5CGXBC9C7F23C8N - Cyclone V GX FPGA, 301K LE, 484-FBGA | Intel
부품 번호: 5CGXBC9C7F23C8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $82.18 | $82.18 |
| 10 | $76.4 | $764.00 |
| 100 | $68.95 | $6,895.00 |
| 500 | $61.2 | $30,600.00 |
| 1,000 | $54.8 | $54,800.00 |
5CGXBC9C7F23C8N 개요
What is a Cyclone V GX FPGA? The Cyclone V GX is Intel's (formerly Altera's) low-power, mid-density FPGA family targeting cost-optimized designs that require integrated transceivers. Within the broader taxonomy, it sits as: FPGA -> programmable logic device -> semiconductor IC -> logic. The 'GX' variant adds up to 12 integrated 3.125 Gbps multi-gigabit transceivers, distinguishing it from the E (enhanced logic/memory) and GT (transceiver-equipped) family siblings. Compared with discrete logic or ASIC implementations, the Cyclone V GX delivers ASIC-like unit economics at NRE cost zero, with the flexibility of in-system reprogrammability for evolving interface standards.
Key features include 9.4 Mbits of embedded SRAM (MLAB + M20K blocks), 156 18x19 multipliers, 4 PLLs, and a hard PCI Express Gen2 x4 controller. The device also embeds two hard memory controllers supporting DDR3, DDR2, and LPDDR2 interfaces, eliminating soft-IP overhead for common memory subsystems.
Architecturally, the 5CGXBC9 uses an Adaptive Logic Module (ALM) of 8-input fracturable look-up tables combined with variable-precision DSP blocks, achieving up to 133 GMACs of fixed-point throughput while drawing as little as 1.05W typical quiescent power. The integrated 3.125 Gbps transceivers consume approximately 100 mW per channel at full utilization, enabling single-chip connectivity for protocols such as PCIe Gen2, Gigabit Ethernet, CPRI, and JESD204B.
Typical applications include industrial motor control and machine vision, low-cost PCIe endpoint cards, broadband access equipment (PON/ONT), broadcast video processing, and software-defined radio front-ends. The combination of transceivers, DSP blocks, and DDR3 controllers also makes it suitable for low-latency packet processing and embedded vision pipelines in factory automation.
When designing with this part, ensure the FBGA-484 footprint includes 0.4 mm solder-ball pitch, microvia-compatible PCB stack-up, and matched-length routing for transceiver channels. The core 1.1V supply must ramp within the datasheet's monotonic power-sequencing window; use a sequencer IC if your system shares rails with other large devices.
This page synthesizes distributor pricing, drop-in package-compatible Cyclone V GX alternatives, and practical design considerations not consolidated in the manufacturer datasheet, giving engineers a single decision-ready reference.
드롭인 대체품: 5CGXBC9C7F23C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CGXBC9C7F23C8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Transceivers, Family, Embedded Memory Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CGXBC9C7F23C7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CGXBC9C6F23C7N
✅ 드롭인✓ 재고 있음
$334.2 / 개
데이터시트 보기 →5CGXBC7C7F23C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$29.7 / 개
데이터시트 보기 →5CGXBC7D7F27C8N
✅ 드롭인✓ 재고 있음
$228.5 / 개
데이터시트 보기 →5CGXBC9C7F23C8N 최대 정격 & 전기적 특성
| Family | Cyclone V GX |
| Logic Elements (LE) | 301,000 |
| Embedded Memory Bits | 14,251,008 (9.4 Mbit) |
| User I/O Pins | 224 |
| 패키지 | 484-ball FBGA (F23, 23x23 mm, 1.0 mm pitch) |
| Core Voltage | 1.1 V |
| Process Technology | 28 nm TSMC low-power |
| 동작 온도 | 0 C to +85 C (commercial, 'C' speed grade) |
| Speed Grade | 8 (C8) |
| Hard Memory Controllers | 2 (DDR3, DDR2, LPDDR2) |
| PLLs | 4 |
| Embedded Multipliers (18x19) | 156 |
| Transceivers | Up to 9 channels, 3.125 Gbps |
| PCIe Hard IP | Gen2 x4 (1 hard IP block) |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 (168 hours) |
| RoHS 상태 | Compliant (Pb-free) |
5CGXBC9C7F23C8N 484-ball fbga (f23, 23x23 mm, 1.0 mm pitch) 핀 구성 가이드
5CGXBC9C7F23C8N(484-ball fbga (f23, 23x23 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CGXBC9C7F23C8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CGXBC9C7F23C8N 적합 용도: 6 애플리케이션s: Industrial Motor Control and Drive, PCIe Endpoint Expansion Cards, Broadcast Video Processing, Broadband Access - PON / ONT Optical Line Termination, Software Defined Radio Front-End, Machine Vision and Industrial Camera Processing.
