10M50DAF256C8G - MAX 10 FPGA 50K LE 256-FBGA | Intel
부품 번호: 10M50DAF256C8G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $72.5 | $72.50 |
| 10 | $65.2 | $652.00 |
| 100 | $58.1 | $5,810.00 |
| 500 | $52.4 | $26,200.00 |
| 1,000 | $47.85 | $47,850.00 |
10M50DAF256C8G 개요
MAX 10 FPGAs are low-cost, non-volatile PLDs that integrate the optimal set of system components typically found around an FPGA. They embed flash configuration memory, a hardened ADC block, dual-configuration flash, and instant-on support on a single die, eliminating the need for an external boot PROM. Architecturally, MAX 10 belongs to the programmable logic hierarchy (FPGA -> programmable logic device -> logic IC -> integrated circuit) and is positioned as a bridge between small CPLDs and higher-density Cyclone devices.
Key features include 50 K logic elements (LEs), 1,677 Kb (bits) of user flash, 312 18x18 multipliers, a 12-bit 1 MSPS ADC, on-chip temperature sensing, and integrated PLL blocks. The 256-FBGA (F256) package supports industrial temperature grades (the C8G speed/temperature code denotes commercial 8 ns timing) and exposes LVDS, LVTTL, and LVCMOS I/O standards. Internal configuration is achieved via embedded flash, giving instant-on behavior with no external boot device.
Typical applications include industrial I/O expansion and bridging, motor control and drive interfacing, video processing pipelines, low-cost prototyping for ASIC replacement, and I/O-aggregation in factory automation modules. The integrated ADC is well suited to sensor fusion and analog front-end monitoring on a single board, while the embedded flash enables remote firmware updates with no external memory.
When designing with the 10M50DAF256C8G, follow Intel PCB layout guidelines for the F256 package: route decoupling capacitors as close to each power pin pair as possible, provide a continuous ground plane beneath the BGA, and use at least 6 PCB layers with stitched ground vias for signal integrity. Designers should also plan thermal management; the F256 package has a moderate junction-to-ambient thermal resistance and may require airflow for high-utilization designs.
This page synthesizes distributor pricing (as of 2026-09-05), same-package drop-in alternatives within the MAX 10 family, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: 10M50DAF256C8G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M50DAF256C8G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Temperature Grade, PLLs.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M50DAF256I7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$155.2 / 개
데이터시트 보기 →10M50DAF256C7G
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10M50DAF256I8G
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10M50DCF256C8G
✅ 드롭인✓ 재고 있음
$52.85 / 개
데이터시트 보기 →10M50DCF256C7G
✅ 드롭인✓ 재고 있음
$98 / 개
데이터시트 보기 →10M40DAF256C8G
✅ 드롭인✓ 재고 있음
$55.2 / 개
데이터시트 보기 →10M25DAF256C8G
✅ 드롭인✓ 재고 있음
$45.3 / 개
데이터시트 보기 →10M50DAF256A7G
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10M50DAF256C8G 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements | 49,760 (50K) |
| Embedded Memory (bits) | 1,677,312 |
| User Flash (bits) | 1,677,312 |
| Maximum User I/Os | 178 |
| Multipliers (18x18) | 312 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| On-chip ADC | 12-bit, 1 MSPS, single or dual supply |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Configuration | Internal flash (non-volatile, instant-on) |
| Speed Grade | C8 (8 ns) |
| Temperature Grade | Commercial (0C to +85C) |
| 패키지 | 256-ball FBGA (F256) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-20) |
10M50DAF256C8G 256-ball fbga (f256) 핀 구성 가이드
10M50DAF256C8G(256-ball fbga (f256) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M50DAF256C8G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M50DAF256C8G 적합 용도: 6 애플리케이션s: Industrial I/O Expansion and Bridging, Multi-Axis Motor Control (FOC Servo Drives), Video Format Conversion and Processing, Low-Cost ASIC Replacement / Prototyping, Sensor Fusion and Data Acquisition Front-Ends, Industrial IoT Gateway and Edge Computing.
