A3P1000-2FG484M - ProASIC3 FPGA 1M Gate | Microchip
부품 번호: A3P1000-2FG484M ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $50.99 | $50.99 |
| 10 | $47.5 | $475.00 |
| 100 | $45 | $4,500.00 |
| 500 | $42 | $21,000.00 |
| 1,000 | $40.5 | $40,500.00 |
A3P1000-2FG484M 개요
A field-programmable gate array (FPGA) is an integrated circuit whose logic fabric can be configured after manufacture to implement arbitrary digital logic functions, ranging from simple glue logic to complex signal processing. In the hierarchy of programmable logic devices, FPGA sits above CPLDs and below full custom ASICs, offering a balance of flexibility, performance, and non-recurring engineering cost. The ProASIC3 family specifically uses non-volatile flash-based configuration, allowing instant-on operation without external boot memory and providing inherent design security.
Key features of the A3P1000-2FG484M include 1,000,000 system gates, 11,000 VersaTiles (logic elements), 147,456 bits of RAM, and 300 user I/Os configurable with multiple I/O standards. The device operates from a 1.5V core supply and supports system performance up to 350 MHz in the -2 speed grade. The 484-ball FBGA package with 1.0mm ball pitch enables compact, high-density board designs while providing excellent thermal and electrical performance.
The ProASIC3 architecture uses a flash-based switch interconnect that retains configuration during power cycles, eliminating the need for configuration components and reducing system susceptibility to bitstream corruption or reverse engineering. Each VersaTile functions as either a three-input LUT equivalent or a D-flip-flop/latch with enable, providing efficient logic utilization. The inclusion of embedded memory blocks supports FIFOs, RAM, and ROM implementations without consuming logic resources.
Typical applications include aerospace flight-control computers, industrial automation controllers, medical imaging front-ends, communication infrastructure, and secure data-processing systems. The wide temperature range and high-reliability flash technology make it particularly suited for extreme-environment deployments where data retention and instant-on are critical.
When designing with this device, ensure proper power supply decoupling on all VCC and VCCPLL pins, with low-impedance 100nF ceramic capacitors placed as close to the BGA balls as possible. The flash-based configuration also requires a controlled JTAG programming environment; verify the TCK/TMS/TDI/TDO pin connections before board fabrication.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers and buyers with actionable information for design-in and procurement decisions.
드롭인 대체품: A3P1000-2FG484M — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P1000-2FG484M (동일 폼 팩터 및 풋프린트) — 차이점: Configuration Memory, Logic Elements, Maximum Operating Temperature, Mounting Type, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P1000-2FGG484M
✅ 드롭인✓ 재고 있음
$75.44 / 개
데이터시트 보기 →A3P1000-1FG484M
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
A3P1000-2FG484I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
A3P1000-1FG484I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
A3P1000-2FGG484I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
A3P1000-2FG484M 최대 정격 & 전기적 특성
| Product Series | ProASIC3 |
| System Gates | 1,000,000 |
| Logic Elements | 11,000 LE (VersaTiles) |
| RAM Bits | 147,456 bits |
| User I/Os | 300 |
| 패키지 | FBGA-484 (484-BGA) |
| Core Supply Voltage | 1.5 V |
| Maximum System Performance | 350 MHz |
| Speed Grade | -2 |
| 실장 유형 | SMD/SMT |
| Packaging | Tray |
| Maximum Operating Temperature | +125 °C |
| FPGA Configuration | Flash-based (non-volatile) |
| RoHS 상태 | unknown (FG variant, FGG is green) |
A3P1000-2FG484M fbga-484 (484-bga) 핀 구성 가이드
A3P1000-2FG484M(fbga-484 (484-bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P1000-2FG484M.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P1000-2FG484M 적합 용도: 6 애플리케이션s: Aerospace and Defense Systems, Industrial Automation and Motor Control, Medical Imaging and Diagnostics, Communication and Networking Equipment, Test and Measurement Systems, Secure Data Processing and IoT Gateways.
Aerospace and Defense Systems
The A3P1000-2FG484M's military temperature grade and flash-based configuration make it suitable for flight control computers, satellite payload data handling, and secure communication systems. Its instant-on operation is critical for systems that cannot wait for SRAM-based FPGAs to load configuration from external flash. The 300 I/Os support diverse sensor and bus interfaces, while the 147,456 bits of RAM enable local buffering. The flash fabric is resistant to configuration bitstream tampering, enhancing security for defense applications. With up to 350 MHz performance, it can handle real-time processing tasks such as sensor fusion and command decoding in harsh environments.
추천
Industrial Automation and Motor Control
In industrial automation, the A3P1000-2FG484M provides programmable logic for motor control, PLC I/O expansion, and real-time Ethernet bridges. Its 1.5V core and 300 I/Os allow direct interfacing with high-voltage isolation barriers and encoder interfaces. The flash-based design retains configuration during power loss without an external configuration device, simplifying field maintenance. With 11,000 logic elements, designers can implement multiple PID loops, PWM generation, and safety interlock logic in a single device. The wide temperature option supports deployment near motors and drives. The ProASIC3 security features help protect intellectual property in competitive industrial environments.
