A3P1000-2FG484M - ProASIC3 FPGA 1M Gate | Microchip
MPN: A3P1000-2FG484M β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $50.99 | $50.99 |
| 10 | $47.5 | $475.00 |
| 100 | $45 | $4,500.00 |
| 500 | $42 | $21,000.00 |
| 1,000 | $40.5 | $40,500.00 |
Drop-in alternatives for A3P1000-2FG484M β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3P1000-2FGG484M
β Drop-Inβ In Stock
$75.44 / Unit
View Datasheet βA3P1000-1FG484M
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
A3P1000-2FG484I
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
A3P1000-1FG484I
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
A3P1000-2FGG484I
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
A3P1000-2FG484M Maximum Ratings & Electrical Characteristics
| Product Series | ProASIC3 |
| System Gates | 1,000,000 |
| Logic Elements | 11,000 LE (VersaTiles) |
| RAM Bits | 147,456 bits |
| User I/Os | 300 |
| Package | FBGA-484 (484-BGA) |
| Core Supply Voltage | 1.5 V |
| Maximum System Performance | 350 MHz |
| Speed Grade | -2 |
| Mounting Type | SMD/SMT |
| Packaging | Tray |
| Maximum Operating Temperature | +125 Β°C |
| FPGA Configuration | Flash-based (non-volatile) |
| RoHS Status | unknown (FG variant, FGG is green) |
A3P1000-2FG484M fbga-484 (484-bga) Pin Configuration Guide
Complete pinout information for A3P1000-2FG484M (fbga-484 (484-bga) package) with 48 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P1000-2FG484M.
Refer to the datasheet for full pin configuration.
Estimated pin count: 48 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P1000-2FG484M is suitable for 6 applications: Aerospace and Defense Systems, Industrial Automation and Motor Control, Medical Imaging and Diagnostics, Communication and Networking Equipment, Test and Measurement Systems, Secure Data Processing and IoT Gateways.
Aerospace and Defense Systems
The A3P1000-2FG484M's military temperature grade and flash-based configuration make it suitable for flight control computers, satellite payload data handling, and secure communication systems. Its instant-on operation is critical for systems that cannot wait for SRAM-based FPGAs to load configuration from external flash. The 300 I/Os support diverse sensor and bus interfaces, while the 147,456 bits of RAM enable local buffering. The flash fabric is resistant to configuration bitstream tampering, enhancing security for defense applications. With up to 350 MHz performance, it can handle real-time processing tasks such as sensor fusion and command decoding in harsh environments.
Recommended
Industrial Automation and Motor Control
In industrial automation, the A3P1000-2FG484M provides programmable logic for motor control, PLC I/O expansion, and real-time Ethernet bridges. Its 1.5V core and 300 I/Os allow direct interfacing with high-voltage isolation barriers and encoder interfaces. The flash-based design retains configuration during power loss without an external configuration device, simplifying field maintenance. With 11,000 logic elements, designers can implement multiple PID loops, PWM generation, and safety interlock logic in a single device. The wide temperature option supports deployment near motors and drives. The ProASIC3 security features help protect intellectual property in competitive industrial environments.
Recommended
Medical Imaging and Diagnostics
Medical imaging systems such as ultrasound, X-ray, and MRI scanners rely on high-speed data acquisition and preprocessing. The A3P1000-2FG484M provides 350 MHz performance and 147,456 bits of on-chip RAM for line buffering and image filtering. Its 300 I/Os connect to multiple ADC arrays, sensor interfaces, and display controllers. The flash-based, secure configuration is advantageous for regulated medical devices where firmware integrity must be guaranteed. The device's low static power and instant-on behavior help meet strict power and boot-time requirements. The -2 speed grade enables convolution and correlation algorithms to run in parallel across multiple channels, improving real-time imaging quality.
Recommended
Communication and Networking Equipment
The A3P1000-2FG484M is well suited for network line cards, switches, and protocol converters where large I/O counts and deterministic timing are needed. Its 300 I/Os support parallel bus interfaces, PCS/PHY, and control plane signaling. The 11,000 logic elements can implement FIFOs, packet filters, and CRC engines. The flash configuration updates can be performed in-system via JTAG, enabling field upgrades without a host processor. With 350 MHz operation, the device can handle wire-speed processing for TDM and Ethernet at moderate rates. For ruggedized communication shelters, the military temperature grade ensures reliable operation in extreme temperatures.
