A3P030-2QNG68I - ProASIC3 Flash FPGA 30K Gates | Microchip
MPN: A3P030-2QNG68I β Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for A3P030-2QNG68I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3P030-QNG68I
β Drop-Inπ Reference alternative (not in catalog)
A3P030-1QNG68I
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
A3P030L-2QNG68I
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
A3P030-2QNG68I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 Flash FPGA |
| System Gates | 30000 |
| Logic Elements (LEs) | 330 |
| User I/O | 49 |
| Maximum System Frequency | 310 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash |
| Speed Grade | 2 |
| Temperature Grade | Industrial (I) |
| Configuration Memory | On-chip Flash (non-volatile) |
| Package | 68-VFQFN Exposed Pad |
| Mounting Type | Surface Mount |
| Soft ARM Support | Optional (per family datasheet) |
| RoHS Status | RoHS Compliant |
| Lead Free Status | Lead Free |
A3P030-2QNG68I [data_needed: package dimensions] Pin Configuration Guide
Complete pinout information for A3P030-2QNG68I ([data_needed: package dimensions] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: package dimensions] package pinout diagram for A3P030-2QNG68I](/assets/package-diagrams/default.svg?v=1788069619)
No detailed pinout data available for A3P030-2QNG68I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P030-2QNG68I is suitable for 6 applications: Industrial Automation Control, Glue Logic and Bus Bridging, Power Sequencing and Housekeeping, Portable and Battery-Powered Instruments, Secure Single-Chip Logic, Processor Companion and Reset Control.
Industrial Automation Control
The A3P030-2QNG68I fits industrial control nodes that need deterministic, instant-on logic without external configuration storage. With 330 logic elements and 49 user I/Os at up to 310 MHz, it handles sensor polling, handshake logic, and simple state machines between PLC modules and field devices. The industrial (I) temperature rating supports factory-floor ambient conditions, and the 1.5V flash core keeps static power low in always-on cabinets. Because configuration is non-volatile, equipment restarts are immediate after power interruption - critical in automation where boot delays from SRAM FPGA configuration chains are unacceptable. Implement the design in Microchip Libero SoC and reuse the 68-QFN footprint across product variants.
Recommended
Glue Logic and Bus Bridging
Bridging dissimilar buses - for example a microcontroller bus to legacy peripheral interfaces - is a classic use for the A3P030-2QNG68I. Its 49 user I/Os and 330 LEs implement address decoding, wait-state generation, level-aware handshake, and parallel-to-serial conversion in a single 68-VFQFN chip, replacing dozens of 74-series parts. Flash configuration means the bridge is active at power-up, so a host CPU can enumerate peripherals without waiting for a configuration controller. Speed grade 2 timing supports typical 310 MHz-class internal fabric operation, far exceeding legacy bus speeds. Exposed-pad QFN grounding keeps I/O switching noise controlled on mixed-signal boards.
Recommended
Power Sequencing and Housekeeping
Multi-rail systems need controlled power-up ordering, voltage monitoring, and reset distribution - functions the A3P030-2QNG68I implements reliably because its flash configuration is valid the instant power is applied. The 1.5V flash core on a 130nm process draws minimal static current, suitable for housekeeping circuitry that is always energized. Its 49 I/Os monitor power-good signals and drive enable pins of DC-DC converters across a backplane. The industrial temperature rating ensures sequencing correctness across the full ambient range. Compared with a discrete sequencer IC, the FPGA allows in-field reprogramming of sequencing order via JTAG when rail requirements change.
Recommended
Portable and Battery-Powered Instruments
Battery-operated instruments benefit from the A3P030-2QNG68I's low static power 1.5V flash core and single-chip, no-boot-PROM architecture. With 330 LEs and 49 I/Os, it implements display drivers, keypad scanning, sensor timing, and simple DSP preprocessing for handheld meters and portable test tools. The compact 68-VFQFN exposed-pad package minimizes board area in space-constrained enclosures. Because configuration is non-volatile, the instrument is functional immediately on power-up, avoiding the energy and latency cost of reloading an SRAM bitstream from external flash. For extended battery life designs, the pin-compatible low-power A3P030L-2QNG68I variant reduces standby consumption in the same footprint.