Industrial I/O Expansion and Bridging
The 10M50DAF256C8G provides 178 user I/Os and 50K LEs for protocol bridging between industrial fieldbus standards (EtherCAT, PROFINET, Modbus TCP, RS-485, CAN) and modern Ethernet-based controllers. Its non-volatile instant-on configuration eliminates external boot PROMs, and the embedded 12-bit ADC digitizes analog sensor inputs (4-20 mA, 0-10 V, thermocouples) without an external ADC IC. Designers place the FPGA between a processor's SPI/UART and the fieldbus transceivers, using hardware multipliers for fast CRC checksums and PLLs to synthesize precise baud rates. The 50K LE budget supports 8-16 simultaneous protocol stacks in firmware, sufficient for typical PLC expansion modules.
추천
Multi-Axis Motor Control (FOC Servo Drives)
The 10M50DAF256C8G drives up to 78 PID-based field-oriented-control (FOC) loops with 18-bit multipliers, supporting multi-axis servo drives under 10 kW per axis. Hardware PLLs synthesize precise 10-50 kHz PWM switching frequencies with sub-100ns resolution, while the on-chip 12-bit 1 MSPS ADC samples two phase currents plus DC-bus voltage per axis. The 50K LE budget lets engineers implement space-vector PWM, sine filtering, encoder decoding, and safety-watchdog logic in a single chip, replacing a DSP+ASIC combination. Intel publishes reference designs in AN 624 and AN 738 demonstrating MAX 10 in FOC motor control.
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Video Format Conversion and Processing
The 10M50DAF256C8G handles real-time video format conversion (RGB to LVDS, parallel-CMOS to MIPI bridge, VGA to HDMI preprocessing) with 178 I/Os supporting 24-bit parallel video buses plus control channels. Hardware multipliers enable pixel-level color correction, gamma, and chroma resampling in a single pass at 60 Hz 1080p. Embedded SRAM (1.67 Mb) acts as a multi-line frame buffer for deinterlacing and noise reduction. Compared to a discrete scaler IC, the FPGA gives flexibility to switch protocols via firmware, which is valuable in broadcast and pro-AV equipment where multiple input standards must be supported.
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Low-Cost ASIC Replacement / Prototyping
The 10M50DAF256C8G serves as a low-NRE ASIC replacement for production volumes under 50K units/year, especially in industrial and medical designs where ASIC mask charges exceed USD 500K. With 50K LEs, 1.67 Mb SRAM, embedded flash, and an on-chip ADC, designers can implement glue logic, state machines, custom peripherals, and analog front-ends in one device. Once volume justifies mask costs, the same Quartus Prime RTL can be re-targeted to a structured-ASIC or Cyclone family, preserving firmware investment.
추천
Sensor Fusion and Data Acquisition Front-Ends
The 10M50DAF256C8G combines an on-chip 12-bit 1 MSPS ADC, 178 I/Os, and 50K LEs to form a complete sensor-fusion front-end for industrial condition monitoring and multi-channel DAQ systems. Up to 16 analog channels can be time-multiplexed into the internal ADC while digital sensors stream via SPI/I2C. Hardware DSP blocks implement FFT-based vibration analysis, statistical filtering, and threshold detection. Embedded flash stores calibration coefficients and threshold tables, and instant-on behavior lets the system boot and report first readings within 50 ms of power-up.
