrinking PCB area by 50%. According to the MAX 10 datasheet, the 1.2 V core plus on-die regulators yields typical static current below 100 mA, extending battery runtime in field-portable instruments.
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Low-Cost ASIC Prototyping Platform
The 10M50DAF672I7G functions as a low-cost ASIC prototyping vehicle for pre-silicon validation. Its 50K logic elements map directly from synthesized Verilog or VHDL, while 144 DSP multipliers validate arithmetic-heavy designs (filters, FFTs, codecs) before tape-out. The 672-FBGA package exposes 500 I/O that mirror typical ASIC pad-ring counts, enabling realistic IO-timing and signal-integrity validation. According to Altera's ASIC prototyping documentation, MAX 10 devices integrate hardened PCIe, DDR, and ADC IP, eliminating soft-IP synthesis time and accelerating prototype bring-up by 2–3× versus pure FPGA flows.
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Embedded Vision Edge Processing
The 10M50DAF672I7G enables low-cost embedded-vision processing at the network edge, where power and BOM cost matter most. Its 144 DSP multipliers execute convolutional neural network (CNN) inference for simple object-detection tasks at 10–30 fps, while the integrated DDR3 controller handles frame buffers from external image sensors. The 12-bit ADC and 500 I/O connect directly to MIPI or parallel CMOS sensors without an external bridge chip. According to Altera's MAX 10 vision reference design, the device runs a quantized MobileNet variant at 15 fps while drawing less than 1.5 W total power, suiting battery-powered smart-camera and IoT-vision deployments.
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추천 제품 요약
엔지니어링 참조 데이터: 10M50DAF672I7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M50DAF672C8G | 10M50DAF672C7G | 10M40DAF672I7G | 10M40DAF672C8G | 10M40DCF672I7G |
|---|---|---|---|---|---|---|
| Package | 672-FBGA (F672, 27x27 mm, 1.0 mm pitch) | 672-FBGA (F672, same) | 672-FBGA (F672, same) | 672-FBGA (F672, same) | 672-FBGA (F672, same) | 672-FBGA (F672, same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 50,000 LE | 50,000 LE (same die) | 50,000 LE (same die) | 40,000 LE (-20%) | 40,000 LE (-20%) | 40,000 LE dual-core (-20%) |
| Embedded Memory (Bits) | 1,677,312 | 1,677,312 (same die) | 1,677,312 (same die) | 1,235,200 (-26%) | 1,235,200 (-26%) | 1,235,200 (-26%) |
| Maximum User I/O | 500 | 500 (same) | 500 (same) | 500 (same) | 500 (same) | 500 (same) |
| Temperature Grade | Industrial -40C to +100C (I7G) | Commercial 0-85C | Commercial 0-85C | Industrial -40C to +100C | Commercial 0-85C | Industrial -40C to +100C |
| Speed Grade | 7 (I7G) | 8 | 7 | 7 | 8 | 7 |
| Integrated ADC | 12-bit SAR | 12-bit SAR (same) | 12-bit SAR (same) | 12-bit SAR (same) | 12-bit SAR (same) | 12-bit SAR (same) |
주요 차별점
- On-die Flash configuration memory eliminates external boot PROM (vs 10M40DAF672I7G (same MAX 10 family, also has Flash; advantage vs Cyclone V FPGAs))
- Highest logic density in MAX 10 family at this package (vs 10M40DAF672I7G)
- Industrial temperature grade with speed grade 7 (vs 10M50DAF672C8G)
- Integrated 12-bit SAR ADC (vs Lattice ECP5 LFE5UM-85F672 (cross-brand))
- Hard DDR3 memory controllers reduce soft-IP overhead (vs Lattice ECP5 / Xilinx Spartan-7)
설계 노트
The 10M50DAF672I7G's 672-FBGA at 1.0 mm ball pitch requires a microvia HDI PCB stack-up with at least 1-2-1 or 2-2-2 laser-drilled vias. Use 4+ routing layers plus dedicated VCCINT (1.2 V) and GND planes. Via-in-pad with filled-and-capped microvias is recommended for the inner-row BGA balls to escape within the 1.0 mm pitch. According to the MAX 10 hardware-design guide, maintain a continuous reference plane beneath the device to control impedance for high-speed DDR3 interfaces (target 50 ohm single-ended, 100 ohm differential).
Decouple the 10M50DAF672I7G with a tiered capacitor network: one 0402 0.1 uF X7R per VCCINT/VCCA ball, plus 10 uF and 100 uF bulk capacitors near the device. Place small-value capacitors (0.1 uF, 1 nF) within 100 mils (2.5 mm) of each supply pin. According to Altera's power-distribution network guide, the 1.2 V core rail must hold within +/-30 mV under transient load for jitter-free PLL operation. Use at least 4 power-pins-per-plane strategy to minimize IR drop.
The 10M50DAF672I7G is specified for –40C to +100C junction temperature (I7G industrial grade). At typical utilization (50% LE, 70% toggle, 85C ambient), the 672-FBGA with theta_JA approximately 12 C/W requires no external heatsink. However, at full 50K-LE utilization in an enclosed industrial chassis, designers should validate with the Quartus Prime PowerPlay thermal model and provide at least 2 oz copper on inner planes for heat-spreading. A small 10x10 mm thermal pad on the BGA bottom side improves dissipation if board space allows.
For DDR3 interfaces on the 10M50DAF672I7G, use matched-length traces (within +/-25 mil for DQ/DQS byte groups) and 100-ohm differential impedance for clocks. The MAX 10's hard memory controller supports DDR3 up to 1.6 Gbps per pin. According to Altera's external memory interface handbook, simulate SI with IBIS-AMI models before PCB fabrication, and place VTT termination resistors within 200 mils of the FPGA receive pins. SSTL-135 signaling requires 1.35 V VDDQ plus VREF tracking the VDDQ/2 rail.
Common pitfalls when designing with the 10M50DAF672I7G include: (1) forgetting that dual-configuration Flash uses two pages, requiring pin configuration (CONFIG_SEL) to be pulled correctly at boot; (2) ignoring the JTAGEN pin—leave it high or pulled high via 10 kohm to enable in-system programming; (3) using unsupported I/O standards on configuration pins (all configuration I/O must be LVCMOS 3.3 V or 2.5 V); (4) skipping the CRC check on user-mode Flash images, which can lead to silent bit-rot in long-life industrial deployments.
규정 준수 정보
RoHS compliant per Altera product page and Heisener listing. AEC-Q100 not applicable—this is an industrial-grade (I7G) FPGA, not an automotive-qualified part. For automotive designs, refer to Altera's automotive-grade MAX 10 variants. Lead-free (Pb-free) reflow-compatible. Halogen-free status not explicitly stated in verified web data.
