5CGXBC9C6F23C7N - Cyclone V GX FPGA, 301K LE, 484-FBGA | Intel
MPN: 5CGXBC9C6F23C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $512.3 | $512.30 |
| 10 | $478.1 | $4,781.00 |
| 100 | $421.5 | $42,150.00 |
| 500 | $372.8 | $186,400.00 |
| 1,000 | $334.2 | $334,200.00 |
Drop-in alternatives for 5CGXBC9C6F23C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CGXBC9C6F23C8N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
5CGXBC9C6F23I7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
5CGXBC9C7F23C7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
5CGXBC9A7U19C8N
✅ Drop-In✓ In Stock
$219.75 / Unit
View Datasheet →5CGXBC7C6F23C7N
✅ Drop-In✓ In Stock
$154.9 / Unit
View Datasheet →5CGXFC7C6F23C7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
5CGXBC9C6F23C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V GX |
| Series | 5CGXBC9 (9-series, 6 transceivers) |
| Logic Elements | 301,000 |
| Embedded Memory | 13,917 Kbit |
| Number of GPIO | 224 |
| Number of Transceivers | 6 |
| Transceiver Data Rate | 3.125 Gbps |
| Core Supply Voltage | 1.13 V (typ) |
| Process Technology | TSMC 28 nm low-power |
| Maximum Operating Frequency | 800 MHz |
| Package | 484-ball FBGA (F23, 23x23 mm) |
| Operating Temperature | 0 °C to +85 °C (commercial, suffix 7) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Tape & Reel Quantity | 60 (per FindIC) |
| Memory Type | SRAM-based configuration |
5CGXBC9C6F23C7N 484-ball fbga (f23, 23x23 mm) Pin Configuration Guide
Complete pinout information for 5CGXBC9C6F23C7N (484-ball fbga (f23, 23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CGXBC9C6F23C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CGXBC9C6F23C7N is suitable for 6 applications: Industrial Machine Vision, Video Surveillance NVR/DVR, Wireless Small-Cell Backhaul, Industrial Motor Control Drives, PCIe Endpoint Add-In Cards, Broadcast Video Processing.
Industrial Machine Vision
The 5CGXBC9C6F23C7N fits industrial machine vision pipelines where its 301K logic elements host real-time image preprocessing (debayering, color correction, edge detection) and its six 3.125 Gbps transceivers drive MIPI-CSI-2 to GigE Vision bridge conversion. With 13,917 Kbit embedded memory, frame buffers fit on-chip without external SRAM, reducing BOM cost and latency. The 484-FBGA footprint dissipates up to 5W at 100% utilization; design with at least 4 signal layers and a 60 mm x 60 mm copper pour beneath the BGA to keep junction below 85 °C.
Recommended
Video Surveillance NVR/DVR
For multi-channel HD/4K video recording, the 5CGXBC9C6F23C7N delivers H.264/H.265 transcode acceleration across 224 GPIO handling camera inputs plus the six transceivers driving SATA III storage links at 6 Gbps. Compared to the GT variant, this GX part saves cost while still supporting SATA PHY directly. With PCIe Gen2 hard IP, the device also serves as a downstream endpoint to an application processor SoC via x4 link. Use Intel's Video and Image Processing (VIP) Suite IP cores to achieve 4K@30 fps decode in roughly 50% of the 301K LE.
Recommended
Wireless Small-Cell Backhaul
The 5CGXBC9C6F23C7N integrates six 3.125 Gbps transceivers that natively drive CPRI, OBSAI, and Serial RapidIO for small-cell radio units, eliminating an external PHY and reducing board area by approximately 30%. At 301K LE, the device can host PHY layer baseband functions plus up to two LTE 20 MHz carriers. The 28 nm low-power process keeps total power around 3-4W typical, suitable for fanless outdoor enclosures. Use the device's hard PCIe Gen2 IP for the backhaul SGMII-to-SoC link.
Recommended
Industrial Motor Control Drives
The 5CGXBC9C6F23C7N's 224 GPIO connect to industrial field buses (EtherCAT, PROFINET) plus resolver/PWM motor control channels, while its 6 transceivers drive RS-485/RS-232 isolation stages. With 13,917 Kbit embedded memory and 800 MHz DSP blocks, the device implements field-oriented control (FOC) loops in under 4 µs latency for industrial drives up to 50 kW. The -40 to +85 °C commercial range suits cabinet-mounted installations. For outdoor or extreme-temp installations, choose the 5CGXBC9C6F23I7N variant.
Recommended
PCIe Endpoint Add-In Cards
The integrated PCIe Gen2 hard IP block makes the 5CGXBC9C6F23C7N an ideal endpoint controller for instrumentation and data acquisition cards, delivering up to 5 Gbps per lane over x4 links. The 301K LE host custom protocol logic, data path FIFO buffers (13,917 Kbit), and DMA engines without consuming soft logic. Combined with six transceivers, one design can host PCIe plus dual 10 GbE KR signalling on the same silicon, reducing PCB layer count from 10 to 8.
Recommended
Broadcast Video Processing
Broadcast studios use the 5CGXBC9C6F23C7N for SDI-to-IP gateway conversion where the six transceivers drive SMPTE 2022-6/2110 IP packets at 3 Gbps SDI rates without external PHY. The 224 GPIO connect to HDMI, DisplayPort, and audio codec companion chips. With 301K LE, multiple 1080p60 video channels are processed concurrently with under 100 µs latency. The 28 nm low-power process suits fanless rack-mount units. The 484-FBGA thermal dissipation is suitable for 1U chassis with linear airflow.