Recommended
Secure Single-Chip Logic
Designs that must not expose a readable configuration bitstream favor the A3P030-2QNG68I's flash-based fabric: there is no external configuration device whose contents can be intercepted, as configuration resides in on-chip flash cells. This makes it appropriate for secure industrial control, licensed equipment, and anti-tamper-adjacent logic in a 68-VFQFN single-chip package. The 49 user I/Os and 330 LEs cover encryption glue, authentication handshake, and access-control state machines at speed-grade-2 timing. Combined with the industrial temperature rating, the device serves security-conscious installations in harsh environments. Design updates are performed via the JTAG port with Microchip programming tools.
Recommended
Processor Companion and Reset Control
As a processor companion, the A3P030-2QNG68I generates reset sequences, watches watchdog behavior, decodes chip-selects, and arbitrates simple shared resources around MCUs such as MSP430 or ARM-based hosts. Its instant-on flash fabric means reset management is active before the processor completes boot, closing the classic cold-start gap seen with SRAM FPGAs. The 49 I/Os interface directly with 1.5V-class core-domain signals and common 3.3V I/O banks of the ProASIC3 architecture, and the 68-VFQFN exposed pad keeps the companion physically adjacent to the CPU on dense boards. Logic changes ship as firmware updates without PCB respins, lowering total cost of ownership.
Recommended
Recommended Products Summary
Engineering reference data for A3P030-2QNG68I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P030-QNG68I | A3P030-1QNG68I | A3P030L-2QNG68I |
|---|---|---|---|---|
| Package | 68-VFQFN Exposed Pad | 68-VFQFN Exposed Pad - same | 68-VFQFN Exposed Pad - same | 68-VFQFN Exposed Pad - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 30000 | 30000 | 30000 | 30000 |
| Logic Elements | 330 | 330 | 330 | 330 |
| User I/O | 49 | 49 | 49 | 49 |
| Speed Grade | 2 | Standard | 1 | 2 |
| Temperature Grade | Industrial (I) | Commercial | Industrial (I) | Industrial |
| Power Class | Standard | Standard | Standard | Low power (L) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Industrial temperature rating (vs A3P030-QNG68I)
- Higher guaranteed timing performance (vs A3P030-1QNG68I)
- Standard power vs low power (vs A3P030L-2QNG68I)
Design Notes
The A3P030-2QNG68I requires a 1.5V core supply. Derate your DC-DC or LDO budget using the ProASIC3 family datasheet power calculator (Microchip SmartPower tool) with your actual toggle rates - estimated static plus dynamic draw is modest for 330 LEs but I/O switching on all 49 pins can dominate. Ensure the 1.5V rail is valid before I/O bank supplies per family power-up requirements, and verify sequencing order in Libero SoC timing simulation.
The 68-VFQFN exposed pad is the primary ground and thermal path. Solder the exposed pad to a stitched ground array with at least a 4x4 via field to the internal ground plane; skipping the pad connection is a common pitfall that degrades signal integrity and increases ground bounce on simultaneous-switching I/Os. Decouple each supply pin with 0.1 uF ceramics placed within 2 mm of the pin, plus bulk 10 uF near the package.
With only 49 user I/Os, pin budgets overflow quickly. Complete pin assignment in Microchip Libero SoC before PCB layout lock, reserving JTAG and dedicated configuration pins. Speed grade 2 vs speed grade 1 (A3P030-1QNG68I) timing differences matter only above roughly 100 MHz-class paths - re-run timing reports if substituting grades. Do not substitute the commercial-grade A3P030-QNG68I in industrial-ambient designs.
Compliance Information
RoHS Compliant and Lead Free per distributor specification data (digchips.com). REACH, halogen-free, and conflict minerals status not stated in provided data.
