10M50DAF672C8G - MAX 10 FPGA 50K LE 672-BGA | Intel / Altera
MPN: 10M50DAF672C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $148.5 | $148.50 |
| 10 | $135.2 | $1,352.00 |
| 100 | $119.85 | $11,985.00 |
| 250 | $108.4 | $27,100.00 |
| 500 | $97.6 | $48,800.00 |
10M50DAF672C8G Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic fabric and routing can be reconfigured after manufacture by the end user. In the broader taxonomy, an FPGA belongs to programmable logic devices (PLD) and sits alongside CPLDs in the digital logic IC family. Unlike an ASIC, an FPGA offers rapid prototyping and field upgrades, while MAX 10 devices add non-volatile flash configuration that enables instant-on behavior without an external boot PROM - ideal for cost- and board-space-constrained industrial designs.
Key specifications of the 10M50DAF672C8G include 50,000 logic elements, 1,677,312 bits (~1.6 Mb) of user SRAM, 500 maximum user I/O pins, embedded 18x18 multipliers, and dual 12-bit successive-approximation ADCs. The device integrates flash configuration memory on-chip, eliminating external boot components. Internal PLLs support multiple clock domains, and the 672-ball FineLine BGA package provides high pin density for I/O-rich designs.
Architecturally, MAX 10 uses a Logic Array Block (LAB) fabric composed of adaptive logic modules (ALMs), interconnected by a MultiTrack routing architecture. The embedded flash array stores the configuration image, enabling sub-100 ms power-to-functional startup. The dual on-chip ADCs sample up to 16 analog channels, supporting sensor monitoring and digital system management directly inside the FPGA.
Typical applications include industrial motor control, factory automation I/O expansion, video bridging and display controllers, automotive driver-assistance subsystems, and portable instrumentation. The instant-on, single-chip architecture suits designs where deterministic power-up and small PCB area outweigh the need for the largest logic capacity.
When designing with this FPGA, plan bank voltage compatibility carefully. Each I/O bank operates at an independent VCCIO, and mixing 1.8 V, 2.5 V, 3.3 V, and 1.5 V interfaces requires deliberate bank assignments. Verify Quartus Prime pinout assignments against the chosen board layout before tape-out.
This page synthesizes Intel/Altera datasheet specs, distributor pricing tiers, drop-in same-package alternatives from the MAX 10 family, and practical Quartus Prime design notes that manufacturer datasheets do not aggregate in one place.
Drop-in alternatives for 10M50DAF672C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M50DAF672C8G (same form factor and footprint) — differing in Package, Configuration Memory, Speed Grade, Operating Temperature, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M50DAF672I7G
✅ Drop-In✓ In Stock
$144.2 / Unit
View Datasheet →10M50DAF672C7G
✅ Drop-In✓ In Stock
$48.25 / Unit
View Datasheet →10M50DAF672I8G
✅ Drop-In📋 Reference alternative (not in catalog)
10M40DAF672C8G
✅ Drop-In✓ In Stock
$86.1 / Unit
View Datasheet →10M25DAF672C8G
✅ Drop-In📋 Reference alternative (not in catalog)
10M50DAF672C8G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements | 50,000 |
| Embedded SRAM | 1,677,312 bits (~1.6 Mb) |
| Maximum User I/O | 500 |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Package | 672-ball FBGA (FineLine BGA) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Embedded Multipliers | Yes (18x18) |
| On-chip ADC | Dual 12-bit SAR ADC |
| PLLs | Internal PLLs (multiple clock domains) |
| Speed Grade | C8 (commercial, -8) |
| Operating Temperature | Commercial 0 C to +85 C |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
10M50DAF672C8G 672-ball fbga (fineline bga) Pin Configuration Guide
Pin configuration for 10M50DAF672C8G (672-ball fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50DAF672C8G.
Refer to the datasheet for full pin configuration.
Typical Applications
10M50DAF672C8G is suitable for 6 applications: Industrial Motor Control, Video Bridging and Display Controllers, Factory Automation I/O Expansion, Automotive Driver-Assistance Subsystems, Portable Test and Measurement Instrumentation, Industrial IoT Gateway Edge Processing.
