2VM3104 - Versal Prime Gen 2 Adaptive SoC | AMD | 23x23mm
부품 번호: 2VM3104 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
2VM3104 개요
An adaptive SoC (System-on-Chip) combines a processor subsystem (PS) with programmable logic (PL) on a single device, enabling hardware acceleration and flexible I/O. The Versal Prime Series Gen 2 targets embedded systems requiring high compute density and low latency, bridging the gap between traditional FPGAs and application-specific standard products (ASSPs). The 2VM3104 is positioned as an entry point for customers evaluating the Versal Prime Gen 2 family, with availability expected in 2027.
Key features of the 2VM3104 include a quad-core Arm Cortex-A78AE APU with 64 KB L1 cache, a 23 x 23 mm package that is 27% smaller than previous second-generation Versal Prime devices, and higher programmable logic density per square millimeter compared to similarly sized 8-core devices. The device supports up to 100K DMIPS of scalar compute, making it suitable for real-time control and signal processing.
Technically, the 2VM3104 leverages AMD's advanced process technology to achieve a balance of power efficiency and performance. The programmable logic fabric allows custom accelerators, while the APU handles general-purpose computing. The compact package enables designs with reduced board area, critical for space-constrained systems.
Typical applications include Pro AV equipment (video processing, audio mixing), broadcast infrastructure (encoding, transcoding), and industrial IoT gateways (edge computing, machine vision). The device's small footprint and high compute density make it ideal for these markets.
When designing with the 2VM3104, consider thermal management due to the high compute density in a small package. Adequate cooling and power delivery are essential to maintain performance and reliability.
드롭인 대체품: 2VM3104 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 2VM3104 (동일 폼 팩터 및 풋프린트) — 차이점: Availability.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
2VM3254
⚡ 동일 패키지✓ 재고 있음
가격 문의
데이터시트 보기 →2VM3454
⚡ 동일 패키지✓ 재고 있음
가격 문의
데이터시트 보기 →2VM3654
⚡ 동일 패키지📋 참조 대체품 (카탈로그에 없음)
XC7Z020
⚡ 동일 패키지 ⚠️ 사양 미검증✓ 재고 있음
$21.9 / 개
데이터시트 보기 →XC7A100T
⚡ 동일 패키지 ⚠️ 사양 미검증✓ 재고 있음
$27.9 / 개
데이터시트 보기 →2VM3104 최대 정격 & 전기적 특성
| Family | Versal Prime Series Gen 2 |
| Processor Subsystem | Quad-core Arm Cortex-A78AE |
| L1 Cache | 64 KB |
| Scalar Compute | Up to 100K DMIPS |
| Package Size | 23 x 23 mm |
| RoHS 상태 | unknown |
| Availability | Expected 2027 |
2VM3104 23 x 23 mm 핀 구성 가이드
2VM3104(23 x 23 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 2VM3104.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
2VM3104 적합 용도: 6 애플리케이션s: Pro AV Equipment, Broadcast Infrastructure, Industrial IoT Gateways, Edge AI and Machine Vision, Test and Measurement, Aerospace and Defense.
Pro AV Equipment
The 2VM3104 is ideal for Pro AV equipment such as video processors, audio mixers, and signal distribution units. Its compact 23x23 mm package allows integration into space-constrained AV hardware, while the quad-core Arm Cortex-A78AE APU and programmable logic handle real-time video processing, scaling, and audio mixing. The device's up to 100K DMIPS scalar compute ensures smooth operation of complex AV algorithms, and the programmable logic enables custom video interfaces and codecs. With high compute density, the 2VM3104 supports multiple video streams and low-latency processing, making it suitable for professional broadcast and AV installations.
추천
Broadcast Infrastructure
In broadcast infrastructure, the 2VM3104 excels in encoding, transcoding, and signal processing applications. Its programmable logic can implement custom video codecs and transport stream processors, while the APU handles control plane tasks. The 23x23 mm package is ideal for dense broadcast equipment like encoders and switchers. With up to 100K DMIPS, the device can manage multiple channels of video processing simultaneously. The small footprint reduces board space, enabling more channels per rack unit. The Versal Prime Gen 2 architecture provides the performance needed for high-quality video delivery.