추천
Industrial IoT Gateway and Edge Computing
The 10M50DAF256C8G operates as an edge-compute front-end for IIoT gateways: 50K LEs handle protocol parsing (MQTT, OPC-UA, CoAP), local decision logic, and pre-processing of sensor data before forwarding to a host CPU. Hardware multipliers accelerate AES-128 and SHA-256 for secure MQTT connections, while embedded flash stores credentials and configuration. With 178 I/Os the FPGA can interface directly to RS-485, RS-232, CAN, and SPI peripherals without external logic. Industrial -40C to +100C variants (10M50DAF256I7G) are drop-in compatible for harsh-environment deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M50DAF256C8G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M50DAF256I7G | 10M50DAF256C7G | 10M50DAF256I8G | 10M50DCF256C8G | 10M50DCF256C7G | 10M40DAF256C8G | 10M25DAF256C8G | 10M50DAF256A7G |
|---|---|---|---|---|---|---|---|---|---|
| Package | 256-ball FBGA (F256) | 256-ball FBGA (F256) | 256-ball FBGA (F256) | 256-ball FBGA (F256) | 256-ball FBGA (F256) | 256-ball FBGA (F256) | 256-ball FBGA (F256) | 256-ball FBGA (F256) | 256-ball FBGA (F256) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 49,760 | 49,760 | 49,760 | 49,760 | 49,760 | 49,760 | 39,600 (40K) | 24,640 (25K) | 49,760 |
| Embedded Memory (bits) | 1,677,312 | 1,677,312 | 1,677,312 | 1,677,312 | 1,259,520 | 823,296 | 1,677,312 | ||
| Speed Grade | C8 | I7 | C7 (faster) | I8 | C8 | C7 (faster) | C8 | C8 | A7 (automotive) |
| Temperature Grade | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Automotive -40C to +125C | ||||
| Supply Variant | Single-supply (A) | Single-supply (A) | Dual-supply (D) | Dual-supply (D) | Single-supply (A) | ||||
| Maximum User I/Os | 178 | 178 | 178 | 178 | 178 | 178 | 178 |
주요 차별점
- Non-volatile configuration eliminates external boot PROM (vs 10M40DAF256C8G (also non-volatile))
- On-chip 12-bit ADC for analog front-end integration (vs 10M25DAF256C8G (also has ADC))
- Commercial C8 speed grade balances cost and performance (vs 10M50DAF256C7G (C7 speed grade))
- 178 user I/Os in compact F256 footprint (vs 10M50DAF484C8G (F484 package))
- Wide commercial-to-industrial drop-in family (vs Single-temperature competitor FPGAs)
설계 노트
Route all power pins of the F256 package through short, wide traces fed by 0.1 uF decoupling capacitors placed within 3 mm of each power-ball pair. Add bulk 10 uF-100 uF tantalum or ceramic capacitors adjacent to each power rail (1.2 V core, 2.5 V analog, I/O bank supplies). Use a continuous ground plane on the layer directly beneath the BGA to provide a low-impedance return path; stitch ground vias around and through the BGA escape pattern for signal integrity.
The F256 FBGA package has a theta_JA in the 25-30 C/W range with proper PCB layout (six-layer board with internal ground plane). Estimated: at 25% logic utilization with 312 active multipliers, the die dissipates approximately 0.7 W to 1.0 W, giving a junction temperature rise of 18-30 C above ambient. For high-utilization designs exceeding 60% LE and 75% multiplier occupancy, plan for forced-air cooling or a thermal-spreader PCB design. Always refer to the MAX 10 device thermal model AN for accurate simulation.
LVDS and high-speed DDR interfaces require matched-length routing with 100 ohm differential impedance. Keep BGA escape traces on the top layer for the first 5 mm, then transition to internal stripline layers. Series-termination resistors on LVCMOS outputs used above 100 MHz should be placed within 8 mm of the FPGA pin. The MAX 10 device handbook AN 692 provides IBIS models for Quartus Prime signal-integrity simulation.
Do not leave any MAX 10 power pin floating - even unused I/O bank supplies must be tied to a valid voltage for proper power-on-reset sequencing. The internal flash programming voltage (VCCIO7 for some banks) must be set to 1.8 V during configuration; mis-configuring it locks the device from JTAG access. Always run Quartus Prime pin-planner validation before generating the programming file, and use the 'Verify Pin-Out' check before downloading.
Place the JTAG header within 50 mm of the FPGA and route TDI, TDO, TMS, TCK as a length-matched group with 4.7 kΩ pull-ups on TCK/TMS and a 4.7 kΩ pull-up on TDI. Place a 4.7 kΩ pull-up on nCONFIG to ensure clean re-configuration after power-up. Reserve space for a status-LED connected to a CONFIG_DONE or USER_LED pin for visual bring-up diagnostics during board bring-up.
규정 준수 정보
RoHS and REACH compliance per DigiKey/Mouser product listings. AEC-Q100 qualification is NOT available on the 10M50DAF256C8G (commercial temperature only); choose 10M50DAF256A7G for AEC-Q automotive applications. Lead-free (Pb-free) finish confirmed. Halogen-free status not specified in the verified data.