Industrial Motor Control and Drive
The 5CGXBC9C7F23C8N is well suited to industrial motor control and AC drive designs, where its 156 embedded 18x19 multipliers execute field-oriented control (FOC) algorithms at switching frequencies up to 100 kHz with deterministic latency. The hard DDR3 memory controllers connect to external SDRAM for control-loop data logging and vibration FFT analysis, while the 224 user I/Os accommodate multiple incremental encoder, resolver, and isolated gate-driver interfaces in a single chip. At roughly 4.5 W total board power with 6 active transceivers, the part delivers adequate thermal margin for sealed IP65 enclosures when paired with a 10x10 mm copper pour. Engineers typically combine it with TI TMS320F28379 or Infineon XMC4000 MCUs in dual-processor architectures for safety-critical SIL2/SIL3 drive designs.
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PCIe Endpoint Expansion Cards
The integrated hard PCIe Gen2 x4 controller makes the 5CGXBC9C7F23C8N ideal for low-cost PCIe endpoint cards such as data-acquisition, software-radio, and machine-vision frame-grabber boards. The hard IP eliminates soft-IP timing closure risk and saves approximately 15K logic elements versus an equivalent soft implementation, freeing fabric for user DSP and buffer logic. The 9 integrated 3.125 Gbps transceivers support auxiliary SATA, GbE, or CPRI links on the same card, consolidating functions previously requiring a separate PHY chip. PCIe Gen2 x4 delivers 16 Gbps of payload bandwidth, sufficient for 4K video capture at 60 fps or multi-channel RF digitizer streaming to host memory.
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Broadcast Video Processing
The 5CGXBC9C7F23C8N handles broadcast video workloads including SD/HD/3G-SDI bridging, HDR/WCG color-space conversion, and multi-channel video mixing. Its 156 DSP blocks perform 4K60 video scaling at approximately 600 MHz of fabric clock, while the 9.4 Mbit embedded SRAM buffers active scan-line data without external memory. Integrated transceivers drive 3G-SDI SMPTE 424M outputs up to 2.97 Gbps per channel without external serializer PHYs. The commercial temperature range and 28 nm low-power process suit fanless broadcast equipment racks where ambient intake can reach 45 C during summer operation.
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Broadband Access - PON / ONT Optical Line Termination
Passive Optical Network (PON) Optical Line Terminal (OLT) line cards and high-end Optical Network Terminals (ONT) use the 5CGXBC9C7F23C8N to combine 1G/10G EPON or XG-PON SerDes, queue management, and upstream Ethernet aggregation in one device. The 3.125 Gbps transceivers connect directly to SFP+ optics for 10G uplink or to BPON/GPON burst-mode transceivers, removing external PHY cost. The hard DDR3 controller with ECC support implements 4 MB packet buffer per channel for traffic shaping and congestion management, while 301K logic elements sustain up to 16K subscriber flows with hierarchical QoS. Designers typically run Linux on a hard ARM core, but the Cyclone V here acts as the network processor paired with a host SoC.
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Software Defined Radio Front-End
The 5CGXBC9C7F23C8N serves as a digital front-end in software defined radio (SDR) systems performing channelization, digital down-conversion (DDC), and packet formation between high-speed ADCs/DACs and the host processor. Its 156 18x19 multipliers run 4-channel DDC at 200 MSPS with 80 dB SFDR, while 9.4 Mbit embedded SRAM stores filter coefficients and intermediate samples. The 3.125 Gbps transceivers link to JESD204B-compliant ADC/DAC pairs such as AD9680 or AD9144, providing a deterministic multi-gigabit sample interface that scales to 4 channels without external bridge chips. A typical design pairs this FPGA with a Linux SoC for protocol stack processing.