Recommended
Recommended Products Summary
Engineering reference data for 5CGXBC9C6F23C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CGXBC9C6F23C8N | 5CGXBC9C6F23I7N | 5CGXBC9A7U19C8N | 5CGXBC7C6F23C7N | 5CGXFC7C6F23C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F23, 23x23 mm) | 484-FBGA (F23, 23x23 mm) - same | 484-FBGA (F23, 23x23 mm) - same | 484-UBGA (U19, 19x19 mm) - smaller | 484-FBGA (F23, 23x23 mm) - same | 484-FBGA (F23, 23x23 mm) - same |
| Logic Elements | 301,000 | 301,000 (same die) | 301,000 (same die) | 301,000 (same die) | 149,500 (-50%) | 149,500 (-50%) |
| Transceivers | 6 x 3.125 Gbps | 6 x 3.125 Gbps (same) | 6 x 3.125 Gbps (same) | 6 x 3.125 Gbps (same) | 6 x 3.125 Gbps (same) | 6 x 3.125 Gbps (same) |
| Embedded Memory | 13,917 Kbit | 13,917 Kbit (same) | 13,917 Kbit (same) | 13,917 Kbit (same) | 7,860 Kbit (-43%) | 7,860 Kbit (-43%) |
| GPIO | 224 | 224 (same) | 224 (same) | 224 (same) | 224 (same) | 224 (same) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| Speed Grade | C7 | C8 (faster) | C7 | C8 | C7 | C7 |
| Hardened PCIe Gen2 | Yes | Yes | Yes | Yes | Yes | Yes |
| Estimated Unit Price (qty-1000) | $334.20 | $420-$460 | $410-$450 | $390-$430 | $135-$155 | $170-$195 |
Key Differentiators
- Highest density (301K LE) at 3.125 Gbps in a single F23 484-FBGA package (vs 5CGXBC7C6F23C7N)
- Commercial temperature variant for cost-sensitive indoor applications (vs 5CGXBC9C6F23I7N)
- Hardened PCIe Gen2 IP block eliminates soft-logic consumption (vs Cyclone V E family (no transceivers, no PCIe IP))
- 28 nm TSMC low-power process yields ~40% lower power vs prior Cyclone IV (vs Cyclone IV E/GX family)
Design Notes
Estimated: At 100% utilization with all six transceivers active at 3.125 Gbps, the 5CGXBC9C6F23C7N draws approximately 3.5-4.5W from the 1.13 V core rail. Use a switching regulator with at least 5 A peak current capability and a ferrite bead network at the BGA. Decoupling: at least twenty 0.1 µF 0402 X7R ceramic capacitors on the bottom side of the BGA, four 4.7 µF bulk capacitors within 25 mm, and one 220 µF polymer tantalum bulk capacitor at the regulator output. Refer to Intel's Cyclone V Device Handbook, Volume 1, Power Distribution Network Design Guidelines chapter.
The 484-FBGA with 1.0 mm ball pitch requires 6 PCB layers minimum for escape routing (top signal / GND / inner signals / VCC_1V13 / GND / bottom signal). Via-in-pad with 0.5 mm laser drill and filled-capped via process is strongly recommended for BGA balls B1-B19 (top row) to route out differential transceiver pairs. Use a 50 Ω controlled-impedance stack-up with 0.20 mm dielectric (Er ~3.8) between top signal and GND. Place 0402 series resistors for transceiver TX on the second signal layer, never as stubs. Refer to Intel AN 528: Cyclone V PCB Design Guidelines.
Estimated: At 4W total power dissipation and 23x23 mm FBGA package, the junction-to-ambient thermal resistance (θ_JA) is approximately 12 °C/W with a 4-layer FR-4 PCB and still air, giving a 48 °C temperature rise above ambient. For commercial 0-85 °C operation, ambient is limited to approximately 37 °C at 4W. To achieve the full 85 °C ambient rating, place a 50 mm x 50 mm x 8 mm aluminum heatsink with thermal interface material (TIM) above the BGA. For sealed enclosures, specify at least 1 m/s of forced airflow.
Each of the six transceivers requires matched-length differential routing within 0.127 mm (5 mil) intra-pair and 6.4 mm inter-pair for 3.125 Gbps operation. Maintain 100 Ω differential impedance with 0.20 mm trace/space on the top layer. Keep the transceiver lane AC-coupling capacitors (0.1 µF 0201 X7R) within 12.7 mm of the BGA ball. Series termination is internal to the FPGA; do not add external resistors in series. Verify signal integrity with a 3D EM solver for the chosen stack-up. Refer to Intel's Cyclone V GX Transceiver User Guide.
Do not assume all 224 GPIO are simultaneously usable: the C7 commercial variant typically supports 184-200 GPIO after subtracting transceiver lane balls and configuration pins. Always cross-check pin assignments against the latest Quartus pin planner file. The JTAG pins (TCK, TMS, TDI, TDO) require external 4.7 kΩ pull-down resistors on TCK and TMS and 4.7 kΩ pull-up on TDI. For the MSEL configuration pins, install a 10 kΩ resistor network per Intel's configuration scheme selection table to avoid mid-level voltages during power-up. Refer to Intel AN 472: Configuration Hardware Design Guidelines.
Compliance Information
RoHS and REACH compliant per Intel/Altera product page. Not AEC-Q100 qualified - this is a commercial-grade FPGA. For automotive applications, consider Cyclone V automotive grade variants (e.g., 5CGXBC9E6F27C7N) qualified to AEC-Q100.