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Medical Imaging and Diagnostics
Medical imaging systems such as ultrasound, X-ray, and MRI scanners rely on high-speed data acquisition and preprocessing. The A3P1000-2FG484M provides 350 MHz performance and 147,456 bits of on-chip RAM for line buffering and image filtering. Its 300 I/Os connect to multiple ADC arrays, sensor interfaces, and display controllers. The flash-based, secure configuration is advantageous for regulated medical devices where firmware integrity must be guaranteed. The device's low static power and instant-on behavior help meet strict power and boot-time requirements. The -2 speed grade enables convolution and correlation algorithms to run in parallel across multiple channels, improving real-time imaging quality.
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Communication and Networking Equipment
The A3P1000-2FG484M is well suited for network line cards, switches, and protocol converters where large I/O counts and deterministic timing are needed. Its 300 I/Os support parallel bus interfaces, PCS/PHY, and control plane signaling. The 11,000 logic elements can implement FIFOs, packet filters, and CRC engines. The flash configuration updates can be performed in-system via JTAG, enabling field upgrades without a host processor. With 350 MHz operation, the device can handle wire-speed processing for TDM and Ethernet at moderate rates. For ruggedized communication shelters, the military temperature grade ensures reliable operation in extreme temperatures.
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Test and Measurement Systems
Automated test equipment (ATE), data loggers, and signal generators benefit from the A3P1000-2FG484M's reconfigurable I/O and 350 MHz clocking. It can implement high-speed counters, pattern generators, and acquisition logic adjacent to the test site. The 147,456 bits of RAM provide temporary capture storage, reducing data loss at high sampling rates. The 300 digital I/Os allow parallel control of probe stations and measurement instruments. Because the FPGA is flash-based, it is ready to operate immediately after power-up, which is essential for benchtop and portable instruments. Its secure bitstream protects proprietary calibration algorithms.
추천
Secure Data Processing and IoT Gateways
The A3P1000-2FG484M can serve as a secure data aggregation and processing engine in IoT gateways and edge servers. Its flash-based bitstream is stored internally, making it much more difficult to reverse-engineer than SRAM-based FPGAs with external configuration memory. With 1 million system gates, designers can implement cryptographic cores, protocol parsing, and sensor fusion on a single chip. The 300 I/Os connect to multiple sensors, radios, and legacy buses. The device's reliable flash configuration also supports over-the-air updates by reprogramming the internal flash through JTAG when security policies permit.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P1000-2FG484M — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P1000-2FGG484M | A3P1000-1FG484M | A3P1000-2FG484I |
|---|---|---|---|---|
| Package | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 11,000 | 11,000 | 11,000 | 11,000 |
| RAM Bits | 147,456 | 147,456 | 147,456 | 147,456 |
| User I/Os | 300 | 300 | 300 | 300 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -2 | -2 | -1 | -2 |
| Maximum Frequency | 350 MHz | 350 MHz | 310 MHz | 350 MHz |
| Temperature Grade | Military (M) | Military (M) | Military (M) | Industrial (I) |
| Green Package (RoHS) | No | Yes | No | No |
주요 차별점
- Flash-based secure configuration (vs A3P1000-2FGG484M)
- Higher speed grade -2 (vs A3P1000-1FG484M)
- Military temperature range (vs A3P1000-2FG484I)
설계 노트
Estimated: The A3P1000-2FG484M core draws approximately 5-15 mA at 1.5V for typical logic utilization, but dynamic power scales with switching activity. Place a 10uF bulk capacitor and multiple 100nF ceramic capacitors on each VCC rail, close to the BGA vias. For VCCPLL pins, use ferrite beads and low-noise 100nF capacitors to reduce PLL jitter.
The 484-ball FBGA package requires careful board layout. Use via-in-pad or microvias for signal escape, maintain a solid ground plane under the package, and route high-speed differential pairs with controlled impedance. For the 300 user I/Os, avoid long stub traces; connect series termination resistors close to the FPGA pins for standard LVCMOS/LVTTL signals.
Do not rely on the FG (non-G) variant's RoHS status without verification. For new RoHS-compliant designs, specify the FGG variant. Also ensure the JTAG programming pins (TCK, TMS, TDI, TDO) are connected with proper pull-up resistors and the programming voltage is within the specified range. Since ProASIC3 is flash-based, no external configuration device is needed, but the SPI or JTAG port must be secured for in-system updates.
The military temperature grade allows operation up to +125°C ambient, but junction temperature must remain within the absolute maximum rating. At 350 MHz and high logic utilization, power dissipation can approach several watts. Provide adequate copper area and airflow around the BGA, and consider a heat sink for designs with tight thermal budgets.
The 300 I/Os should be terminated according to the selected I/O standard. For high-speed LVDS, use external 100 ohm differential termination near the receiver and keep trace skew below 100 ps. For single-ended interfaces, adjust slew rate and drive strength through the Microchip Libero tools to minimize ringing when driving long traces.
규정 준수 정보
The FG (non-G) variant does not explicitly indicate green/RoHS compliance in the verified web data. For guaranteed RoHS/halogen-free requirements, use the FGG variant.