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Machine Vision and Industrial Camera Processing
Industrial machine-vision cameras and frame-grabbers use the 5CGXBC9C7F23C8N for image preprocessing, defect detection, and protocol bridging between MIPI CSI-2 or GigE Vision sensors and host PCs. The DSP blocks implement 5x5 convolution kernels at full HD 60 fps, while embedded SRAM holds line buffers for Sobel, Laplacian, and Canny edge detection in real time. The PCIe hard IP enables low-latency sub-frame delivery to host applications, and 3.125 Gbps transceivers drive GigE Vision POE+ uplinks without external PHY. Fanless camera enclosures benefit from the 28 nm low-power process, holding junction temperature below 95 C at ambient 60 C with a minimal copper heatsink.
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추천 제품 요약
엔지니어링 참조 데이터: 5CGXBC9C7F23C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CGXBC9C7F23C7N | 5CGXBC9C6F23C7N | 5CGXBC7C7F23C8N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F23, 23x23 mm) | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same |
| Logic Elements | 301,000 | 301,000 | 301,000 | 149,500 |
| Embedded Memory | 14,251,008 bits (9.4 Mbit) | 14,251,008 bits | 14,251,008 bits | 7,024,640 bits (4.5 Mbit) |
| User I/O | 224 | 224 | 224 | 224 |
| Speed Grade | C8 | C7 (faster) | C7 (faster) | C8 |
| Transceivers | 9 ch, 3.125 Gbps | 9 ch, 3.125 Gbps | 9 ch, 3.125 Gbps | 9 ch, 3.125 Gbps |
| PCIe Hard IP | Gen2 x4 | Gen2 x4 | Gen2 x4 | Gen2 x4 |
주요 차별점
- Higher logic density in same footprint than 5CGXBC7 family (vs 5CGXBC7C7F23C8N)
- Speed grade 8 vs grade 7 trade-off (vs 5CGXBC9C7F23C7N)
- Integrated hard PCIe Gen2 x4 controller (vs Lattice ECP5 LFE150)
설계 노트
The 484-ball F23 FBGA package uses 1.0 mm ball pitch in a 22x22 array with center balls, requiring a microvia-compatible PCB stack-up (e.g., 8-layer 1-6-1 HDI). Use NSMD (non-solder mask defined) pads with 0.5 mm diameter for reliable assembly. Match transceiver channel lengths to within 0.13 mm (5 mil) for 3.125 Gbps operation; use length-matched serpentine routing on the top microvia layer to control skew.
Estimated: at typical 50% utilization with 6 active transceivers and DDR3 interface, total board power reaches approximately 4.5-6 W, and theta_JA for the F23 package is around 14 C/W (with 4-layer JEDEC test board, no airflow). Without airflow at 85 C ambient, junction rises to roughly 150-170 C. Add a 15x15 mm bottom-side copper pour and 200 LFM of forced air for industrial designs above 3 W dissipation.
The Cyclone V GX requires seven distinct power rails: VCC (1.1V core), VCCPT (1.1V or 1.2V PLL), VCCAUX (2.5V), VCCAUX_RX/TX (2.5V transceiver analog), VCCR/VCCT (1.1V transceiver), VCCIO (per-bank, 1.2V-3.3V), and VCCPD (2.5V or 3.0V). Use a dedicated sequencer IC such as LM3880 or TI TPS65086 to enforce monotonic power-up within the datasheet's 200 ms window; reverse rail sequencing can permanently damage the device.
Three common mistakes cause first-prototype failures: (1) configuring unused transceiver channels as high-Z without enabling internal bias - leave them at default termination; (2) omitting VREF pins on banks used for DDR3 - these must be driven by external precision resistors; (3) relying on GPIO during configuration without proper INIT_DONE handshake - this can cause JTAG scan-chain misidentification after POR.
규정 준수 정보
RoHS compliant per Intel product page; lead-free finish indicated by 'N' suffix. Not AEC-Q100 qualified - use industrial temperature variants for harsh environments.