Recommended
Test and Measurement Systems
Automated test equipment (ATE), data loggers, and signal generators benefit from the A3P1000-2FG484M's reconfigurable I/O and 350 MHz clocking. It can implement high-speed counters, pattern generators, and acquisition logic adjacent to the test site. The 147,456 bits of RAM provide temporary capture storage, reducing data loss at high sampling rates. The 300 digital I/Os allow parallel control of probe stations and measurement instruments. Because the FPGA is flash-based, it is ready to operate immediately after power-up, which is essential for benchtop and portable instruments. Its secure bitstream protects proprietary calibration algorithms.
Recommended
Secure Data Processing and IoT Gateways
The A3P1000-2FG484M can serve as a secure data aggregation and processing engine in IoT gateways and edge servers. Its flash-based bitstream is stored internally, making it much more difficult to reverse-engineer than SRAM-based FPGAs with external configuration memory. With 1 million system gates, designers can implement cryptographic cores, protocol parsing, and sensor fusion on a single chip. The 300 I/Os connect to multiple sensors, radios, and legacy buses. The device's reliable flash configuration also supports over-the-air updates by reprogramming the internal flash through JTAG when security policies permit.
Recommended
Recommended Products Summary
Engineering reference data for A3P1000-2FG484M β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P1000-2FGG484M | A3P1000-1FG484M | A3P1000-2FG484I |
|---|---|---|---|---|
| Package | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 11,000 | 11,000 | 11,000 | 11,000 |
| RAM Bits | 147,456 | 147,456 | 147,456 | 147,456 |
| User I/Os | 300 | 300 | 300 | 300 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -2 | -2 | -1 | -2 |
| Maximum Frequency | 350 MHz | 350 MHz | 310 MHz | 350 MHz |
| Temperature Grade | Military (M) | Military (M) | Military (M) | Industrial (I) |
| Green Package (RoHS) | No | Yes | No | No |
Key Differentiators
- Flash-based secure configuration (vs A3P1000-2FGG484M)
- Higher speed grade -2 (vs A3P1000-1FG484M)
- Military temperature range (vs A3P1000-2FG484I)
Design Notes
Estimated: The A3P1000-2FG484M core draws approximately 5-15 mA at 1.5V for typical logic utilization, but dynamic power scales with switching activity. Place a 10uF bulk capacitor and multiple 100nF ceramic capacitors on each VCC rail, close to the BGA vias. For VCCPLL pins, use ferrite beads and low-noise 100nF capacitors to reduce PLL jitter.
The 484-ball FBGA package requires careful board layout. Use via-in-pad or microvias for signal escape, maintain a solid ground plane under the package, and route high-speed differential pairs with controlled impedance. For the 300 user I/Os, avoid long stub traces; connect series termination resistors close to the FPGA pins for standard LVCMOS/LVTTL signals.
Do not rely on the FG (non-G) variant's RoHS status without verification. For new RoHS-compliant designs, specify the FGG variant. Also ensure the JTAG programming pins (TCK, TMS, TDI, TDO) are connected with proper pull-up resistors and the programming voltage is within the specified range. Since ProASIC3 is flash-based, no external configuration device is needed, but the SPI or JTAG port must be secured for in-system updates.
The military temperature grade allows operation up to +125Β°C ambient, but junction temperature must remain within the absolute maximum rating. At 350 MHz and high logic utilization, power dissipation can approach several watts. Provide adequate copper area and airflow around the BGA, and consider a heat sink for designs with tight thermal budgets.
The 300 I/Os should be terminated according to the selected I/O standard. For high-speed LVDS, use external 100 ohm differential termination near the receiver and keep trace skew below 100 ps. For single-ended interfaces, adjust slew rate and drive strength through the Microchip Libero tools to minimize ringing when driving long traces.
Compliance Information
The FG (non-G) variant does not explicitly indicate green/RoHS compliance in the verified web data. For guaranteed RoHS/halogen-free requirements, use the FGG variant.