추천
Industrial IoT Gateways
The 2VM3104 is well-suited for industrial IoT gateways that require edge computing, machine vision, and real-time control. Its quad-core Arm Cortex-A78AE APU provides powerful general-purpose processing, while the programmable logic can implement custom sensor interfaces and acceleration engines. The compact 23x23 mm package fits into rugged industrial enclosures. With up to 100K DMIPS, the device can handle complex analytics and protocol conversion. The small size and high compute density make it ideal for distributed edge nodes in factories and smart buildings.
추천
Edge AI and Machine Vision
The 2VM3104 enables edge AI and machine vision applications by combining a powerful APU with programmable logic for custom neural network accelerators. The quad-core Arm Cortex-A78AE can run inference frameworks, while the PL implements high-throughput preprocessing. The 23x23 mm package is suitable for cameras and smart sensors. With up to 100K DMIPS, the device can process multiple video streams for object detection and classification. The small form factor allows integration into compact vision systems, and the adaptive nature of the SoC allows algorithm updates in the field.
추천
Test and Measurement
The 2VM3104 is suitable for test and measurement equipment such as oscilloscopes, logic analyzers, and signal generators. Its programmable logic can implement high-speed data acquisition and triggering, while the APU handles user interface and data processing. The compact 23x23 mm package enables portable instruments. With up to 100K DMIPS, the device can perform real-time signal analysis and waveform generation. The small size reduces instrument footprint, and the adaptive SoC allows firmware updates to add new measurement capabilities.
추천
Aerospace and Defense
The 2VM3104 can be used in aerospace and defense applications such as radar processing, secure communications, and flight control. Its programmable logic allows custom signal processing and encryption, while the APU provides general-purpose computing. The compact 23x23 mm package is suitable for avionics and unmanned systems. With up to 100K DMIPS, the device can handle complex algorithms in real-time. The small size reduces weight and power consumption, critical for airborne platforms. AMD's Versal family is designed for high-reliability applications.
추천
추천 제품 요약
엔지니어링 참조 데이터: 2VM3104 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 2VM3254 | 2VM3454 | 2VM3654 |
|---|---|---|---|---|
| Package | 23x23 mm | 23x23 mm | 23x23 mm | 23x23 mm |
| Brand | AMD | AMD | AMD | AMD |
| Processor Subsystem | Quad-core Arm Cortex-A78AE | Quad-core Arm Cortex-A78AE | Quad-core Arm Cortex-A78AE | Quad-core Arm Cortex-A78AE |
| Availability | Expected 2027 | Expected 2027 | Early access now | Early access now |
| Package Size Reduction | 27% smaller than previous gen | 27% smaller | 27% smaller | 27% smaller |
| Programmable Logic Density | Higher per mm2 than 8-core devices | Higher per mm2 | Higher per mm2 | Higher per mm2 |
| Target Applications | Pro AV, broadcast, industrial IoT | Pro AV, broadcast, industrial IoT | Pro AV, broadcast, industrial IoT | Pro AV, broadcast, industrial IoT |
주요 차별점
- Compact 23x23 mm package (vs Previous Versal Prime Gen 2 devices)
- Up to 100K DMIPS scalar compute (vs Existing AMD adaptive SoCs)
- Higher programmable logic density (vs Similarly sized 8-core Versal Prime devices)
설계 노트
The 2VM3104's high compute density in a 23x23 mm package requires careful thermal management. Ensure adequate airflow or a heatsink to dissipate heat, especially under sustained loads. Use thermal vias and a solid ground plane to improve heat spreading. Consider the ambient temperature and derating curves once available.
Design a robust power delivery network for the 2VM3104, with multiple voltage rails for the APU, PL, and I/O. Use low-ESR decoupling capacitors close to the power pins. Follow AMD's power sequencing requirements, which will be detailed in the datasheet. Consider using PMICs designed for adaptive SoCs.
For the 23x23 mm package, ensure the PCB layout accommodates high-density BGA or LGA pads. Use fine-pitch routing and controlled impedance for high-speed signals. Follow AMD's layout guidelines for signal integrity, including ground planes and via placement. The small package may require microvias or HDI techniques.
규정 준수 정보
Compliance information not yet available for this pre-release device.