Industrial Motor Control
The 10M50DAF672C8G suits industrial motor control because its 50,000 logic elements and embedded 18x18 multipliers can implement field-oriented control (FOC) algorithms and PWM generation in a single device. The 672-ball BGA exposes up to 500 user I/Os, enough for multi-axis encoder inputs, Hall sensors, and gate-driver interfaces without external I/O expanders. The on-chip dual 12-bit SAR ADC samples motor currents and bus voltages directly inside the FPGA, eliminating an external ADC and reducing BOM. The instant-on flash configuration ensures deterministic startup within tens of milliseconds - critical for safety-critical motor drives that must energize the gate drivers before any external processor boots.
Recommended
Video Bridging and Display Controllers
With 1.6 Mb of embedded SRAM, the 10M50DAF672C8G buffers full-HD video lines without external memory for short frame pipelines, making it ideal for video format conversion, scaling, and protocol bridging (LVDS to MIPI, HDMI to LVDS, etc.). The 500 user I/Os accommodate wide parallel video buses and high-speed LVDS pairs in parallel. The MAX 10's PLLs generate multiple pixel clocks simultaneously, allowing real-time conversion between 60 Hz, 75 Hz, and 120 Hz display modes. The non-volatile configuration enables instant-on display at power-up, which is required for heads-up displays and digital signage that must present content before any host CPU boots.
Recommended
Factory Automation I/O Expansion
In factory automation, the 10M50DAF672C8G acts as a programmable I/O concentrator that aggregates hundreds of 24 V industrial signals, opto-isolated inputs, and RS-485 buses into a high-speed SPI or parallel interface for a host PLC or industrial PC. The 50K LE fabric implements debouncing, pulse counting, PWM output, and protocol conversion (Modbus, CANopen, EtherCAT slave) concurrently. The dual on-chip ADCs monitor backplane voltages and temperatures without external parts. Industrial temperature variants (-40 C to +100 C) of the same 672-ball BGA package handle the harsh thermal environment inside control cabinets, ensuring long-term reliability on the factory floor.
Recommended
Automotive Driver-Assistance Subsystems
The 10M50DAF672C8G is widely used in automotive ADAS subsystems for sensor fusion pre-processing, where it aggregates LVDS camera data, CAN-FD bus traffic, and radar pulse timestamps before forwarding to the main SoC. The 50K LE fabric handles real-time image pre-processing (cropping, color space conversion, simple filtering) at line rate, offloading the main processor. The instant-on flash configuration supports cold-start ADAS cameras that must output a stable image within milliseconds of ignition. Designers should note that the C8 commercial speed grade requires a heated garage environment; for under-hood or outdoor mounting, choose the automotive-qualified MAX 10 AEC-Q100 variants in the same 672-ball BGA footprint.
Recommended
Portable Test and Measurement Instrumentation
Portable T&M instruments benefit from the 10M50DAF672C8G's combination of non-volatile instant-on, dual on-chip ADCs, and dense logic. The FPGA captures high-speed analog signals through its internal ADCs, performs real-time DSP (FFT, filtering, digital demodulation) using its 18x18 multipliers, and drives a color TFT display directly through LVDS. The 500 user I/Os allow direct connection to logic analyzer pods, oscilloscope front-ends, and protocol decoders. Because the configuration is stored in on-chip flash, the instrument boots in tens of milliseconds - critical for handheld battery-powered devices where every joule of standby power matters and users expect instant readiness when powering on.
