A3P030-2QNG68I - ProASIC3 Flash FPGA 30K Gates | Microchip
부품 번호: A3P030-2QNG68I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
A3P030-2QNG68I 개요
A flash-based FPGA is a type of field-programmable gate array that stores its configuration in on-chip flash memory cells rather than volatile SRAM. This places the ProASIC3 family in the broader hierarchy of programmable logic: FPGA -> programmable logic device -> digital IC -> semiconductor. Because configuration is non-volatile, the device powers up instantly without an external configuration PROM or boot controller, making it a single-chip solution for space-constrained systems.
Key features include 330 logic elements (LEs), flash-based LiveField reprogrammability, single-supply 1.5V core operation, small-footprint VFQFN packaging, and optional soft ARM support as noted in the ProASIC3 family datasheet. The ultra-low-density class of the device targets glue logic, control-plane functions, and power-up sequencing tasks that previously used CPLDs or discrete logic.
Technically, the A3P030 uses Actel's proprietary flash switch technology, which combines the non-volatility of antifuse devices with the reprogrammability of SRAM FPGAs. The 130nm process yields low static power, and the exposed-pad QFN provides good thermal and ground performance for a small 8x8 mm-class footprint.
Typical applications include industrial automation control, portable and battery-powered instruments, bridge logic between processors and peripherals, power sequencing controllers, and secure single-chip logic where bitstream volatility would be a liability.
A key design consideration is I/O budget: with only 49 user I/Os available in the 68-pin package, pin mapping should be validated early in Libero SoC before routing commitment.
This page synthesizes distributor availability, drop-in family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: A3P030-2QNG68I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P030-2QNG68I (동일 폼 팩터 및 풋프린트) — 차이점: Configuration Memory, Family, Speed Grade, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P030-QNG68I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P030-1QNG68I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
A3P030L-2QNG68I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
A3P030-2QNG68I 최대 정격 & 전기적 특성
| Family | ProASIC3 Flash FPGA |
| System Gates | 30000 |
| Logic Elements (LEs) | 330 |
| User I/O | 49 |
| Maximum System Frequency | 310 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash |
| Speed Grade | 2 |
| Temperature Grade | Industrial (I) |
| Configuration Memory | On-chip Flash (non-volatile) |
| 패키지 | 68-VFQFN Exposed Pad |
| 실장 유형 | Surface Mount |
| Soft ARM Support | Optional (per family datasheet) |
| RoHS 상태 | RoHS Compliant |
| Lead Free Status | Lead Free |
A3P030-2QNG68I 68-vfqfn exposed pad 핀 구성 가이드
A3P030-2QNG68I(68-vfqfn exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P030-2QNG68I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P030-2QNG68I 적합 용도: 6 애플리케이션s: Industrial Automation Control, Glue Logic and Bus Bridging, Power Sequencing and Housekeeping, Portable and Battery-Powered Instruments, Secure Single-Chip Logic, Processor Companion and Reset Control.
Industrial Automation Control
The A3P030-2QNG68I fits industrial control nodes that need deterministic, instant-on logic without external configuration storage. With 330 logic elements and 49 user I/Os at up to 310 MHz, it handles sensor polling, handshake logic, and simple state machines between PLC modules and field devices. The industrial (I) temperature rating supports factory-floor ambient conditions, and the 1.5V flash core keeps static power low in always-on cabinets. Because configuration is non-volatile, equipment restarts are immediate after power interruption - critical in automation where boot delays from SRAM FPGA configuration chains are unacceptable. Implement the design in Microchip Libero SoC and reuse the 68-QFN footprint across product variants.
추천
Glue Logic and Bus Bridging
Bridging dissimilar buses - for example a microcontroller bus to legacy peripheral interfaces - is a classic use for the A3P030-2QNG68I. Its 49 user I/Os and 330 LEs implement address decoding, wait-state generation, level-aware handshake, and parallel-to-serial conversion in a single 68-VFQFN chip, replacing dozens of 74-series parts. Flash configuration means the bridge is active at power-up, so a host CPU can enumerate peripherals without waiting for a configuration controller. Speed grade 2 timing supports typical 310 MHz-class internal fabric operation, far exceeding legacy bus speeds. Exposed-pad QFN grounding keeps I/O switching noise controlled on mixed-signal boards.
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Power Sequencing and Housekeeping
Multi-rail systems need controlled power-up ordering, voltage monitoring, and reset distribution - functions the A3P030-2QNG68I implements reliably because its flash configuration is valid the instant power is applied. The 1.5V flash core on a 130nm process draws minimal static current, suitable for housekeeping circuitry that is always energized. Its 49 I/Os monitor power-good signals and drive enable pins of DC-DC converters across a backplane. The industrial temperature rating ensures sequencing correctness across the full ambient range. Compared with a discrete sequencer IC, the FPGA allows in-field reprogramming of sequencing order via JTAG when rail requirements change.
