5CEFA4U19I7 - Cyclone V E FPGA 49K LE UFBGA-484 | Intel/Altera
부품 번호: 5CEFA4U19I7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $31.42 | $31.42 |
| 10 | $28.95 | $289.50 |
| 100 | $25.4 | $2,540.00 |
| 500 | $22.18 | $11,090.00 |
| 1,000 | $19.75 | $19,750.00 |
5CEFA4U19I7 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that engineers can configure after manufacturing to implement arbitrary digital functions. Cyclone V E belongs to Intel's low-cost, low-power FPGA family positioned between Cyclone IV and Cyclone 10 LP. Within the broader taxonomy: FPGA -> programmable logic -> programmable logic device (PLD) -> digital IC -> semiconductor. Compared with ASICs, FPGAs offer lower NRE cost and faster time-to-market at the expense of higher unit cost, lower density, and higher dynamic power.
Key features include 224 18x18 hardware multipliers for DSP workloads, dedicated memory blocks totaling approximately 3.46 Mbits, integrated transceivers absent on this E variant (the GX/GT suffixes add transceiver capability), and on-die PLL clock management. The 28nm process enables static power below 0.25W typical and supports 1.1V core operation with multi-rail I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL standards up to 3.0V. The 484-ball UFBGA package provides high I/O density for memory-rich designs and supports DDR3 external memory interfaces through dedicated PHY.
Typical applications include industrial motor control, video surveillance and machine vision, automotive driver assistance systems (non-safety-critical paths), wireless baseband, software-defined radio (SDR), and embedded vision processing. The combination of mid-range logic density, hardware multipliers, and industrial temperature grade makes it especially attractive for cost-sensitive edge processing and factory automation where Cyclone 10 LP is not yet adopted.
When designing with this device, ensure proper power rail sequencing (1.1V core, separate VCCAUX/VCCPD) and adequate decoupling. Quartus Prime design software supports the device family. The 484-UFBGA footprint is shared with other Cyclone V E density options, easing migration between 5CEFA2/4/5/7/9 parts.
This page synthesizes distributor pricing, package-compatible same-family drop-in alternatives (5CEFA5U19I7N, 5CEFA9F27I7N), and practical design notes not found in the standalone Altera datasheet.
드롭인 대체품: 5CEFA4U19I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CEFA4U19I7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Process Technology, Configuration Scheme, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CEFA5U19I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CEFA9F27I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CEFA4F23I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CEFA2F23I7N
✅ 드롭인✓ 재고 있음
$42.85 / 개
데이터시트 보기 →5CEBA4F23C8N
✅ 드롭인✓ 재고 있음
$62.41 / 개
데이터시트 보기 →5CEFA4U19I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CEFA4U19I7 최대 정격 & 전기적 특성
| Family | Cyclone V E |
| Logic Elements (LE) | 49,000 |
| Embedded Memory (bits) | 3,464,192 |
| Embedded Memory (Mbits) | 3.46 Mbits |
| 18x18 Multipliers | 224 |
| Process Technology | 28 nm TSMC low-power |
| Core Voltage | 1.1 V |
| 동작 온도 범위 | -40C to +100C (Industrial, I7 grade) |
| 패키지 | 484-ball UFBGA (UBGA-484, 19x19 mm) |
| 실장 유형 | Surface Mount (BGA) |
| Transceivers | None (E variant, no GX/GT suffix) |
| Configuration Scheme | Serial/Parallel (Quartus Prime supported) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
5CEFA4U19I7 484-ball ufbga (ubga-484, 19x19 mm) 핀 구성 가이드
5CEFA4U19I7(484-ball ufbga (ubga-484, 19x19 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CEFA4U19I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CEFA4U19I7 적합 용도: 6 애플리케이션s: Industrial Motor Control and Drive, Video Surveillance and Machine Vision, Software-Defined Radio (SDR) Baseband, Automotive Infotainment and Driver Assistance (Non-Safety), Industrial IoT Edge Gateway, Test and Measurement Instrumentation.
Industrial Motor Control and Drive
The 5CEFA4U19I7 fits industrial motor control because its 224 18x18 hardware multipliers accelerate field-oriented control (FOC) and space-vector PWM algorithms, while the 3.46 Mbits of embedded memory buffer current-loop sample streams. Industrial temperature rating (-40C to +100C) lets it sit beside power stages on factory-floor drive boards. Compared with a microcontroller+DSP two-chip solution, the FPGA consolidates encoder decoding, PWM generation, and safety logic in a single -7 speed-grade device, simplifying the bill of materials for mid-power servo drives.
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Video Surveillance and Machine Vision
The 5CEFA4U19I7 is well-suited for video surveillance and machine vision pipelines because its 224 hardware multipliers handle real-time Sobel, Gaussian, and Haar filter kernels at HD video rates, while the 3.46 Mbits of on-chip memory stores line buffers to feed external DDR3 memory through the dedicated PHY. The 484-UFBGA package exposes enough I/O to drive a MIPI-CSI, LVDS, or parallel CMOS sensor plus an HDMI/DVI display output. Industrial temperature grade supports outdoor camera enclosures, and Quartus Prime video IP cores (VIP) accelerate bring-up.
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Software-Defined Radio (SDR) Baseband
The 5CEFA4U19I7 supports software-defined radio baseband processing where its 224 multipliers implement digital down-conversion, FIR filtering, and FFT butterflies at baseband sample rates. While the E variant lacks transceivers, an external ADC/DAC pair feeds the FPGA's LVDS I/O, and the 3.46 Mbits of block memory buffer FFT windows. The -7 speed grade comfortably closes timing at 200 MHz fabric clocks typical of DDC stages. The U19 484-ball package provides sufficient I/O for multi-channel ADC interfaces plus Ethernet or USB bridging.