Recommended
Industrial IoT Gateway Edge Processing
As an edge-processing node in Industrial IoT gateways, the 10M50DAF672C8G aggregates data from Modbus, CAN, SPI, and I2C sensors, performs local filtering and threshold detection, and publishes only meaningful events to the cloud via Ethernet or cellular backhaul. The on-chip flash configuration eliminates boot ROMs, shrinking the gateway PCB and lowering bill of materials. The 50K LE fabric supports soft-core processors such as Nios II for protocol stack handling alongside hardware accelerators for cryptography (AES, SHA) and packet inspection. The integrated dual ADCs monitor the gateway's own power rails and temperature, enabling predictive maintenance without external monitoring ICs.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DAF672C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M50DAF672I7G | 10M50DAF672C7G | 10M50DAF672I8G | 10M40DAF672C8G | 10M25DAF672C8G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FBGA (F672) | 672-ball FBGA (F672) - same | 672-ball FBGA (F672) - same | 672-ball FBGA (F672) - same | 672-ball FBGA (F672) - same | 672-ball FBGA (F672) - same |
| Logic Elements | 50,000 | 50,000 | 50,000 | 50,000 | 40,000 | 25,000 |
| Embedded SRAM | 1,677,312 bits | 1,677,312 bits | 1,677,312 bits | 1,677,312 bits | 1,252,096 bits | 837,120 bits |
| Maximum User I/O | 500 | 500 | 500 | 500 | 500 | 500 |
| Speed Grade | C8 (-8 commercial) | I7 (-7 industrial) | C7 (-7 commercial) | I8 (-8 industrial) | C8 (-8 commercial) | C8 (-8 commercial) |
| Temperature Range | Commercial 0 C to +85 C | Industrial -40 C to +100 C | Commercial 0 C to +85 C | Industrial -40 C to +100 C | Commercial 0 C to +85 C | Commercial 0 C to +85 C |
| On-chip Flash (Non-volatile) | Yes | Yes | Yes | Yes | Yes | Yes |
| On-chip ADC | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR | Dual 12-bit SAR |
| Approx. Unit Price (USD, qty 1) | 148.50 | 165.00 | 132.00 | 172.00 | 118.00 | 92.00 |
Key Differentiators
- Non-volatile instant-on configuration in 50K LE capacity (vs 10M40DAF672C8G (40K LE variant))
- Industrial temperature range available in same package (vs 10M50DAF672I7G (industrial variant))
- On-chip flash eliminates external boot PROM (vs Cyclone IV EP4CE50F23 (older SRAM-based FPGA))
Design Notes
The 10M50DAF672C8G requires multiple supply rails: VCCINT (1.2 V core), VCCIO (per-bank I/O voltage, 1.2 V to 3.3 V), VCCA (1.2 V analog PLL/ADC supply), and VCCD_PLL (1.2 V digital PLL). Per the MAX 10 Power Management User Guide, place a 10 uF bulk capacitor plus 0.1 uF and 1 nF decoupling caps adjacent to each VCC pin group. Estimate: a fully utilized 50K LE design with 60% toggle rate at 100 MHz draws roughly 400-600 mA from VCCINT - budget for at least 1 A on each VCCINT rail to avoid inrush-induced brown-out.
In the 672-ball FBGA package, the junction-to-ambient thermal resistance (theta_JA) is approximately 12-15 C/W on a JEDEC 4-layer test board with minimal airflow. Estimated: at 1.5 W total dissipation, junction rises about 20 C above ambient. For industrial deployments up to +85 C ambient, ensure at least 200 LFM of forced airflow across the BGA or use thermal vias to a dedicated inner copper plane. Without thermal management, hot spots in dense logic regions can throttle performance or trigger the device's internal thermal sensor.
The 672-ball FineLine BGA requires a 4-layer PCB minimum with 0.4 mm or 0.5 mm ball pitch routing. Use microvia (laser-drilled) stack-up for inner-to-outer layer escape; standard 8-mil vias cannot fan out a 0.5 mm pitch BGA. Per the MAX 10 Hardware Design Guidelines, place 0402 decoupling caps on the opposite side of the BGA within 100 mils of each supply pin. Maintain continuous reference planes under high-speed LVDS and clock traces to control impedance to 100 ohm differential.
Common pitfalls when designing with the 10M50DAF672C8G: (1) mixing 1.8 V and 3.3 V LVCMOS in the same I/O bank without setting VCCIO correctly - this damages I/O buffers; (2) leaving unused LVDS pairs floating instead of tying to VCCIO through 10 kohm - unused pairs emit noise; (3) using JTAG without pull-ups on TCK/TMS/TDI - signal integrity issues during programming; (4) configuring PLL outputs beyond the rated frequency range, which causes silent timing failures; (5) failing to assign all VREF pins when using differential I/O standards.
For optimal signal integrity on the 672-ball BGA, group high-speed differential pairs (LVDS, LVPECL) on the same PCB layer with matched length tuning within 150 mils. Per Intel's MAX 10 device pinout guidelines, place external clock inputs (CLK[0..3]) on dedicated clock input pins with short, impedance-controlled traces. Avoid routing signals over plane splits in the reference plane - return-path discontinuities cause EMI and timing jitter on DDR-style edges.
Compliance Information
RoHS and REACH compliant per Altera/Intel product page. The C8 speed grade is commercial temperature range; AEC-Q100 qualified variants exist in the MAX 10 family with different ordering codes. Lead-free and halogen-free per Intel material declaration.