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Portable and Battery-Powered Instruments
Battery-operated instruments benefit from the A3P030-2QNG68I's low static power 1.5V flash core and single-chip, no-boot-PROM architecture. With 330 LEs and 49 I/Os, it implements display drivers, keypad scanning, sensor timing, and simple DSP preprocessing for handheld meters and portable test tools. The compact 68-VFQFN exposed-pad package minimizes board area in space-constrained enclosures. Because configuration is non-volatile, the instrument is functional immediately on power-up, avoiding the energy and latency cost of reloading an SRAM bitstream from external flash. For extended battery life designs, the pin-compatible low-power A3P030L-2QNG68I variant reduces standby consumption in the same footprint.
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Secure Single-Chip Logic
Designs that must not expose a readable configuration bitstream favor the A3P030-2QNG68I's flash-based fabric: there is no external configuration device whose contents can be intercepted, as configuration resides in on-chip flash cells. This makes it appropriate for secure industrial control, licensed equipment, and anti-tamper-adjacent logic in a 68-VFQFN single-chip package. The 49 user I/Os and 330 LEs cover encryption glue, authentication handshake, and access-control state machines at speed-grade-2 timing. Combined with the industrial temperature rating, the device serves security-conscious installations in harsh environments. Design updates are performed via the JTAG port with Microchip programming tools.
추천
Processor Companion and Reset Control
As a processor companion, the A3P030-2QNG68I generates reset sequences, watches watchdog behavior, decodes chip-selects, and arbitrates simple shared resources around MCUs such as MSP430 or ARM-based hosts. Its instant-on flash fabric means reset management is active before the processor completes boot, closing the classic cold-start gap seen with SRAM FPGAs. The 49 I/Os interface directly with 1.5V-class core-domain signals and common 3.3V I/O banks of the ProASIC3 architecture, and the 68-VFQFN exposed pad keeps the companion physically adjacent to the CPU on dense boards. Logic changes ship as firmware updates without PCB respins, lowering total cost of ownership.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P030-2QNG68I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P030-QNG68I | A3P030-1QNG68I | A3P030L-2QNG68I |
|---|---|---|---|---|
| Package | 68-VFQFN Exposed Pad | 68-VFQFN Exposed Pad - same | 68-VFQFN Exposed Pad - same | 68-VFQFN Exposed Pad - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 30000 | 30000 | 30000 | 30000 |
| Logic Elements | 330 | 330 | 330 | 330 |
| User I/O | 49 | 49 | 49 | 49 |
| Speed Grade | 2 | Standard | 1 | 2 |
| Temperature Grade | Industrial (I) | Commercial | Industrial (I) | Industrial |
| Power Class | Standard | Standard | Standard | Low power (L) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Industrial temperature rating (vs A3P030-QNG68I)
- Higher guaranteed timing performance (vs A3P030-1QNG68I)
- Standard power vs low power (vs A3P030L-2QNG68I)
설계 노트
The A3P030-2QNG68I requires a 1.5V core supply. Derate your DC-DC or LDO budget using the ProASIC3 family datasheet power calculator (Microchip SmartPower tool) with your actual toggle rates - estimated static plus dynamic draw is modest for 330 LEs but I/O switching on all 49 pins can dominate. Ensure the 1.5V rail is valid before I/O bank supplies per family power-up requirements, and verify sequencing order in Libero SoC timing simulation.
The 68-VFQFN exposed pad is the primary ground and thermal path. Solder the exposed pad to a stitched ground array with at least a 4x4 via field to the internal ground plane; skipping the pad connection is a common pitfall that degrades signal integrity and increases ground bounce on simultaneous-switching I/Os. Decouple each supply pin with 0.1 uF ceramics placed within 2 mm of the pin, plus bulk 10 uF near the package.
With only 49 user I/Os, pin budgets overflow quickly. Complete pin assignment in Microchip Libero SoC before PCB layout lock, reserving JTAG and dedicated configuration pins. Speed grade 2 vs speed grade 1 (A3P030-1QNG68I) timing differences matter only above roughly 100 MHz-class paths - re-run timing reports if substituting grades. Do not substitute the commercial-grade A3P030-QNG68I in industrial-ambient designs.
규정 준수 정보
RoHS Compliant and Lead Free per distributor specification data (digchips.com). REACH, halogen-free, and conflict minerals status not stated in provided data.