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Automotive Infotainment and Driver Assistance (Non-Safety)
The 5CEFA4U19I7 suits non-safety-critical automotive paths such as infotainment HMI rendering, surround-view stitching, and rear-seat entertainment because its industrial -40C to +100C temperature grade exceeds AEC-Q100 grade-3 expectations and its 3.46 Mbits of block memory buffers multi-camera frames. The 484-UFBGA footprint supports LVDS display links to cluster and head-unit panels. Designers targeting safety-critical ASIL paths should select a Cyclone V with explicit ASIL documentation rather than this industrial-grade part.
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Industrial IoT Edge Gateway
The 5CEFA4U19I7 is a strong fit for industrial IoT edge gateways that aggregate multiple sensor protocols (Modbus, CAN, RS-485, EtherCAT) because the FPGA fabric implements multiple soft-core CPUs and protocol stacks concurrently. The 224 multipliers accelerate on-gateway analytics such as vibration FFT or predictive-maintenance feature extraction. The industrial temperature grade supports DIN-rail and outdoor cabinet installations. Quartus Prime's Nios II soft-core and Ethernet IP cores enable full gateway functionality without an external host MCU.
추천
Test and Measurement Instrumentation
The 5CEFA4U19I7 suits test and measurement equipment such as protocol analyzers, logic-analyzer front-ends, and arbitrary waveform generators because its 49K logic elements implement deep state machines and trigger logic while the 224 hardware multipliers generate arbitrary waveforms or compute FFTs of captured signals. The U19 484-ball package provides sufficient I/O for high-pin-count probe pods, and the -7 speed grade ensures deterministic timing for time-interleaved capture. The industrial temperature grade supports lab and field-deployed instrument use.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CEFA4U19I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CEFA5U19I7N | 5CEFA9F27I7N | 5CEFA4F23I7N | 5CEFA2F23I7N | 5CEBA4F23C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | UFBGA-484 (U19) | UFBGA-484 (U19) - same | FBGA-672 (F27) - different | FBGA-484 (F23) - same pin count | FBGA-484 (F23) - same pin count | FBGA-484 (F23) - same pin count |
| Logic Elements | 49,000 | 77,000 (+57%) | 301,000 (+514%) | 49,000 (same) | 22,000 (-55%) | 49,000 (same) |
| Transceivers | None (E variant) | None (E variant) | None (E variant) | None (E variant) | None (E variant) | Yes (Cyclone V GX adds transceivers) |
| Temperature Grade | Industrial I7 (-40C to +100C) | Industrial I7 (same) | Industrial I7 (same) | Industrial I7 (same) | Industrial I7 (same) | Commercial C8 (0C to +85C) |
| Process Technology | 28 nm TSMC low-power | 28 nm (same) | 28 nm (same) | 28 nm (same) | 28 nm (same) | 28 nm (same) |
주요 차별점
- Mid-density 49K LE in proven 28nm Cyclone V E process (vs 5CEFA2F23I7N)
- UFBGA-484 package option for high I/O density (vs 5CEFA4F23I7N)
- Same-family drop-in upgrade path to 77K LE (vs 5CEFA5U19I7N)
설계 노트
Estimated: The Cyclone V E 5CEFA4 typically dissipates 0.5W to 1.5W static power at room temperature with light utilization, rising to 2-3W at high toggle rates with all 49K LEs active. Design a 4-layer PCB with separate 1.1V VCCINT, 2.5V VCCAUX, and VCCPD rails; place at least one 100uF bulk plus four 0.1uF and two 10uF ceramic decoupling capacitors within 5 mm of the package. Add a ferrite bead on each rail to isolate switching noise. Use the Intel PowerPlay Early Power Estimator (EPE) spreadsheet to refine these estimates for your specific utilization before finalizing the PCB stackup.
The 484-ball UFBGA uses 0.8 mm ball pitch, requiring laser-drilled microvias on the top signal layer and back-drilled or blind vias for inner layers to escape the dense BGA grid. Use a minimum 4-layer PCB with continuous GND plane on layer 2 directly beneath the BGA. Fan-out the BGA on layer 1 with 0.1 mm (4 mil) trace width to maximize signal escape; for DDR3 interfaces, match trace lengths within 50 mils and use 100-ohm differential impedance for clocks. JTAG, MSEL configuration, and reference-clock traces should be kept under 50 mm to preserve signal integrity.
Common pitfalls when bringing up the 5CEFA4U19I7 include: (1) incorrect MSEL[3..0] strap resistors for the desired configuration mode (AS, JTAG, or Fast Passive Parallel); (2) missing or undersized decoupling on VCCPD causing configuration failures; (3) attempting to use Cyclone V E variant for protocols requiring transceivers - if you need PCIe or gigabit serial, migrate to Cyclone V GX/GT; (4) not checking silicon revision against the Quartus Prime device support list - older revisions may require specific Quartus versions. Always validate the design on a development kit before committing to custom hardware.
Estimated: At maximum utilization, junction-to-ambient thermal resistance theta_JA for the UFBGA-484 package is approximately 12-15 C/W with a JEDEC-compliant 4-layer test board (per typical Altera thermal models). At 2W dissipation and 70C ambient, junction temperature reaches roughly 100-105C, within the 100C industrial limit but with little margin. Design with thermal vias under the central BGA balls and provide airflow, or derate utilization to keep junction below 90C for long-term reliability. Use the Altera thermal-resistance table for your specific board design rather than relying on the JEDEC value.
규정 준수 정보
RoHS compliant per Altera/Intel product page. Industrial I7 temperature grade exceeds AEC-Q100 grade-3 expectations but the part is not formally AEC-Q100 qualified; consult Intel for ASIL-targeted variants. Lead-free (Pb-free) finish on BGA balls confirmed.
